/Modules/CommSerial/I2CIO01A/PCB_SCH/I2CIO01A.kicad_pcb
1,12 → 1,12
(kicad_pcb (version 4) (host pcbnew "(2014-10-14 BZR 5188)-product")
(kicad_pcb (version 4) (host pcbnew "(2014-08-29 BZR 5106)-product")
 
(general
(links 106)
(no_connects 106)
(area 1.211218 1.635759 161.754458 128.9812)
(no_connects 84)
(area 0 0 0 0)
(thickness 1.6)
(drawings 0)
(tracks 1)
(tracks 103)
(zones 0)
(modules 35)
(nets 25)
38,6 → 38,8
 
(setup
(last_trace_width 0.381)
(user_trace_width 0.381)
(user_trace_width 0.508)
(trace_clearance 0.2)
(zone_clearance 0.508)
(zone_45_only no)
62,7 → 64,7
(pad_drill 3)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(visible_elements 7FFFFFFF)
(visible_elements 7FFFFF7F)
(pcbplotparams
(layerselection 0x00030_80000001)
(usegerberextensions false)
144,17 → 146,17
(add_net /P17)
(add_net /SCL)
(add_net /SDA)
(add_net /Vccp)
(add_net GND)
)
 
(net_class vdd ""
(clearance 0.254)
(clearance 0.2)
(trace_width 0.508)
(via_dia 0.889)
(via_drill 0.635)
(uvia_dia 0.508)
(uvia_drill 0.127)
(add_net /Vccp)
(add_net VDD)
)
 
246,14 → 248,14
)
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D33F)
(at 13.97 -11.43 90)
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 54734EFE)
(at 13.589 -14.224 180)
(path /5469D318)
(attr smd)
(fp_text reference 100n1 (at 0 0.3175 90) (layer B.SilkS)
(fp_text reference 100n1 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value C (at 0 -0.381 90) (layer B.SilkS)
(fp_text value C (at 0 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
263,9 → 265,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 1 VDD))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
471,8 → 473,8
)
)
 
(module Hrebinky:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 5469CB53) (tstamp 5469D375)
(at 12.7 -3.81 270)
(module Hrebinky:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 5469CB53) (tstamp 54734CE8)
(at 13.081 -7.366 270)
(descr "1 pin")
(tags "CONN DEV")
(path /5468852B)
830,13 → 832,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3C1)
(at 29.21 6.35 270)
(at 11.43 6.477 90)
(path /5468C6CB)
(attr smd)
(fp_text reference R6 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R6 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
846,10 → 848,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 18 /P10))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 19 /P17))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
886,13 → 888,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3CD)
(at 26.67 6.35 270)
(at 21.59 6.477 90)
(path /5468C73A)
(attr smd)
(fp_text reference R8 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R8 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
902,10 → 904,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 17 /P11))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 24 /P13))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
942,13 → 944,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3D9)
(at 24.13 6.35 270)
(at 16.51 6.477 90)
(path /5468C75B)
(attr smd)
(fp_text reference R10 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R10 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
958,10 → 960,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 21 /P12))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 22 /P15))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
998,13 → 1000,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3E5)
(at 21.59 6.35 270)
(at 19.05 6.477 90)
(path /5468C780)
(attr smd)
(fp_text reference R12 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R12 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1014,10 → 1016,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 24 /P13))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 23 /P14))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1054,13 → 1056,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3F1)
(at 19.05 6.35 270)
(at 13.97 6.477 90)
(path /5468C7A3)
(attr smd)
(fp_text reference R14 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R14 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1070,10 → 1072,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 23 /P14))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 20 /P16))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1082,7 → 1084,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D65B)
(at 16.51 -26.67 270)
(at 13.97 -26.67 270)
(path /5468B49B)
(attr smd)
(fp_text reference R15 (at 0 0.3175 270) (layer B.SilkS)
1101,7 → 1103,7
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 /P02))
(net 9 /P01))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1110,7 → 1112,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3FD)
(at 16.51 6.35 270)
(at 16.51 -26.67 270)
(path /5468C7D0)
(attr smd)
(fp_text reference R16 (at 0 0.3175 270) (layer B.SilkS)
1127,9 → 1129,9
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 22 /P15))
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(net 13 /P02))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1138,13 → 1140,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D67B)
(at 13.97 -26.67 270)
(at 24.13 6.477 90)
(path /5468B4B8)
(attr smd)
(fp_text reference R17 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R17 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1154,10 → 1156,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 9 /P01))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 21 /P12))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1166,7 → 1168,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D409)
(at 13.97 6.35 270)
(at 11.43 -26.67 270)
(path /5468C7F9)
(attr smd)
(fp_text reference R18 (at 0 0.3175 270) (layer B.SilkS)
1183,9 → 1185,9
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 20 /P16))
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(net 10 /P00))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1194,13 → 1196,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D62E)
(at 11.43 -26.67 270)
(at 26.67 6.477 90)
(path /5468B4D7)
(attr smd)
(fp_text reference R19 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R19 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1210,10 → 1212,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 10 /P00))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 17 /P11))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1222,13 → 1224,13
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D57A) (tstamp 5469D415)
(at 11.43 6.35 270)
(at 29.21 6.477 90)
(path /5468C81E)
(attr smd)
(fp_text reference R20 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R20 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1238,10 → 1240,10
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -1.016 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 19 /P17))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.016 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /Vccp))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 18 /P10))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
1250,7 → 1252,7
)
 
(module IO:TSSOP-28 (layer B.Cu) (tedit 5469DD7B) (tstamp 5469E3B7)
(at 20.32 -7.62)
(at 21.082 -9.398)
(descr TSSOP-28)
(path /546882E8)
(attr smd)
1320,6 → 1322,108
)
)
 
(segment (start 34.29 -7.62) (end 32.9565 -7.62) (width 0.508) (layer B.Cu) (net 1))
(segment (start 32.9565 -7.62) (end 30.48 -10.0965) (width 0.508) (layer B.Cu) (net 1))
(segment (start 30.48 -10.0965) (end 30.48 -11.0617) (width 0.508) (layer B.Cu) (net 1))
(segment (start 30.48 -11.0617) (end 30.48 -12.21994) (width 0.508) (layer B.Cu) (net 1))
(segment (start 36.83 -7.62) (end 34.29 -7.62) (width 0.508) (layer B.Cu) (net 1))
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(segment (start 28.41244 -12.21994) (end 26.67 -10.4775) (width 0.508) (layer B.Cu) (net 1))
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