/Modules/Sensors/RPS01A/PCB/RPS01A.kicad_pcb-bak
1,14 → 1,14
(kicad_pcb (version 4) (host pcbnew "(2014-08-29 BZR 5106)-product")
(kicad_pcb (version 4) (host pcbnew "(2015-01-07 BZR 5359)-product")
 
(general
(links 34)
(no_connects 33)
(links 39)
(no_connects 0)
(area 0.205999 -40.434001 20.114001 -0.205999)
(thickness 1.6)
(drawings 4)
(tracks 44)
(drawings 17)
(tracks 117)
(zones 0)
(modules 16)
(modules 17)
(nets 9)
)
 
37,7 → 37,9
)
 
(setup
(last_trace_width 0.254)
(last_trace_width 0.3)
(user_trace_width 0.3)
(user_trace_width 0.4)
(trace_clearance 0.254)
(zone_clearance 0.508)
(zone_45_only no)
58,11 → 60,11
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 1.5 1.5)
(pad_drill 0.6)
(pad_size 4 1.2)
(pad_drill 0)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(visible_elements FFFFFF7F)
(visible_elements 7FFFFF7F)
(pcbplotparams
(layerselection 0x00030_80000001)
(usegerberextensions false)
173,12 → 175,12
)
)
 
(module Hrebinky:Pin_Header_Straight_2x05 placed (layer F.Cu) (tedit 53F5A718) (tstamp 547EC957)
(module Hrebinky:Pin_Header_Straight_2x05 placed (layer F.Cu) (tedit 55125659) (tstamp 547EC957)
(at 7.62 -35.179 180)
(descr "1 pin")
(tags "CONN DEV")
(path /547DF2B1)
(fp_text reference J1 (at 0 -3.81 180) (layer F.SilkS)
(fp_text reference J1 (at 0 -3.81 180) (layer F.SilkS) hide
(effects (font (size 1.27 1.27) (thickness 0.2032)))
)
(fp_text value JUMP_5X2 (at 1.27 0 180) (layer F.SilkS) hide
237,12 → 239,12
)
)
 
(module Hrebinky:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 5472F1F7) (tstamp 547EC961)
(module Hrebinky:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 55125655) (tstamp 547EC961)
(at 17.145 -35.179)
(descr "1 pin")
(tags "CONN DEV")
(path /547DF44F)
(fp_text reference J2 (at 0 -3.81) (layer F.SilkS)
(fp_text reference J2 (at 0 -3.81) (layer F.SilkS) hide
(effects (font (size 1.27 1.27) (thickness 0.2032)))
)
(fp_text value JUMP_2x1 (at 0 0) (layer F.SilkS) hide
263,12 → 265,12
)
)
 
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC977)
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 55126217) (tstamp 547EC977)
(at 5.08 -5.08)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /547E0CBD)
(fp_text reference P1 (at 0.1778 -0.0762) (layer F.SilkS)
(fp_text reference P1 (at 0.1778 -0.0762) (layer F.SilkS) hide
(effects (font (thickness 0.3048)))
)
(fp_text value _ (at 1.00076 5.00126) (layer F.SilkS) hide
279,12 → 281,12
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC97D)
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 5512621C) (tstamp 547EC97D)
(at 15.24 -5.08)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /547E0EDE)
(fp_text reference P2 (at 0.1778 -0.0762) (layer F.SilkS)
(fp_text reference P2 (at 0.1778 -0.0762) (layer F.SilkS) hide
(effects (font (thickness 0.3048)))
)
(fp_text value _ (at 1.00076 5.00126) (layer F.SilkS) hide
295,12 → 297,12
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC983)
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 55126201) (tstamp 547EC983)
(at 15.24 -25.4)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /547E0F11)
(fp_text reference P3 (at 0.1778 -0.0762) (layer F.SilkS)
(fp_text reference P3 (at 0.1778 -0.0762) (layer F.SilkS) hide
(effects (font (thickness 0.3048)))
)
(fp_text value _ (at 1.00076 5.00126) (layer F.SilkS) hide
311,12 → 313,12
(net 2 GND) (clearance 1) (zone_connect 2))
)
 
