/Modules/CommSerial/I2CIO01A/PCB_SCH/I2CIO01A.kicad_pcb-bak
2,7 → 2,7
 
(general
(links 106)
(no_connects 98)
(no_connects 90)
(area -3.868782 -3.444241 208.33322 128.9812)
(thickness 1.6)
(drawings 0)
58,8 → 58,8
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 0.4191 1.47066)
(pad_drill 0)
(pad_size 6 6)
(pad_drill 3)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(visible_elements 7FFFFFFF)
158,8 → 158,8
(add_net VDD)
)
 
(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 5469E3E9)
(at 0 0)
(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 5469E339)
(at 5.08 5.08)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(fp_text reference P1 (at 0.1778 -0.0762) (layer F.SilkS)
188,7 → 188,7
(clearance 1) (zone_connect 2))
)
 
(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 5469E3DD)
(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 5469E303)
(at 19.685 17.399)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
219,7 → 219,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D339)
(at 146.812 125.984)
(at 150.241 126.873)
(path /5469D39D)
(attr smd)
(fp_text reference 10u1 (at 0 0.3175) (layer B.SilkS)
310,7 → 310,7
)
 
(module Hrebinky:Pin_Header_Straight_2x02 placed (layer F.Cu) (tedit 5469D2A0) (tstamp 5469D34D)
(at 165.354 116.459)
(at 119.126 93.726)
(descr "1 pin")
(tags "CONN DEV")
(path /5468999D)
436,7 → 436,7
)
 
(module Hrebinky:Pin_Header_Straight_2x03 placed (layer F.Cu) (tedit 5469D2A0) (tstamp 5469D36F)
(at 202.565 112.903)
(at 146.685 107.95)
(descr "1 pin")
(tags "CONN DEV")
(path /54689904)
472,14 → 472,14
)
 
(module Hrebinky:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 5469CB53) (tstamp 5469D375)
(at 200.66 48.006)
(at 127.381 106.934 270)
(descr "1 pin")
(tags "CONN DEV")
(path /5468852B)
(fp_text reference J5 (at 0 -2.286) (layer F.SilkS)
(fp_text reference J5 (at 0 -2.286 270) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.2032)))
)
(fp_text value CONN1_2 (at 0 0) (layer F.SilkS) hide
(fp_text value CONN1_2 (at 0 0 270) (layer F.SilkS) hide
(effects (font (size 1.27 1.27) (thickness 0.2032)))
)
(fp_line (start -3.81 -1.27) (end -1.27 -1.27) (layer F.SilkS) (width 0.254))
488,9 → 488,9
(fp_line (start -1.27 -1.27) (end 1.27 -1.27) (layer F.SilkS) (width 0.254))
(fp_line (start -3.81 -1.27) (end -3.81 1.27) (layer F.SilkS) (width 0.254))
(fp_line (start -3.81 1.27) (end -1.27 1.27) (layer F.SilkS) (width 0.254))
(pad 1 thru_hole rect (at -2.54 0) (size 1.651 1.651) (drill 0.9) (layers *.Cu *.Mask F.SilkS)
(pad 1 thru_hole rect (at -2.54 0 270) (size 1.651 1.651) (drill 0.9) (layers *.Cu *.Mask F.SilkS)
(net 1 VDD))
(pad 2 thru_hole rect (at 0 0) (size 1.651 1.651) (drill 0.9) (layers *.Cu *.Mask F.SilkS)
(pad 2 thru_hole rect (at 0 0 270) (size 1.651 1.651) (drill 0.9) (layers *.Cu *.Mask F.SilkS)
(net 8 /Vccp))
(model Pin_Headers/Pin_Header_Straight_1x03.wrl
(at (xyz 0 0 0))
718,7 → 718,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3A9)
(at 169.672 117.221 90)
(at 123.444 94.488 90)
(path /54689A1B)
(attr smd)
(fp_text reference R2 (at 0 0.3175 90) (layer B.SilkS)
774,7 → 774,7
)
 
(module SMD_Packages:SMD-0805 (layer B.Cu) (tedit 5469D2AF) (tstamp 5469D3B5)
(at 201.549 116.84)
(at 145.669 111.887)
(path /54689A9E)
(attr smd)
(fp_text reference R4 (at 0 0.3175) (layer B.SilkS)