WebSVN – MLAB – /Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb Rev 4173 and /Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb Rev 4174 – Path Comparison

/Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb
1,15 → 1,15
(kicad_pcb (version 4) (host pcbnew "(2015-05-13 BZR 5653)-product")

(general
(links 408)
(no_connects 400)
(links 409)
(no_connects 366)
(area -16.306001 -94.538001 111.429001 -0.203999)
(thickness 1.6)
(drawings 7)
(tracks 126)
(tracks 527)
(zones 0)
(modules 165)
(nets 99)
(nets 98)
)

(page A4)
64,8 → 64,8
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 1.5 1.5)
(pad_drill 0.6)
(pad_size 2.70002 2.70002)
(pad_drill 2.30124)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(visible_elements 7FFFFFFF)
194,7 → 194,6
(net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3")
(net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2")
(net 97 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1")
(net 98 "Net-(C50-Pad1)")

(net_class Default "Toto je výchozí třída sítě."
(clearance 0.2)
266,7 → 265,6
(add_net "Net-(C34-Pad1)")
(add_net "Net-(C35-Pad1)")
(add_net "Net-(C38-Pad1)")
(add_net "Net-(C50-Pad1)")
(add_net "Net-(C57-Pad1)")
(add_net "Net-(C58-Pad1)")
(add_net "Net-(C59-Pad2)")
696,7 → 694,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 5565993D)
(at 72.39 -59.436)
(at 91.186 -54.356)
(path /555DEC99)
(attr smd)
(fp_text reference C15 (at 0 0.3175) (layer B.SilkS)
1144,13 → 1142,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 5565999D)
(at 15.748 3.81)
(at 28.448 -24.892 270)
(path /555F0254)
(attr smd)
(fp_text reference C31 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C31 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
1160,9 → 1158,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 6 "Net-(C31-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
1172,13 → 1170,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599A3)
(at 22.606 3.556)
(at 28.448 -32.004 90)
(path /555F0392)
(attr smd)
(fp_text reference C32 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C32 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
1188,9 → 1186,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 7 "Net-(C32-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
1424,7 → 1422,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599D9)
(at 94.742 -10.922)
(at 6.096 -10.668)
(path /5555526D/55556FAC)
(attr smd)
(fp_text reference C41 (at 0 0.3175) (layer B.SilkS)
1452,7 → 1450,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599DF)
(at -13.97 -103.378)
(at 5.588 -39.624)
(path /5555526D/555D7F82)
(attr smd)
(fp_text reference C42 (at 0 0.3175) (layer B.SilkS)
1480,7 → 1478,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599E5)
(at 100.076 -15.748)
(at 8.636 -19.304)
(path /5555526D/55556FAF)
(attr smd)
(fp_text reference C43 (at 0 0.3175) (layer B.SilkS)
1507,7 → 1505,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 556599EB)
(at -10.922 -100.33)
(at 7.112 -49.276)
(path /5555526D/555D7F94)
(attr smd)
(fp_text reference C44 (at 0 0.3175) (layer B.SilkS)
1535,28 → 1533,28
)

(module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 556599F1)
(at 100.584 -19.05)
(at 5.08 -25.908 90)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
(tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
(path /5555526D/55556FAD)
(attr smd)
(fp_text reference C45 (at -0.20066 3.29946) (layer B.SilkS)
(fp_text reference C45 (at -0.20066 3.29946 90) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
(fp_text value 100uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
(fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
(fp_text user + (at -5.6515 2.79908 90) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
(fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
(pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(model MLAB_3D/Capacitors/c_tant_D.wrl
(at (xyz 0 0 0))
1566,7 → 1564,7
)

(module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 556599F7)
(at 13.208 -75.184 90)
(at 6.096 -59.944 90)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
(tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
(path /5555526D/555D7F88)
1597,7 → 1595,7
)

(module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 556599FD)
(at 100.584 -23.876)
(at 13.716 -13.208)
(descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
(tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
(path /5555526D/55556FAE)
1628,7 → 1626,7
)

(module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A03)
(at 5.08 -64.516)
(at 12.192 -43.688)
(descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
(tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
(path /5555526D/555D7F8E)
1659,13 → 1657,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A09)
(at 102.108 -47.752)
(at 45.72 -75.184 90)
(path /5555526D/555D825C)
(attr smd)
(fp_text reference C49 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C49 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
1675,9 → 1673,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
1687,7 → 1685,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A0F)
(at -34.544 -60.452)
(at 75.184 -70.612)
(path /5555526D/555D82E6)
(attr smd)
(fp_text reference C50 (at 0 0.3175) (layer B.SilkS)
1704,7 → 1702,7
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 98 "Net-(C50-Pad1)"))
(net 10 +5V))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
1715,13 → 1713,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A15)
(at 102.108 -37.338)
(at 34.036 -77.724 90)
(path /5555526D/555D826E)
(attr smd)
(fp_text reference C51 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C51 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
1731,9 → 1729,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
1743,13 → 1741,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A1B)
(at -37.084 -55.372)
(at 62.484 -71.628 180)
(path /5555526D/555D82F8)
(attr smd)
(fp_text reference C52 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C52 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
1759,9 → 1757,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
1771,28 → 1769,28
)