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC989)
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 551261F5) (tstamp 547EC989)
(at 5.08 -25.4)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /547E0F45)
(fp_text reference P4 (at 0.1778 -0.0762) (layer F.SilkS)
(fp_text reference P4 (at 0.1778 -0.0762) (layer F.SilkS) hide
(effects (font (thickness 0.3048)))
)
(fp_text value _ (at 1.00076 5.00126) (layer F.SilkS) hide
356,13 → 358,13
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9A3)
(at 18.669 -16.637 90)
(at 9.144 -11.303 180)
(path /547DF9D0)
(attr smd)
(fp_text reference R2 (at 0 0.3175 90) (layer B.SilkS)
(fp_text reference R2 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 0R (at 0.127 -0.381 90) (layer B.SilkS)
(fp_text value 0R (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
372,9 → 374,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 /A1))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 3 VDD))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
384,7 → 386,7
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9B0)
(at 18.669 -12.954 90)
(at 12.065 -10.414 90)
(path /547DF9FA)
(attr smd)
(fp_text reference R3 (at 0 0.3175 90) (layer B.SilkS)
412,13 → 414,13
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9BD)
(at 16.383 -16.51 90)
(at 9.144 -9.271 180)
(path /547DF710)
(attr smd)
(fp_text reference R4 (at 0 0.3175 90) (layer B.SilkS)
(fp_text reference R4 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 0R (at 0.127 -0.381 90) (layer B.SilkS)
(fp_text value 0R (at 0.127 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
428,9 → 430,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 7 /A2))
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 3 VDD))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
440,7 → 442,7
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9CA)
(at 16.383 -12.827 90)
(at 10.16 -6.477 90)
(path /547DFA35)
(attr smd)
(fp_text reference R5 (at 0 0.3175 90) (layer B.SilkS)
467,16 → 469,16
)
)
 
(module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 547EC9E7)
(at 9.906 -13.208 180)
(module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer B.Cu) (tedit 551255F1) (tstamp 55125207)
(at 10.16 -15.24 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /547DEEB9)
(attr smd)
(fp_text reference U1 (at 0 3.55 180) (layer B.SilkS)
(fp_text reference U1 (at 0 0 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value AS5048B (at 0 -3.55 180) (layer B.SilkS)
(fp_text value AS5048B (at -0.381 -0.127 270) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_line (start -3.95 2.8) (end -3.95 -2.8) (layer B.CrtYd) (width 0.05))
520,13 → 522,13
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED178)
(at 11.938 -20.193)
(at 10.16 -20.447 90)
(path /547ED127)
(attr smd)
(fp_text reference R6 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R6 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 0R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 0R (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
536,9 → 538,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 /SDA))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 3 VDD))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
548,13 → 550,13
)
 
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED185)
(at 17.145 -20.32)
(at 12.573 -20.447 90)
(path /547ED1C7)
(attr smd)
(fp_text reference R7 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R7 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 0R (at 0.127 -0.381) (layer B.SilkS)
(fp_text value 0R (at 0.127 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.15))
564,9 → 566,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 4 /SCL))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 3 VDD))
(model MLAB_3D/Resistors/chip_cms.wrl
(at (xyz 0 0 0))
575,54 → 577,300
)
)
 
(module Hrebinky:SMD_JUMP1X5 (layer B.Cu) (tedit 5512564D) (tstamp 547ED707)
(at 17.526 -15.494 180)
(path /547ED805)
(fp_text reference J3 (at 14.859 3.81 180) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(fp_text value JUMP_5X2 (at -0.127 6.477 180) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 1 smd rect (at 0 -4 180) (size 4 1.2) (layers B.Cu B.Paste B.Mask)
(net 2 GND))
(pad 2 smd rect (at 0 -2 180) (size 4 1.2) (layers B.Cu B.Paste B.Mask)
(net 3 VDD))
(pad 3 smd rect (at 0 0 180) (size 4 1.2) (layers B.Cu B.Paste B.Mask)
(net 4 /SCL))
(pad 4 smd rect (at 0 2 180) (size 4 1.2) (layers B.Cu B.Paste B.Mask)
(net 5 /SDA))
(pad 5 smd rect (at 0 4 180) (size 4 1.2) (layers B.Cu B.Paste B.Mask)
(net 6 /PWM))
)
 
(gr_text RPS01A (at 4.191 -15.748 90) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(gr_text MLAB (at 1.778 -15.748 90) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(gr_text PWM (at 19.558 -38.989) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text SDA (at 5.08 -38.989) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)))
)
(gr_text SCL (at 10.16 -32.258 90) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text VDD (at 7.747 -32.385 90) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text GND (at 19.939 -11.303) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text VDD (at 19.939 -13.462) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text SCL (at 19.812 -15.494) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text SDA (at 19.812 -17.526) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_text PWM (at 19.939 -19.431) (layer F.SilkS)
(effects (font (size 1.5 1.5) (thickness 0.3)) (justify right))
)
(gr_line (start 5.08 -5.08) (end 15.24 -25.4) (layer F.SilkS) (width 0.2))
(gr_line (start 15.113 -5.334) (end 5.08 -25.4) (layer F.SilkS) (width 0.2))
(gr_line (start 0.256 -0.256) (end 0.256 -40.384) (angle 90) (layer Edge.Cuts) (width 0.1))
(gr_line (start 0.256 -40.384) (end 20.064 -40.384) (angle 90) (layer Edge.Cuts) (width 0.1))
(gr_line (start 20.064 -40.384) (end 20.064 -0.256) (angle 90) (layer Edge.Cuts) (width 0.1))
(gr_line (start 0.256 -0.256) (end 20.064 -0.256) (angle 90) (layer Edge.Cuts) (width 0.1))
 
