/Modules/Audio/SYMTRANS01A/SCH_PCB/SYMTRANS01A.kicad_pcb
3,7 → 3,7
(general
(links 62)
(no_connects 0)
(area -8.659285 -46.736 50.315286 7.620001)
(area 0.178999 -40.461001 40.461001 -0.178999)
(thickness 1.6)
(drawings 29)
(tracks 146)
178,7 → 178,7
(add_net "Net-(J6-Pad2)")
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CB8)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CB8)
(at 10.5156 -27.1272 180)
(path /57D7EDD1)
(attr smd)
206,7 → 206,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CDF)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CDF)
(at 14.3764 -25.908 90)
(path /57D7EDC5)
(attr smd)
234,7 → 234,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7D06)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7D06)
(at 17.9705 -27.1272 180)
(path /57D7EDDD)
(attr smd)
262,7 → 262,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C26)
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C26)
(at 5.08 -25.908)
(descr "pin header straight 2x04")
(tags "pin header straight 2x04")
303,7 → 303,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C4A)
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C4A)
(at 36.576 -14.732)
(descr "pin header straight 2x04")
(tags "pin header straight 2x04")
344,7 → 344,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C56)
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C56)
(at 36.576 -25.908)
(descr "pin header straight 2x04")
(tags "pin header straight 2x04")
385,7 → 385,7
)
)
 
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C60)
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C60)
(at 35.56 -35.56)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
401,13 → 401,13
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Mlab_TR:H110X_H1121_HX1188 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7D38)
(module Mlab_TR:H110X_H1121_HX1188 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7D38)
(at 26.924 -20.32 90)
(path /57DA8991)
(fp_text reference TR1 (at 0 -0.5 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value TRANSF5-RESCUE-SYMTRANS01A (at 0 0.5 90) (layer B.Fab)
(fp_text value H1102NL (at 0 0.5 90) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start 6.35 3.55) (end -6.35 3.55) (layer B.SilkS) (width 0.15))
444,7 → 444,7
(net 29 /A3+))
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C77)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C77)
(at 22.86 -6.096)
(path /57D7E244)
(attr smd)
472,7 → 472,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C2C)
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C2C)
(at 23.876 -10.668 270)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
498,7 → 498,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C91)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C91)
(at 27.432 -6.096 180)
(path /57D7E01A)
(attr smd)
526,7 → 526,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C01)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C01)
(at 26.416 -3.048 270)
(path /57D7D977)
(attr smd)
554,7 → 554,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C0E)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C0E)
(at 26.416 -37.592 90)
(path /57D7EA08)
(attr smd)
582,7 → 582,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7D13)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7D13)
(at 17.9197 -13.462 180)
(path /57D7E0F0)
(attr smd)
610,7 → 610,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C9E)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C9E)
(at 27.432 -34.544 180)
(path /57D7EA1A)
(attr smd)
638,7 → 638,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CD2)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CD2)
(at 10.4648 -15.9512 180)
(path /57D7E0A1)
(attr smd)
666,7 → 666,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CEC)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CEC)
(at 14.3256 -14.732 90)
(path /57D7DD01)
(attr smd)
694,7 → 694,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CC5)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CC5)
(at 10.4648 -13.5128 180)
(path /57D7E033)
(attr smd)
722,7 → 722,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7D20)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7D20)
(at 17.9197 -16.002 180)
(path /57D7E0F6)
(attr smd)
750,7 → 750,7
)
)
 
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C5B)
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C5B)
(at 5.08 -35.56)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
766,7 → 766,7
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C6A)
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C6A)
(at 5.08 -5.08)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
782,7 → 782,7
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7BF4)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7BF4)
(at 23.876 -37.592 90)
(path /57D7EA26)
(attr smd)
810,7 → 810,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7C84)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7C84)
(at 22.86 -34.544)
(path /57D7EA38)
(attr smd)
838,7 → 838,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C38)
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C38)
(at 26.416 -10.668 270)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
864,7 → 864,7
)
)
 
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C65)
(module Mlab_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C65)
(at 35.56 -5.08)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
880,7 → 880,7
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7BE7)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7BE7)
(at 23.876 -3.048 270)
(path /57D7E232)
(attr smd)
908,7 → 908,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C1A)
(module Mlab_Pin_Headers:Straight_2x04 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C1A)
(at 5.08 -14.732)
(descr "pin header straight 2x04")
(tags "pin header straight 2x04")
949,7 → 949,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CAB)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CAB)
(at 10.5156 -24.6888 180)
(path /57D7EDCB)
(attr smd)
977,7 → 977,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C3E)
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C3E)
(at 26.416 -30.48 90)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
1003,7 → 1003,7
)
)
 
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57E39E0F) (tstamp 57DB7C32)
(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 57ECBB9F) (tstamp 57DB7C32)
(at 23.876 -30.48 90)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
1029,7 → 1029,7
)
)
 
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57E39E0F) (tstamp 57DB7CF9)
(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 57ECBB9F) (tstamp 57DB7CF9)
(at 17.9705 -24.6888 180)
(path /57D7EDD7)
(attr smd)