(module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 55659A21)
(at 102.616 -51.816)
(at 24.892 -74.676 180)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
(tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
(path /5555526D/555D8262)
(attr smd)
(fp_text reference C53 (at -0.20066 3.29946) (layer B.SilkS)
(fp_text reference C53 (at -0.20066 3.29946 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
(fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
(fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
(fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
(fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
(pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(model MLAB_3D/Capacitors/c_tant_D.wrl
(at (xyz 0 0 0))
1802,28 → 1800,28
)

(module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 54BBE3ED) (tstamp 55659A27)
(at -36.576 -68.326)
(at 56.896 -75.184 180)
(descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
(tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
(path /5555526D/555D82EC)
(attr smd)
(fp_text reference C54 (at -0.20066 3.29946) (layer B.SilkS)
(fp_text reference C54 (at -0.20066 3.29946 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value 100uF (at -0.09906 -3.59918) (layer B.SilkS) hide
(fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.00126 2.19964) (end -5.00126 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start -4.50088 -2.19964) (end 4.50088 -2.19964) (layer B.SilkS) (width 0.15))
(fp_line (start 4.50088 2.19964) (end -4.50088 2.19964) (layer B.SilkS) (width 0.15))
(fp_text user + (at -5.6515 2.79908) (layer B.SilkS)
(fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start -5.65404 3.302) (end -5.65404 2.20218) (layer B.SilkS) (width 0.15))
(fp_line (start -6.25348 2.80162) (end -5.0546 2.80162) (layer B.SilkS) (width 0.15))
(pad 2 smd rect (at 3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 1 smd rect (at -3.175 0) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
(net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(model MLAB_3D/Capacitors/c_tant_D.wrl
(at (xyz 0 0 0))
1833,7 → 1831,7
)

(module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A2D)
(at 106.934 -36.83)
(at 40.132 -76.708)
(descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
(tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
(path /5555526D/555D8268)
1864,7 → 1862,7
)

(module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 54BBE3C9) (tstamp 55659A33)
(at -35.56 -53.34)
(at 67.564 -77.216)
(descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
(tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
(path /5555526D/555D82F2)
1895,7 → 1893,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A39)
(at 16.256 -35.052 90)
(at 11.684 -27.94 90)
(path /5555B01B/555C68CB)
(attr smd)
(fp_text reference C57 (at 0 0.3175 90) (layer B.SilkS)
2147,7 → 2145,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A6F)
(at 50.8 -24.892)
(at 46.736 -15.24)
(path /5555B01B/555C520D)
(attr smd)
(fp_text reference C66 (at 0 0.3175) (layer B.SilkS)
2175,13 → 2173,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A75)
(at 12.954 -65.278 180)
(at 11.176 -58.42 90)
(path /5555B01B/555C8AC8)
(attr smd)
(fp_text reference C67 (at 0 0.3175 180) (layer B.SilkS)
(fp_text reference C67 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
2191,9 → 2189,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 21 "Net-(C67-Pad1)"))
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
2315,13 → 2313,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A93)
(at 66.04 -64.516)
(at 54.356 -70.612 180)
(path /5555B01B/555C8446)
(attr smd)
(fp_text reference C72 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C72 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
2331,9 → 2329,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 23 "Net-(C72-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
2343,7 → 2341,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A99)
(at 54.356 -71.374 180)
(at 49.276 -78.74 180)
(path /5555B01B/555C8410)
(attr smd)
(fp_text reference C73 (at 0 0.3175 180) (layer B.SilkS)
2371,13 → 2369,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659A9F)
(at 34.036 -72.136)
(at 23.876 -70.104 180)
(path /5555B01B/555C830B)
(attr smd)
(fp_text reference C74 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C74 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
2387,9 → 2385,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 25 "Net-(C74-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
2483,7 → 2481,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659AB7)
(at 54.356 -69.088 180)
(at 49.276 -76.2 180)
(path /5555B01B/555C8416)
(attr smd)
(fp_text reference C78 (at 0 0.3175 180) (layer B.SilkS)
2649,32 → 2647,32
)
)

