/Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb
1,15 → 1,15
(kicad_pcb (version 4) (host pcbnew "(2015-05-13 BZR 5653)-product")
 
(general
(links 329)
(no_connects 329)
(links 347)
(no_connects 347)
(area 84.277999 50.241999 212.013001 140.766001)
(thickness 1.6)
(drawings 7)
(tracks 0)
(zones 0)
(modules 159)
(nets 61)
(modules 165)
(nets 66)
)
 
(page A4)
62,7 → 62,7
(pad_drill 0.6)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(visible_elements FFFFFF7F)
(visible_elements 7FFFFFFF)
(pcbplotparams
(layerselection 0x00030_80000001)
(usegerberextensions false)
151,6 → 151,11
(net 58 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS")
(net 59 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS")
(net 60 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS")
(net 61 "Net-(C63-Pad2)")
(net 62 /USBPORT/USB_SSRXM_DN1+)
(net 63 /USBPORT/USB_SSRXM_DN2+)
(net 64 /USBPORT/USB_SSRXM_DN4+)
(net 65 /USBPORT/USB_SSRXM_DN3+)
 
(net_class Default "Toto je výchozí třída sítě."
(clearance 0.2)
187,6 → 192,10
(add_net /SDA)
(add_net /SMBUSZ_SS_SUS)
(add_net /TEST_TRSTZ)
(add_net /USBPORT/USB_SSRXM_DN1+)
(add_net /USBPORT/USB_SSRXM_DN2+)
(add_net /USBPORT/USB_SSRXM_DN3+)
(add_net /USBPORT/USB_SSRXM_DN4+)
(add_net /USBPORT/USB_VBUS_UP)
(add_net GND)
(add_net "Net-(C10-Pad2)")
198,6 → 207,7
(add_net "Net-(C57-Pad1)")
(add_net "Net-(C58-Pad1)")
(add_net "Net-(C62-Pad1)")
(add_net "Net-(C63-Pad2)")
(add_net "Net-(C67-Pad1)")
(add_net "Net-(C68-Pad1)")
(add_net "Net-(C72-Pad1)")
1995,7 → 2005,8
(fp_line (start 1.524 -0.762) (end 1.524 0.762) (layer F.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 0.508 0.762) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers F.Cu F.Paste F.Mask)
(net 61 "Net-(C63-Pad2)"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
(scale (xyz 0.1 0.1 0.1))
4412,7 → 4423,346
(net 9 "Net-(C35-Pad1)"))
)
 
(module Housings_SSOP:TSSOP-8_4.4x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 55659C85)
(module Mlab_IO:HTQFP-64_10x10mm_Pitch0.5mm (layer F.Cu) (tedit 55659523) (tstamp 5565AC93)
(at 144.018 106.807)
(descr "64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFP 0.5")
(path /555E9589)
(attr smd)
(fp_text reference U2 (at 0 -7.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TUSB8041IPAPRQ1 (at 0 7.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -6.7 -6.7) (end -6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 6.7 -6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 -6.7) (end 6.7 -6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.175 -5.175) (end -5.175 -4.125) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 -5.175) (end 5.175 -4.125) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 5.175) (end 5.175 4.125) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 5.175) (end -5.175 4.125) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 -5.175) (end -4.125 -5.175) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 5.175) (end -4.125 5.175) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 5.175) (end 4.125 5.175) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 -5.175) (end 4.125 -5.175) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 -4.125) (end -6.45 -4.125) (layer F.SilkS) (width 0.15))
(pad 65 smd rect (at 0 0 90) (size 5 5) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 1 smd rect (at -5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 6 smd rect (at -5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 9 smd rect (at -5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 14 smd rect (at -5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 17 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 22 smd rect (at -1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at 0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at 1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at 1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 29 smd rect (at 2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 32 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 51 /PWRON4_BATEN4))
(pad 33 smd rect (at 5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 52 /PWRON3_BATEN3))
(pad 34 smd rect (at 5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 35 smd rect (at 5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 53 /PWRON2_BATEN2))
(pad 36 smd rect (at 5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 54 /PWRON1_BATEN1))
(pad 37 smd rect (at 5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 44 /SDA))
(pad 38 smd rect (at 5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 43 /SCL))
(pad 39 smd rect (at 5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 40 /SMBUSZ_SS_SUS))
(pad 40 smd rect (at 5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 39 /FULLPWRMGMTZ_SMBA1))
(pad 41 smd rect (at 5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 34 /PWRCTL_POL_TDO))
(pad 42 smd rect (at 5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 38 /GANGED_SMBA2_SH_UP))
(pad 43 smd rect (at 5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 37 /OVRCUR3Z_TCK))
(pad 45 smd rect (at 5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 41 /AUTOENZ_HS_SUS))
(pad 46 smd rect (at 5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 35 /OVRCUR1Z_TDI))
(pad 47 smd rect (at 5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 36 /OVRCUR2Z_TMS))
(pad 48 smd rect (at 5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 49 "Net-(R17-Pad1)"))
(pad 49 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 33 /TEST_TRSTZ))
(pad 50 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 8 "Net-(C34-Pad1)"))
(pad 51 smd rect (at 2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 52 smd rect (at 2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 53 smd rect (at 1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 55 smd rect (at 0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 56 smd rect (at 0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 57 smd rect (at -0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 58 smd rect (at -0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 59 smd rect (at -1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 60 smd rect (at -1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 61 smd rect (at -2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 6 "Net-(C31-Pad1)"))
(pad 62 smd rect (at -2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 63 smd rect (at -3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 64 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 48 "Net-(R16-Pad1)"))
(model Housings_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
 