(segment (start 7.21 -15.89) (end 5.9205 -15.89) (width 0.3) (layer B.Cu) (net 1))
(segment (start 5.9205 -15.89) (end 4.191 -14.1605) (width 0.3) (layer B.Cu) (net 1))
(segment (start 4.4935 -13.858) (end 4.191 -14.1605) (width 0.254) (layer B.Cu) (net 1))
(segment (start 4.191 -14.1605) (end 4.191 -12.1285) (width 0.254) (layer B.Cu) (net 1))
(segment (start 6.956 -13.858) (end 4.4935 -13.858) (width 0.254) (layer B.Cu) (net 1))
(segment (start 4.4935 -13.858) (end 4.191 -14.1605) (width 0.254) (layer B.Cu) (net 1))
(segment (start 4.191 -16.0655) (end 1.905 -16.0655) (width 0.254) (layer B.Cu) (net 2))
(segment (start 4.191 -16.0655) (end 4.191 -17.526) (width 0.3) (layer B.Cu) (net 2))
(segment (start 4.191 -17.526) (end 4.572 -17.907) (width 0.3) (layer B.Cu) (net 2))
(via (at 4.572 -17.907) (size 0.889) (drill 0.635) (layers F.Cu B.Cu) (net 2))
(segment (start 1.905 -16.0655) (end 1.905 -17.018) (width 0.3) (layer B.Cu) (net 2))
(segment (start 1.905 -17.018) (end 2.794 -17.907) (width 0.3) (layer B.Cu) (net 2))
(via (at 2.794 -17.907) (size 0.889) (drill 0.635) (layers F.Cu B.Cu) (net 2))
(segment (start 12.7 -33.909) (end 12.7 -36.449) (width 0.3) (layer B.Cu) (net 2))
(segment (start 2.54 -33.909) (end 2.54 -36.449) (width 0.3) (layer B.Cu) (net 2))
(segment (start 4.191 -16.0655) (end 1.905 -16.0655) (width 0.3) (layer B.Cu) (net 2))
(segment (start 7.21 -16.54) (end 4.6655 -16.54) (width 0.3) (layer B.Cu) (net 2))
(segment (start 4.6655 -16.54) (end 4.191 -16.0655) (width 0.3) (layer B.Cu) (net 2))
(segment (start 4.318 -15.9385) (end 4.191 -16.0655) (width 0.254) (layer B.Cu) (net 2))
(segment (start 6.956 -14.508) (end 5.7485 -14.508) (width 0.254) (layer B.Cu) (net 2))
(segment (start 5.7485 -14.508) (end 4.318 -15.9385) (width 0.254) (layer B.Cu) (net 2))
(segment (start 7.62 -36.449) (end 7.62 -37.5285) (width 0.254) (layer B.Cu) (net 3))
(segment (start 7.62 -37.5285) (end 7.492999 -37.655501) (width 0.254) (layer B.Cu) (net 3))
(segment (start 7.492999 -37.655501) (end 1.409699 -37.655501) (width 0.254) (layer B.Cu) (net 3))
(segment (start 1.409699 -37.655501) (end 0.825499 -37.071301) (width 0.254) (layer B.Cu) (net 3))
(segment (start 0.825499 -37.071301) (end 0.825499 -14.986001) (width 0.254) (layer B.Cu) (net 3))
(segment (start 0.825499 -14.986001) (end 1.651 -14.1605) (width 0.254) (layer B.Cu) (net 3))
(segment (start 1.651 -14.1605) (end 1.905 -14.1605) (width 0.254) (layer B.Cu) (net 3))
(segment (start 6.956 -13.208) (end 5.977 -13.208) (width 0.254) (layer B.Cu) (net 3))
(segment (start 5.977 -13.208) (end 5.270501 -12.501501) (width 0.254) (layer B.Cu) (net 3))
(segment (start 5.270501 -12.501501) (end 5.270501 -11.379199) (width 0.254) (layer B.Cu) (net 3))
(segment (start 5.270501 -11.379199) (end 5.194301 -11.302999) (width 0.254) (layer B.Cu) (net 3))
(segment (start 5.194301 -11.302999) (end 3.187699 -11.302999) (width 0.254) (layer B.Cu) (net 3))
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