(module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659ADE)
(at 106.934 -14.732)
(module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659ADE)
(at 12.827 -36.97 180)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /5555526D/55556FB0)
(attr smd)
(fp_text reference D2 (at 0 2.54) (layer B.SilkS)
(fp_text reference D2 (at 0 2.54 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
(fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
(fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
(fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
(fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
(fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
(fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 28 "Net-(D2-Pad1)"))
(pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
2682,32 → 2680,32
)
)

(module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AE5)
(at -5.08 -97.536)
(module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AE5)
(at 12.827 -67.45 180)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /5555526D/555D7F9A)
(attr smd)
(fp_text reference D3 (at 0 2.54) (layer B.SilkS)
(fp_text reference D3 (at 0 2.54 180) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
(fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
(fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
(fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
(fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
(fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
(fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 29 "Net-(D3-Pad1)"))
(pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
2715,32 → 2713,32
)
)

(module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AEC)
(at 99.06 -40.894)
(module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AEC)
(at 36.97 -68.707 90)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /5555526D/555D8274)
(attr smd)
(fp_text reference D4 (at 0 2.54) (layer B.SilkS)
(fp_text reference D4 (at 0 2.54 90) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
(fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
(fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
(fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
(fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
(fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
(fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 30 "Net-(D4-Pad1)"))
(pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
2749,31 → 2747,31
)

(module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AF3)
(at -29.972 -56.134)
(at 67.45 -68.707 90)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /5555526D/555D82FE)
(attr smd)
(fp_text reference D5 (at 0 2.54) (layer B.SilkS)
(fp_text reference D5 (at 0 2.54 90) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value LED (at 0 -3.81) (layer B.SilkS) hide
(fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
(fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
(fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
(fp_text user A (at -1.80086 -1.5494) (layer B.SilkS)
(fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(fp_text user K (at 1.80086 -1.5494) (layer B.SilkS)
(fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 31 "Net-(D5-Pad1)"))
(pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
2782,31 → 2780,31
)

(module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 553517B5) (tstamp 55659AFA)
(at 47.752 -22.606 180)
(at 29.62 -11.049 270)
(descr "Diode Mini-MELF Standard")
(tags "Diode Mini-MELF Standard")
(path /5555B01B/555C574F)
(attr smd)
(fp_text reference D6 (at 0 2.54 180) (layer B.SilkS)
(fp_text reference D6 (at 0 2.54 270) (layer B.SilkS)
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_text value GREEN (at 0 -3.81 180) (layer B.SilkS) hide
(fp_text value GREEN (at 0 -3.81 270) (layer B.SilkS) hide
(effects (font (thickness 0.3048)) (justify mirror))
)
(fp_line (start 2.21488 -1.50622) (end 2.53492 -1.81102) (layer B.Cu) (width 0.15))
(fp_line (start 2.25298 -1.52146) (end 2.5273 -1.24968) (layer B.Cu) (width 0.15))
(fp_line (start 2.2225 -1.24968) (end 2.21742 -1.81864) (layer B.Cu) (width 0.15))
(fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS)
(fp_text user A (at -1.80086 -1.5494 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS)
(fp_text user K (at 1.80086 -1.5494 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.09906)) (justify mirror))
)
(pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 32 "Net-(D6-Pad1)"))
(pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
(net 20 /USBPORT/USB_VBUS_UP))
(pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(pad "" thru_hole circle (at 0 0 270) (size 1.35 1.35) (drill 1.35) (layers .Cu .Mask B.SilkS))
(model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
(at (xyz 0 0 0))
(scale (xyz 0.3937 0.3937 0.3937))
2815,7 → 2813,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B00)
(at 37.592 -122.682)
(at 34.036 -164.338)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F8795)
2945,7 → 2943,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B1E)
(at 30.734 -99.441)
(at 27.178 -141.097)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F75CB)
2971,7 → 2969,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B24)
(at 30.861 -103.886)
(at 27.305 -145.542)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F7795)
2997,7 → 2995,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B2A)
(at 29.083 -109.093)
(at 25.527 -150.749)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F77EB)
3049,7 → 3047,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B36)
(at 28.448 -125.095)
(at 24.892 -166.751)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F789D)
3075,7 → 3073,7
)