(module Mlab_T:TO-263-5 placed (layer F.Cu) (tedit 55659639) (tstamp 5565ACD7)
(at 156.972 104.775)
(path /55551F88/55556F70)
(attr smd)
(fp_text reference U3 (at 0 -5.969) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TPS7A4533KTTR (at 0 -3.937) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.30022 -2.413) (end 5.715 -2.413) (layer F.SilkS) (width 0.15))
(fp_line (start -4.30022 -2.4003) (end -4.30022 1.143) (layer F.SilkS) (width 0.15))
(fp_line (start -5.715 -2.413) (end -5.715 -15.795) (layer F.SilkS) (width 0.15))
(fp_line (start 5.715 -15.795) (end 5.715 -2.413) (layer F.SilkS) (width 0.15))
(fp_line (start -5.715 -2.413) (end -4.30022 -2.413) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at -1.69926 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at 0 -10.795) (size 10.80008 9.99998) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 4 smd rect (at 1.69926 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 3 smd rect (at 0 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 1 smd rect (at -3.40106 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 5 smd rect (at 3.40106 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 11 "Net-(C38-Pad1)"))
)
 
(module Connect:USB_A (layer F.Cu) (tedit 5543E289) (tstamp 5566BC01)
(at 108.204 153.797)
(descr "USB A connector")
(tags "USB USB_A")
(path /5555B01B/555C77EF)
(fp_text reference J13 (at 0 -2.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB3_A (at 3.83794 7.43458) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.3 13.2) (end -5.3 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.95 -1.4) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 13.2) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 -1.4) (end 11.95 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.04986 -1.14512) (end 11.04986 12.95188) (layer F.SilkS) (width 0.15))
(fp_line (start -3.93614 12.95188) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 -1.14512) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 12.95188) (end -3.93614 12.95188) (layer F.SilkS) (width 0.15))
(pad 4 thru_hole circle (at 7.11286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 2 GND))
(pad 3 thru_hole circle (at 4.57286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 2 thru_hole circle (at 2.54086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole circle (at 0.00086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 17 "Net-(C57-Pad1)"))
(pad 5 thru_hole circle (at 10.16086 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 62 /USBPORT/USB_SSRXM_DN1+))
(pad 5 thru_hole circle (at -3.55514 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 62 /USBPORT/USB_SSRXM_DN1+))
(model Connect.3dshapes/USB_A.wrl
(at (xyz 0.14 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
)
 