(module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 5545E8D2) (tstamp 55659B3C)
(at 28.067 -118.11)
(at 24.511 -159.766)
(descr "pin header straight 2x01")
(tags "pin header straight 2x01")
(path /555F78F9)
3202,13 → 3200,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B5C)
(at 20.066 -32.766)
(at 11.684 -23.876 270)
(path /5555B01B/555C6655)
(attr smd)
(fp_text reference L3 (at 0 0.3175) (layer B.SilkS)
(fp_text reference L3 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3218,9 → 3216,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 17 "Net-(C57-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
3230,13 → 3228,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B62)
(at 16.764 -64.516 90)
(at 11.176 -53.848 270)
(path /5555B01B/555C8AC2)
(attr smd)
(fp_text reference L4 (at 0 0.3175 90) (layer B.SilkS)
(fp_text reference L4 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381 90) (layer B.SilkS)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3246,9 → 3244,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 21 "Net-(C67-Pad1)"))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
3258,13 → 3256,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B68)
(at 63.246 -64.008 270)
(at 58.42 -70.612)
(path /5555B01B/555C8440)
(attr smd)
(fp_text reference L5 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference L5 (at 0 0.3175) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3274,9 → 3272,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 23 "Net-(C72-Pad1)"))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 53 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
3286,13 → 3284,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B6E)
(at 33.782 -75.184 270)
(at 27.432 -70.104)
(path /5555B01B/555C8305)
(attr smd)
(fp_text reference L6 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference L6 (at 0 0.3175) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS)
(fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3302,9 → 3300,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 25 "Net-(C74-Pad1)"))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
3378,7 → 3376,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B88)
(at 72.39 -64.262)
(at 91.186 -59.182)
(path /555DE85C)
(attr smd)
(fp_text reference R1 (at 0 0.3175) (layer B.SilkS)
3406,7 → 3404,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B8E)
(at 75.946 -64.262)
(at 95.758 -59.182)
(path /555DE91B)
(attr smd)
(fp_text reference R2 (at 0 0.3175) (layer B.SilkS)
3434,7 → 3432,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B94)
(at 72.39 -61.468)
(at 91.186 -56.388)
(path /555DE975)
(attr smd)
(fp_text reference R3 (at 0 0.3175) (layer B.SilkS)
3462,7 → 3460,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659B9A)
(at 75.946 -61.468)
(at 95.758 -56.388)
(path /555DE953)
(attr smd)
(fp_text reference R4 (at 0 0.3175) (layer B.SilkS)
3490,7 → 3488,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BA0)
(at 77.724 -58.42)
(at 97.536 -53.34)
(path /555DEE17)
(attr smd)
(fp_text reference R5 (at 0 0.3175) (layer B.SilkS)
3518,7 → 3516,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BA6)
(at 76.2 -59.182)
(at 96.012 -54.102)
(path /555DEEA9)
(attr smd)
(fp_text reference R6 (at 0 0.3175) (layer B.SilkS)
3546,7 → 3544,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BAC)
(at 35.306 -99.314 180)
(at 31.75 -140.97 180)
(path /555F5F8B)
(attr smd)
(fp_text reference R7 (at 0 0.3175 180) (layer B.SilkS)
3574,7 → 3572,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BB2)
(at 23.368 -118.11 180)
(at 19.812 -159.766 180)
(path /555F6396)
(attr smd)
(fp_text reference R8 (at 0 0.3175 180) (layer B.SilkS)
3630,7 → 3628,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BBE)
(at 35.56 -103.886 180)
(at 32.004 -145.542 180)
(path /555F618E)
(attr smd)
(fp_text reference R10 (at 0 0.3175 180) (layer B.SilkS)
3658,7 → 3656,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BC4)
(at 24.638 -125.222 180)
(at 21.082 -166.878 180)
(path /555F640A)
(attr smd)
(fp_text reference R11 (at 0 0.3175 180) (layer B.SilkS)
3686,13 → 3684,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BCA)
(at 19.558 5.08)
(at 34.036 -28.448 270)
(path /555F04D7)
(attr smd)
(fp_text reference R12 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R12 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 1M (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 1M (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3702,9 → 3700,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 7 "Net-(C32-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 6 "Net-(C31-Pad1)"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
3742,7 → 3740,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BD6)
(at 24.384 -108.966)
(at 20.828 -150.622)
(path /555F61E0)
(attr smd)
(fp_text reference R14 (at 0 0.3175) (layer B.SilkS)
3798,13 → 3796,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659BE2)
(at 40.132 -34.798 270)
(at 35.56 -32.512 180)
(path /555F4735)
(attr smd)
(fp_text reference R16 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R16 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 9k53 (at 0.127 -0.381 270) (layer B.SilkS)
(fp_text value 9k53 (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
3814,9 → 3812,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 45 "Net-(R16-Pad1)"))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4106,13 → 4104,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C24)
(at 95.758 -13.716)
(at 2.032 -15.24 90)
(path /5555526D/55556FB3)
(attr smd)
(fp_text reference R27 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R27 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4122,9 → 4120,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4134,13 → 4132,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C2A)
(at -9.652 -103.124)
(at 3.556 -49.276 270)
(path /5555526D/555D7FAC)
(attr smd)
(fp_text reference R28 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R28 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 10K (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4150,9 → 4148,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4162,13 → 4160,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C30)
(at 109.22 -23.368)
(at 17.272 -39.624 90)
(path /5555526D/55556FB1)
(attr smd)
(fp_text reference R29 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R29 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4178,9 → 4176,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 28 "Net-(D2-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4190,13 → 4188,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C36)
(at -6.096 -94.488)
(at 14.732 -71.12 90)
(path /5555526D/555D7FA0)
(attr smd)
(fp_text reference R30 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R30 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4206,9 → 4204,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 29 "Net-(D3-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4218,13 → 4216,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C3C)
(at 104.14 -40.386)
(at 41.656 -67.056 180)
(path /5555526D/555D8286)
(attr smd)
(fp_text reference R31 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R31 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 10K (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4234,9 → 4232,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4246,13 → 4244,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C42)
(at -35.052 -58.166)
(at 71.12 -69.596 90)
(path /5555526D/555D8310)
(attr smd)
(fp_text reference R32 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R32 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10K (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4262,9 → 4260,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 +3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4274,7 → 4272,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C48)
(at 98.044 -38.1)
(at 41.656 -64.516)
(path /5555526D/555D827A)
(attr smd)
(fp_text reference R33 (at 0 0.3175) (layer B.SilkS)
4302,13 → 4300,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C4E)
(at -28.448 -59.436)
(at 67.564 -64.008 270)
(path /5555526D/555D8304)
(attr smd)
(fp_text reference R34 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R34 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 330R (at 0.127 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4318,9 → 4316,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 31 "Net-(D5-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4386,13 → 4384,13
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C60)
(at 50.8 -19.812)
(at 29.464 -16.256 90)
(path /5555B01B/555C43F5)
(attr smd)
(fp_text reference R37 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R37 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 330R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
4402,9 → 4400,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 32 "Net-(D6-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
4442,7 → 4440,7
)

(module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 54799E0C) (tstamp 55659C6C)
(at 54.356 -66.802 180)
(at 49.276 -73.152 180)
(path /5555B01B/555C840A)
(attr smd)
(fp_text reference R39 (at 0 0.3175 180) (layer B.SilkS)
4709,7 → 4707,7
)

(module Mlab_IO:TSSOP-8_4.4x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 54130A77) (tstamp 5566BC2A)
(at 76.962 -67.818)
(at 94.742 -63.246)
(descr "8-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /555DE7C3)
4830,15 → 4828,15
)

(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC50)
(at 101.092 -12.192)
(at 5.588 -14.732 90)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
(path /5555526D/55556FAA)
(attr smd)
(fp_text reference U5 (at 0 2.55) (layer B.SilkS)
(fp_text reference U5 (at 0 2.55 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
(fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
4852,29 → 4850,29
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 97 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1"))
(pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
(pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
(pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
4884,15 → 4882,15
)

(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC5F)
(at 7.62 -68.072)
(at 4.572 -44.196 90)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
(path /5555526D/555D7FD9)
(attr smd)
(fp_text reference U6 (at 0 2.55) (layer B.SilkS)
(fp_text reference U6 (at 0 2.55 90) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
(fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
4906,29 → 4904,29
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2"))
(pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
(pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
(pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
4938,15 → 4936,15
)

(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC6E)
(at 102.616 -43.942)
(at 42.164 -71.12 180)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
(path /5555526D/555D82B3)
(attr smd)
(fp_text reference U7 (at 0 2.55) (layer B.SilkS)
(fp_text reference U7 (at 0 2.55 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value TPS2001CDGN (at 0 -2.55) (layer B.Fab)
(fp_text value TPS2001CDGN (at 0 -2.55 180) (layer B.Fab)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -2.8 1.8) (end -2.8 -1.8) (layer B.CrtYd) (width 0.05))
4960,29 → 4958,29
(fp_line (start -1.625 1.625) (end 1.625 1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer B.SilkS) (width 0.15))
(fp_line (start -1.625 1.41) (end -2.55 1.41) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 3 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 10 +5V))
(pad 4 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at -2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3"))
(pad 5 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 5 smd rect (at 2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
(pad 6 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 6 smd rect (at 2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 7 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 7 smd rect (at 2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 8 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(pad 8 smd rect (at 2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
(pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at 0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(pad 9 smd rect (at -0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
(net 2 GND) (solder_paste_margin_ratio -0.2))
(model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
(at (xyz 0 0 0))
4992,7 → 4990,7
)