(module Connect:USB_B (layer F.Cu) (tedit 55363CC8) (tstamp 5566BC0B)
(at 130.683 171.196)
(tags USB)
(path /5555B01B/555C768C)
(fp_text reference J14 (at 1.27 11.05) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB3_B (at 1.27 4.7) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -6.35 15.25) (end -6.35 -2.3) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.35 -2.3) (end 8.9 -2.3) (layer F.CrtYd) (width 0.05))
(fp_line (start 8.9 -2.3) (end 8.9 15.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 8.9 15.25) (end -6.35 15.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -4.826 6.351) (end -4.826 14.987) (layer F.SilkS) (width 0.15))
(fp_line (start -4.826 -2.031) (end -4.826 3.049) (layer F.SilkS) (width 0.15))
(fp_line (start 7.366 6.351) (end 7.366 14.987) (layer F.SilkS) (width 0.15))
(fp_line (start 7.366 -2.031) (end 7.366 3.049) (layer F.SilkS) (width 0.15))
(fp_line (start 7.366 14.987) (end -4.826 14.987) (layer F.SilkS) (width 0.15))
(fp_line (start -4.826 -2.031) (end 7.366 -2.031) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole circle (at 0 0.001 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
(net 20 /USBPORT/USB_VBUS_UP))
(pad 2 thru_hole circle (at 2.54 0.001 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS))
(pad 3 thru_hole circle (at 2.54 1.99998 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS))
(pad 4 thru_hole circle (at 0 1.99998 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
(net 2 GND))
(pad 5 thru_hole circle (at -4.72948 4.7 180) (size 2.70002 2.70002) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 61 "Net-(C63-Pad2)"))
(pad 5 thru_hole circle (at 7.26948 4.7 180) (size 2.70002 2.70002) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 61 "Net-(C63-Pad2)"))
(model Connect.3dshapes/USB_B.wrl
(at (xyz 0.05 -0.185 0.001))
(scale (xyz 0.3937 0.3937 0.3937))
(rotate (xyz 0 0 0))
)
)
 
(module Connect:USB_A (layer F.Cu) (tedit 5543E289) (tstamp 5566BC15)
(at 191.77 151.511)
(descr "USB A connector")
(tags "USB USB_A")
(path /5555B01B/555C8ADD)
(fp_text reference J15 (at 0 -2.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB3_A (at 3.83794 7.43458) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.3 13.2) (end -5.3 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.95 -1.4) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 13.2) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 -1.4) (end 11.95 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.04986 -1.14512) (end 11.04986 12.95188) (layer F.SilkS) (width 0.15))
(fp_line (start -3.93614 12.95188) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 -1.14512) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 12.95188) (end -3.93614 12.95188) (layer F.SilkS) (width 0.15))
(pad 4 thru_hole circle (at 7.11286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 2 GND))
(pad 3 thru_hole circle (at 4.57286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 2 thru_hole circle (at 2.54086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole circle (at 0.00086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 21 "Net-(C67-Pad1)"))
(pad 5 thru_hole circle (at 10.16086 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 63 /USBPORT/USB_SSRXM_DN2+))
(pad 5 thru_hole circle (at -3.55514 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 63 /USBPORT/USB_SSRXM_DN2+))
(model Connect.3dshapes/USB_A.wrl
(at (xyz 0.14 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
)
 
(module Connect:USB_A (layer F.Cu) (tedit 5543E289) (tstamp 5566BC1F)
(at 153.797 184.404)
(descr "USB A connector")
(tags "USB USB_A")
(path /5555B01B/555C845B)
(fp_text reference J16 (at 0 -2.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB3_A (at 3.83794 7.43458) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.3 13.2) (end -5.3 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.95 -1.4) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 13.2) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 -1.4) (end 11.95 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.04986 -1.14512) (end 11.04986 12.95188) (layer F.SilkS) (width 0.15))
(fp_line (start -3.93614 12.95188) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 -1.14512) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 12.95188) (end -3.93614 12.95188) (layer F.SilkS) (width 0.15))
(pad 4 thru_hole circle (at 7.11286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 2 GND))
(pad 3 thru_hole circle (at 4.57286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 2 thru_hole circle (at 2.54086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole circle (at 0.00086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 23 "Net-(C72-Pad1)"))
(pad 5 thru_hole circle (at 10.16086 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 64 /USBPORT/USB_SSRXM_DN4+))
(pad 5 thru_hole circle (at -3.55514 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 64 /USBPORT/USB_SSRXM_DN4+))
(model Connect.3dshapes/USB_A.wrl
(at (xyz 0.14 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
)
 