(module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 55659CC8) (tstamp 5566BC7D)
(at -35.306 -64.516 180)
(at 68.58 -73.66 180)
(descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
(tags "SSOP 0.65")
(path /5555526D/555D833D)
5017,9 → 5015,9
(pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 98 "Net-(C50-Pad1)"))
(net 10 +5V))
(pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 98 "Net-(C50-Pad1)"))
(net 10 +5V))
(pad 4 smd rect (at -2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
(net 94 "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4"))
(pad 5 smd rect (at 2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
5046,14 → 5044,14
)

(module Crystals:Crystal_HC49-U_Vertical (layer F.Cu) (tedit 0) (tstamp 5566BC91)
(at 19.685 9.779)
(at 32.512 -28.448 90)
(descr "Crystal, Quarz, HC49/U, vertical, stehend,")
(tags "Crystal, Quarz, HC49/U, vertical, stehend,")
(path /555F014A)
(fp_text reference Y1 (at 0 -3.81) (layer F.SilkS)
(fp_text reference Y1 (at 0 -3.81 90) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value 24MHz (at 0 3.81) (layer F.Fab)
(fp_text value 24MHz (at 0 3.81 90) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 4.699 -1.00076) (end 4.89966 -0.59944) (layer F.SilkS) (width 0.15))
5107,9 → 5105,9
(fp_line (start 3.2512 2.32918) (end 3.6703 2.29108) (layer F.SilkS) (width 0.15))
(fp_line (start 3.6703 2.29108) (end 4.16052 2.1209) (layer F.SilkS) (width 0.15))
(fp_line (start -3.2004 -2.32918) (end 3.2512 -2.32918) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole circle (at -2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at -2.44094 0 90) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(net 6 "Net-(C31-Pad1)"))
(pad 2 thru_hole circle (at 2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at 2.44094 0 90) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(net 7 "Net-(C32-Pad1)"))
)

5157,7 → 5155,7
)
)

(module Mlab_Con:USB3_0_B locked (layer F.Cu) (tedit 55DDC16F) (tstamp 55DDC4BB)
(module Mlab_Con:USB3_0_B locked (layer F.Cu) (tedit 55DF05BB) (tstamp 55DDC4BB)
(at 34.62 -11.049)
(tags "USB 3.0 B")
(path /5555B01B/555C768C)
5346,131 → 5344,532
(gr_line (start 81.026 -94.488) (end 81.026 -4.064) (angle 90) (layer Edge.Cuts) (width 0.1))
(gr_line (start -14.097 -81.026) (end 111.379 -81.026) (angle 90) (layer Edge.Cuts) (width 0.1))

(segment (start 40.203 -13.759) (end 40.203 -13.175334) (width 0.125) (layer F.Cu) (net 0))
(segment (start 40.203 -15.759) (end 40.508 -15.454) (width 0.125) (layer F.Cu) (net 0))
(segment (start 45.059501 -32.782499) (end 44.822 -33.02) (width 0.125) (layer F.Cu) (net 0))
(via (at 44.822 -33.02) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 0))
(segment (start 45.059501 -33.257501) (end 44.822 -33.02) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.059501 -36.474999) (end 45.059501 -33.257501) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.104501 -36.519999) (end 45.059501 -36.474999) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.104501 -37.323836) (end 45.104501 -36.519999) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.192 -37.411335) (end 45.104501 -37.323836) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.192 -37.48) (end 45.192 -37.411335) (width 0.125) (layer B.Cu) (net 0))
(segment (start 43.192 -36.355) (end 43.192 -37.48) (width 0.125) (layer B.Cu) (net 0))
(segment (start 43.0945 -36.2575) (end 43.192 -36.355) (width 0.125) (layer B.Cu) (net 0))
(segment (start 42.692 -36.355) (end 42.692 -37.48) (width 0.125) (layer B.Cu) (net 0))
(segment (start 42.7895 -36.2575) (end 42.692 -36.355) (width 0.125) (layer B.Cu) (net 0))
(segment (start 42.692 -36.355) (end 42.692 -37.48) (width 0.125) (layer B.Cu) (net 0))
(segment (start 43.0945 -36.2575) (end 43.192 -36.355) (width 0.125) (layer B.Cu) (net 0))
(segment (start 43.192 -36.355) (end 43.192 -37.48) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.192 -37.48) (end 45.192 -37.411335) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.192 -37.411335) (end 45.104501 -37.323836) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.104501 -37.323836) (end 45.104501 -36.519999) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.104501 -36.519999) (end 45.059501 -36.474999) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.059501 -36.474999) (end 45.059501 -33.257501) (width 0.125) (layer B.Cu) (net 0))
(segment (start 45.059501 -33.257501) (end 44.822 -33.02) (width 0.125) (layer B.Cu) (net 0))
(via (at 44.822 -33.02) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 0))
(segment (start 45.059501 -32.782499) (end 44.822 -33.02) (width 0.125) (layer F.Cu) (net 0))
(segment (start 40.203 -15.759) (end 40.508 -15.454) (width 0.125) (layer F.Cu) (net 0))
(segment (start 40.203 -13.759) (end 40.203 -13.175334) (width 0.125) (layer F.Cu) (net 0))
(segment (start 33.6805 -16.827166) (end 33.6805 -24.447843) (width 0.125) (layer B.Cu) (net 0))
(segment (start 33.6805 -24.447843) (end 36.896886 -27.664229) (width 0.125) (layer B.Cu) (net 0))
(segment (start 33.3755 -16.700834) (end 33.3755 -24.574177) (width 0.125) (layer B.Cu) (net 0))
(segment (start 33.3755 -24.574177) (end 36.681219 -27.879896) (width 0.125) (layer B.Cu) (net 0))
(segment (start 15.888999 -25.156499) (end 16.765001 -25.156499) (width 0.125) (layer B.Cu) (net 2))
(segment (start 15.414499 -25.630999) (end 15.888999 -25.156499) (width 0.125) (layer B.Cu) (net 2))
(segment (start 15.414499 -25.656499) (end 15.414499 -25.630999) (width 0.125) (layer B.Cu) (net 2))
(segment (start 14.827 -25.069) (end 15.414499 -25.656499) (width 0.125) (layer B.Cu) (net 2))
(segment (start 15.414499 -25.656499) (end 15.414499 -25.630999) (width 0.125) (layer B.Cu) (net 2))
(segment (start 15.414499 -25.630999) (end 15.888999 -25.156499) (width 0.125) (layer B.Cu) (net 2))
(segment (start 15.888999 -25.156499) (end 16.765001 -25.156499) (width 0.125) (layer B.Cu) (net 2))
(segment (start 32.512 -26.00706) (end 28.61056 -26.00706) (width 0.25) (layer B.Cu) (net 6))
(segment (start 28.61056 -26.00706) (end 28.448 -25.8445) (width 0.25) (layer B.Cu) (net 6))
(segment (start 38.39 -34.94) (end 38.39 -31.5955) (width 0.25) (layer B.Cu) (net 6))
(segment (start 38.39 -31.5955) (end 34.29 -27.4955) (width 0.25) (layer B.Cu) (net 6))
(segment (start 34.29 -27.4955) (end 34.036 -27.4955) (width 0.25) (layer B.Cu) (net 6))
(segment (start 28.448 -31.0515) (end 32.34944 -31.0515) (width 0.25) (layer B.Cu) (net 7))
(segment (start 32.34944 -31.0515) (end 32.512 -30.88894) (width 0.25) (layer B.Cu) (net 7))
(segment (start 37.89 -34.94) (end 37.89 -32.161498) (width 0.25) (layer B.Cu) (net 7))
(segment (start 37.89 -32.161498) (end 35.129002 -29.4005) (width 0.25) (layer B.Cu) (net 7))
(segment (start 35.129002 -29.4005) (end 34.9845 -29.4005) (width 0.25) (layer B.Cu) (net 7))
(segment (start 34.9845 -29.4005) (end 34.036 -29.4005) (width 0.25) (layer B.Cu) (net 7))
(segment (start 45.364499 -32.782499) (end 45.602 -33.02) (width 0.125) (layer F.Cu) (net 14))
(via (at 45.602 -33.02) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 14))