(module Connect:USB_A (layer F.Cu) (tedit 5543E289) (tstamp 5566BC29)
(at 167.259 150.495)
(descr "USB A connector")
(tags "USB USB_A")
(path /5555B01B/555C8320)
(fp_text reference J17 (at 0 -2.35) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value USB3_A (at 3.83794 7.43458) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.3 13.2) (end -5.3 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.95 -1.4) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 13.2) (end 11.95 13.2) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.3 -1.4) (end 11.95 -1.4) (layer F.CrtYd) (width 0.05))
(fp_line (start 11.04986 -1.14512) (end 11.04986 12.95188) (layer F.SilkS) (width 0.15))
(fp_line (start -3.93614 12.95188) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 -1.14512) (end -3.93614 -1.14512) (layer F.SilkS) (width 0.15))
(fp_line (start 11.04986 12.95188) (end -3.93614 12.95188) (layer F.SilkS) (width 0.15))
(pad 4 thru_hole circle (at 7.11286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 2 GND))
(pad 3 thru_hole circle (at 4.57286 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 2 thru_hole circle (at 2.54086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS))
(pad 1 thru_hole circle (at 0.00086 -0.00212 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
(net 25 "Net-(C74-Pad1)"))
(pad 5 thru_hole circle (at 10.16086 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 65 /USBPORT/USB_SSRXM_DN3+))
(pad 5 thru_hole circle (at -3.55514 2.66488 270) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
(net 65 /USBPORT/USB_SSRXM_DN3+))
(model Connect.3dshapes/USB_A.wrl
(at (xyz 0.14 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 90))
)
)
 
(module Mlab_IO:TSSOP-8_4.4x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 5566BC2A)
(at 146.939 117.221)
(descr "8-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
4457,7 → 4807,83
)
)
 
(module Housings_SSOP:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 55659CED)
(module Mlab_IO:QFN-20-1EP_5x5mm_Pitch0.65mm (layer F.Cu) (tedit 55659A59) (tstamp 5566BC35)
(at 144.526 94.107)
(descr "20-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFN 0.65")
(path /55551F88/55556F79)
(attr smd)
(fp_text reference U4 (at 0 -3.525) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TPS74801RGWR (at 0 3.525) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -2.8 -2.8) (end -2.8 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 -2.8) (end 2.8 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -2.8) (end 2.8 -2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 2.8) (end 2.8 2.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.65 -2.65) (end 2.65 -1.725) (layer F.SilkS) (width 0.15))
(fp_line (start -2.65 2.65) (end -2.65 1.725) (layer F.SilkS) (width 0.15))
(fp_line (start 2.65 2.65) (end 2.65 1.725) (layer F.SilkS) (width 0.15))
(fp_line (start -2.65 -2.65) (end -1.725 -2.65) (layer F.SilkS) (width 0.15))
(fp_line (start -2.65 2.65) (end -1.725 2.65) (layer F.SilkS) (width 0.15))
(fp_line (start 2.65 2.65) (end 1.725 2.65) (layer F.SilkS) (width 0.15))
(fp_line (start 2.65 -2.65) (end 1.725 -2.65) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.4 -1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 12 +1V1))
(pad 2 smd rect (at -2.4 -0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 3 smd rect (at -2.4 0) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 4 smd rect (at -2.4 0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 5 smd rect (at -2.4 1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 6 smd rect (at -1.3 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 7 smd rect (at -0.65 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 8 smd rect (at 0 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 9 smd rect (at 0.65 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 1.3 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 11 smd rect (at 2.4 1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 12 smd rect (at 2.4 0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 13 smd rect (at 2.4 0) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 14 smd rect (at 2.4 -0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 15 smd rect (at 2.4 -1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 55 "Net-(R24-Pad1)"))
(pad 16 smd rect (at 1.3 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 56 "Net-(R25-Pad2)"))
(pad 17 smd rect (at 0.65 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 0 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 12 +1V1))
(pad 19 smd rect (at -0.65 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 12 +1V1))
(pad 20 smd rect (at -1.3 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask)
(net 12 +1V1))
(pad 21 smd rect (at 0.8375 0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 21 smd rect (at 0.8375 -0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 21 smd rect (at -0.8375 0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(pad 21 smd rect (at -0.8375 -0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin_ratio -0.2))
(model Housings_DFN_QFN.3dshapes/QFN-20-1EP_5x5mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
 
(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 55659CC8) (tstamp 5566BC50)
(at 177.546 97.028)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
4480,20 → 4906,20
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
(pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 57 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 57 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 57 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
4510,7 → 4936,7
)
)
 
(module Housings_SSOP:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 55659CFD)
(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 55659CC8) (tstamp 5566BC5F)
(at 124.46 106.299)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
4533,20 → 4959,20
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
(pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 58 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 58 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 58 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
4563,7 → 4989,7
)
)
 
(module Housings_SSOP:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 55659D0D)
(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 55659CC8) (tstamp 5566BC6E)
(at 124.46 100.711)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
4586,20 → 5012,20
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
(pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 59 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 59 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 59 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
4616,7 → 5042,7
)
)
 
(module Housings_SSOP:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 54130A77) (tstamp 55659D1D)
(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 55659CC8) (tstamp 5566BC7D)
(at 124.46 95.25)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
4639,20 → 5065,20
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
(fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 1 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 2 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 3 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 4 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
(pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 6 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 60 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 7 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 60 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
(pad 8 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask)
(net 60 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
4669,240 → 5095,74
)
)
 
(module Mlab_IO:HTQFP-64_10x10mm_Pitch0.5mm (layer F.Cu) (tedit 55659523) (tstamp 5565AC93)
(at 144.018 106.807)
(descr "64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFP 0.5")
(path /555E9589)
(attr smd)
(fp_text reference U2 (at 0 -7.45) (layer F.SilkS)
(module Crystals:Crystal_HC49-U_Vertical (layer F.Cu) (tedit 0) (tstamp 5566BC91)
(at 143.637 152.527)
(descr "Crystal, Quarz, HC49/U, vertical, stehend,")
(tags "Crystal, Quarz, HC49/U, vertical, stehend,")
(path /555F014A)
(fp_text reference Y1 (at 0 -3.81) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TUSB8041IPAPRQ1 (at 0 7.45) (layer F.Fab)
(fp_text value 24MHz (at 0 3.81) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -6.7 -6.7) (end -6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 6.7 -6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 -6.7) (end 6.7 -6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -6.7 6.7) (end 6.7 6.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -5.175 -5.175) (end -5.175 -4.125) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 -5.175) (end 5.175 -4.125) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 5.175) (end 5.175 4.125) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 5.175) (end -5.175 4.125) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 -5.175) (end -4.125 -5.175) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 5.175) (end -4.125 5.175) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 5.175) (end 4.125 5.175) (layer F.SilkS) (width 0.15))
(fp_line (start 5.175 -5.175) (end 4.125 -5.175) (layer F.SilkS) (width 0.15))
(fp_line (start -5.175 -4.125) (end -6.45 -4.125) (layer F.SilkS) (width 0.15))
(pad 65 smd rect (at 0 0 90) (size 5 5) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 1 smd rect (at -5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 6 smd rect (at -5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 9 smd rect (at -5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 14 smd rect (at -5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 17 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 22 smd rect (at -1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at 0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at 1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at 1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 29 smd rect (at 2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 32 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 51 /PWRON4_BATEN4))
(pad 33 smd rect (at 5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 52 /PWRON3_BATEN3))
(pad 34 smd rect (at 5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 35 smd rect (at 5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 53 /PWRON2_BATEN2))
(pad 36 smd rect (at 5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 54 /PWRON1_BATEN1))
(pad 37 smd rect (at 5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 44 /SDA))
(pad 38 smd rect (at 5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 43 /SCL))
(pad 39 smd rect (at 5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 40 /SMBUSZ_SS_SUS))
(pad 40 smd rect (at 5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 39 /FULLPWRMGMTZ_SMBA1))
(pad 41 smd rect (at 5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 34 /PWRCTL_POL_TDO))
(pad 42 smd rect (at 5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 38 /GANGED_SMBA2_SH_UP))
(pad 43 smd rect (at 5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 37 /OVRCUR3Z_TCK))
(pad 45 smd rect (at 5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 41 /AUTOENZ_HS_SUS))
(pad 46 smd rect (at 5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 35 /OVRCUR1Z_TDI))
(pad 47 smd rect (at 5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 36 /OVRCUR2Z_TMS))