(segment (start 45.364499 -33.257501) (end 45.602 -33.02) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.364499 -36.348677) (end 45.364499 -33.257501) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.692 -37.48) (end 45.604501 -37.392501) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.604501 -37.392501) (end 45.604501 -36.588679) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.604501 -36.588679) (end 45.364499 -36.348677) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.604501 -37.392501) (end 45.604501 -36.588679) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.692 -37.48) (end 45.604501 -37.392501) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.364499 -36.348677) (end 45.364499 -33.257501) (width 0.125) (layer B.Cu) (net 14))
(segment (start 45.364499 -33.257501) (end 45.602 -33.02) (width 0.125) (layer B.Cu) (net 14))
(via (at 45.602 -33.02) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 14))
(segment (start 45.364499 -32.782499) (end 45.602 -33.02) (width 0.125) (layer F.Cu) (net 14))
(segment (start 40.059 -70.145) (end 40.059 -69.635) (width 0.3) (layer B.Cu) (net 15))
(segment (start 40.059 -69.635) (end 40.7035 -68.9905) (width 0.3) (layer B.Cu) (net 15))
(segment (start 40.7035 -68.9905) (end 40.7035 -67.056) (width 0.3) (layer B.Cu) (net 15))
(segment (start 11.176 -54.8005) (end 11.176 -57.4675) (width 0.7) (layer B.Cu) (net 21))
(segment (start 14.827 -59.38) (end 12.9145 -57.4675) (width 0.7) (layer B.Cu) (net 21))
(segment (start 12.9145 -57.4675) (end 11.176 -57.4675) (width 0.7) (layer B.Cu) (net 21))
(segment (start 15.287499 -59.247501) (end 15.287499 -59.273001) (width 0.125) (layer B.Cu) (net 21))
(segment (start 14.7 -59.835) (end 15.287499 -59.247501) (width 0.125) (layer B.Cu) (net 21))
(segment (start 15.287499 -59.247501) (end 15.287499 -59.273001) (width 0.125) (layer B.Cu) (net 21))
(segment (start 24.8285 -70.104) (end 26.4795 -70.104) (width 0.7) (layer B.Cu) (net 25))
(segment (start 28.9 -66.707) (end 26.4795 -69.1275) (width 0.7) (layer B.Cu) (net 25))
(segment (start 26.4795 -69.1275) (end 26.4795 -70.104) (width 0.7) (layer B.Cu) (net 25))
(segment (start 14.827 -67.45) (end 14.827 -67.225) (width 0.7) (layer B.Cu) (net 29))
(segment (start 40.7035 -64.516) (end 39.161 -64.516) (width 0.7) (layer B.Cu) (net 30))
(segment (start 39.161 -64.516) (end 36.97 -66.707) (width 0.7) (layer B.Cu) (net 30))
(segment (start 36.89 -34.94) (end 36.89 -32.8895) (width 0.25) (layer B.Cu) (net 45))
(segment (start 36.89 -32.8895) (end 36.5125 -32.512) (width 0.25) (layer B.Cu) (net 45))
(segment (start 6.096 -56.769) (end 6.096 -58.74408) (width 0.7) (layer B.Cu) (net 51))
(segment (start 6.096 -58.74408) (end 10.827 -63.47508) (width 0.7) (layer B.Cu) (net 51))
(segment (start 10.827 -63.47508) (end 10.827 -66) (width 0.7) (layer B.Cu) (net 51))
(segment (start 10.827 -66) (end 10.827 -67.45) (width 0.7) (layer B.Cu) (net 51))
(segment (start 9.66724 -43.688) (end 8.16 -43.688) (width 0.7) (layer B.Cu) (net 51))
(segment (start 8.16 -43.688) (end 5.547 -46.301) (width 0.7) (layer B.Cu) (net 51))
(segment (start 5.547 -48.219) (end 5.547 -50.44808) (width 0.7) (layer B.Cu) (net 51))
(segment (start 5.547 -50.44808) (end 7.99442 -52.8955) (width 0.7) (layer B.Cu) (net 51))
(segment (start 4.247 -46.866) (end 4.813401 -47.432401) (width 0.2) (layer B.Cu) (net 51))
(segment (start 4.813401 -47.432401) (end 4.897 -47.516) (width 0.2) (layer B.Cu) (net 51))
(segment (start 5.547 -48.219) (end 4.813401 -47.485401) (width 0.2) (layer B.Cu) (net 51))
(segment (start 4.813401 -47.485401) (end 4.813401 -47.432401) (width 0.2) (layer B.Cu) (net 51))
(segment (start 5.547 -46.301) (end 5.547 -48.219) (width 0.2) (layer B.Cu) (net 51))
(segment (start 4.247 -46.301) (end 4.247 -46.866) (width 0.2) (layer B.Cu) (net 51))
(segment (start 4.897 -47.516) (end 4.897 -46.301) (width 0.2) (layer B.Cu) (net 51))
(segment (start 6.096 -56.769) (end 6.096 -54.79392) (width 0.7) (layer B.Cu) (net 51))
(segment (start 6.096 -54.79392) (end 7.99442 -52.8955) (width 0.7) (layer B.Cu) (net 51))
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(segment (start 9.7775 -52.8955) (end 11.176 -52.8955) (width 0.7) (layer B.Cu) (net 51))
(segment (start 40.059 -71.445) (end 38.884 -71.445) (width 0.4) (layer B.Cu) (net 52))
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(segment (start 40.059 -70.795) (end 37.058 -70.795) (width 0.4) (layer B.Cu) (net 52))
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)

Subversion Repositories – MLAB

/Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb @ 4173 → /Modules/CommSerial/USBHUB01A/SCH_PCB/usbhub01a.kicad_pcb @ 4174

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With Path:	Rev