(pad 48 smd rect (at 5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 49 "Net-(R17-Pad1)"))
(pad 49 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 33 /TEST_TRSTZ))
(pad 50 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 8 "Net-(C34-Pad1)"))
(pad 51 smd rect (at 2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 52 smd rect (at 2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 53 smd rect (at 1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 55 smd rect (at 0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 56 smd rect (at 0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 57 smd rect (at -0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 3 /IO1V1))
(pad 58 smd rect (at -0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 59 smd rect (at -1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 60 smd rect (at -1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 61 smd rect (at -2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(fp_line (start 4.699 -1.00076) (end 4.89966 -0.59944) (layer F.SilkS) (width 0.15))
(fp_line (start 4.89966 -0.59944) (end 5.00126 0) (layer F.SilkS) (width 0.15))
(fp_line (start 5.00126 0) (end 4.89966 0.50038) (layer F.SilkS) (width 0.15))
(fp_line (start 4.89966 0.50038) (end 4.50088 1.19888) (layer F.SilkS) (width 0.15))
(fp_line (start 4.50088 1.19888) (end 3.8989 1.6002) (layer F.SilkS) (width 0.15))
(fp_line (start 3.8989 1.6002) (end 3.29946 1.80086) (layer F.SilkS) (width 0.15))
(fp_line (start 3.29946 1.80086) (end -3.29946 1.80086) (layer F.SilkS) (width 0.15))
(fp_line (start -3.29946 1.80086) (end -4.0005 1.6002) (layer F.SilkS) (width 0.15))
(fp_line (start -4.0005 1.6002) (end -4.39928 1.30048) (layer F.SilkS) (width 0.15))
(fp_line (start -4.39928 1.30048) (end -4.8006 0.8001) (layer F.SilkS) (width 0.15))
(fp_line (start -4.8006 0.8001) (end -5.00126 0.20066) (layer F.SilkS) (width 0.15))
(fp_line (start -5.00126 0.20066) (end -5.00126 -0.29972) (layer F.SilkS) (width 0.15))
(fp_line (start -5.00126 -0.29972) (end -4.8006 -0.8001) (layer F.SilkS) (width 0.15))
(fp_line (start -4.8006 -0.8001) (end -4.30022 -1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start -4.30022 -1.39954) (end -3.79984 -1.69926) (layer F.SilkS) (width 0.15))
(fp_line (start -3.79984 -1.69926) (end -3.29946 -1.80086) (layer F.SilkS) (width 0.15))
(fp_line (start -3.2004 -1.80086) (end 3.40106 -1.80086) (layer F.SilkS) (width 0.15))
(fp_line (start 3.40106 -1.80086) (end 3.79984 -1.69926) (layer F.SilkS) (width 0.15))
(fp_line (start 3.79984 -1.69926) (end 4.30022 -1.39954) (layer F.SilkS) (width 0.15))
(fp_line (start 4.30022 -1.39954) (end 4.8006 -0.89916) (layer F.SilkS) (width 0.15))
(fp_line (start -3.19024 -2.32918) (end -3.64998 -2.28092) (layer F.SilkS) (width 0.15))
(fp_line (start -3.64998 -2.28092) (end -4.04876 -2.16916) (layer F.SilkS) (width 0.15))
(fp_line (start -4.04876 -2.16916) (end -4.48056 -1.95072) (layer F.SilkS) (width 0.15))
(fp_line (start -4.48056 -1.95072) (end -4.77012 -1.71958) (layer F.SilkS) (width 0.15))
(fp_line (start -4.77012 -1.71958) (end -5.10032 -1.36906) (layer F.SilkS) (width 0.15))
(fp_line (start -5.10032 -1.36906) (end -5.38988 -0.83058) (layer F.SilkS) (width 0.15))
(fp_line (start -5.38988 -0.83058) (end -5.51942 -0.23114) (layer F.SilkS) (width 0.15))
(fp_line (start -5.51942 -0.23114) (end -5.51942 0.2794) (layer F.SilkS) (width 0.15))
(fp_line (start -5.51942 0.2794) (end -5.34924 0.98044) (layer F.SilkS) (width 0.15))
(fp_line (start -5.34924 0.98044) (end -4.95046 1.56972) (layer F.SilkS) (width 0.15))
(fp_line (start -4.95046 1.56972) (end -4.49072 1.94056) (layer F.SilkS) (width 0.15))
(fp_line (start -4.49072 1.94056) (end -4.06908 2.14884) (layer F.SilkS) (width 0.15))
(fp_line (start -4.06908 2.14884) (end -3.6195 2.30886) (layer F.SilkS) (width 0.15))
(fp_line (start -3.6195 2.30886) (end -3.18008 2.33934) (layer F.SilkS) (width 0.15))
(fp_line (start 4.16052 2.1209) (end 4.53898 1.89992) (layer F.SilkS) (width 0.15))
(fp_line (start 4.53898 1.89992) (end 4.85902 1.62052) (layer F.SilkS) (width 0.15))
(fp_line (start 4.85902 1.62052) (end 5.11048 1.29032) (layer F.SilkS) (width 0.15))
(fp_line (start 5.11048 1.29032) (end 5.4102 0.73914) (layer F.SilkS) (width 0.15))
(fp_line (start 5.4102 0.73914) (end 5.51942 0.26924) (layer F.SilkS) (width 0.15))
(fp_line (start 5.51942 0.26924) (end 5.53974 -0.1905) (layer F.SilkS) (width 0.15))
(fp_line (start 5.53974 -0.1905) (end 5.45084 -0.65024) (layer F.SilkS) (width 0.15))
(fp_line (start 5.45084 -0.65024) (end 5.26034 -1.09982) (layer F.SilkS) (width 0.15))
(fp_line (start 5.26034 -1.09982) (end 4.89966 -1.56972) (layer F.SilkS) (width 0.15))
(fp_line (start 4.89966 -1.56972) (end 4.54914 -1.88976) (layer F.SilkS) (width 0.15))
(fp_line (start 4.54914 -1.88976) (end 4.16052 -2.1209) (layer F.SilkS) (width 0.15))
(fp_line (start 4.16052 -2.1209) (end 3.73126 -2.2606) (layer F.SilkS) (width 0.15))
(fp_line (start 3.73126 -2.2606) (end 3.2893 -2.32918) (layer F.SilkS) (width 0.15))
(fp_line (start -3.2004 2.32918) (end 3.2512 2.32918) (layer F.SilkS) (width 0.15))
(fp_line (start 3.2512 2.32918) (end 3.6703 2.29108) (layer F.SilkS) (width 0.15))
(fp_line (start 3.6703 2.29108) (end 4.16052 2.1209) (layer F.SilkS) (width 0.15))
(fp_line (start -3.2004 -2.32918) (end 3.2512 -2.32918) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole circle (at -2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers *.Cu *.Mask F.SilkS)
(net 6 "Net-(C31-Pad1)"))
(pad 62 smd rect (at -2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 63 smd rect (at -3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 1 /IO3V3))
(pad 64 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask)
(net 48 "Net-(R16-Pad1)"))
(model Housings_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
(pad 2 thru_hole circle (at 2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers *.Cu *.Mask F.SilkS)
(net 7 "Net-(C32-Pad1)"))
)
)
 
(module Mlab_T:TO-263-5 placed (layer F.Cu) (tedit 55659639) (tstamp 5565ACD7)
(at 156.972 104.775)
(path /55551F88/55556F70)
(attr smd)
(fp_text reference U3 (at 0 -5.969) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TPS7A4533KTTR (at 0 -3.937) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.30022 -2.413) (end 5.715 -2.413) (layer F.SilkS) (width 0.15))
(fp_line (start -4.30022 -2.4003) (end -4.30022 1.143) (layer F.SilkS) (width 0.15))
(fp_line (start -5.715 -2.413) (end -5.715 -15.795) (layer F.SilkS) (width 0.15))
(fp_line (start 5.715 -15.795) (end 5.715 -2.413) (layer F.SilkS) (width 0.15))
(fp_line (start -5.715 -2.413) (end -4.30022 -2.413) (layer F.SilkS) (width 0.15))
(pad 2 smd rect (at -1.69926 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 3 smd rect (at 0 -10.795) (size 10.80008 9.99998) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 4 smd rect (at 1.69926 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 5 +3V3))
(pad 3 smd rect (at 0 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 2 GND))
(pad 1 smd rect (at -3.40106 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 10 +5V))
(pad 5 smd rect (at 3.40106 0) (size 1.143 3.4) (layers F.Cu F.Paste F.Mask)
(net 11 "Net-(C38-Pad1)"))
)
 
(module Housings_DFN_QFN:QFN-20-1EP_5x5mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77) (tstamp 5565ACE0)
(at 144.526 94.107)
(descr "20-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFN 0.65")
(path /55551F88/55556F79)
(attr smd)
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