WebSVN – MLAB – /Modules/ Rev 3692 and /Modules/ Rev 3693 – Path Comparison

/Modules/AVR/AT32TQ14401A/SCH_PCB/AT32TQ14401A.kicad_pcb
2,11 → 2,11

(general
(links 348)
(no_connects 326)
(area 93.727199 42.698599 199.646457 141.426001)
(no_connects 304)
(area 93.727199 42.698599 197.966401 141.426001)
(thickness 1.6)
(drawings 5)
(tracks 114)
(tracks 319)
(zones 0)
(modules 159)
(nets 128)
53,8 → 53,8
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 1 1)
(pad_drill 0.6)
(pad_size 6 6)
(pad_drill 3)
(pad_to_mask_clearance 0)
(aux_axis_origin 0 0)
(grid_origin 81.28 152.4)
350,7 → 350,7
)

(net_class Power ""
(clearance 0.3)
(clearance 0.2)
(trace_width 0.3)
(via_dia 0.889)
(via_drill 0.635)
362,7 → 362,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88851)
(at 166.37 68.58 270)
(at 160.02 76.2 270)
(path /4AC4586E)
(attr smd)
(fp_text reference C1 (at 0 0.3175 270) (layer B.SilkS)
446,7 → 446,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88878)
(at 164.973 97.9424 270)
(at 164.973 100.4824 270)
(path /4AC45A1F)
(attr smd)
(fp_text reference C4 (at 0 0.3175 270) (layer B.SilkS)
474,7 → 474,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88885)
(at 161.1376 91.1606 270)
(at 162.56 91.2622 270)
(path /4AC45194)
(attr smd)
(fp_text reference C5 (at 0 0.3175 270) (layer B.SilkS)
558,13 → 558,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888AC)
(at 166.7002 75.8444)
(at 161.925 76.327 270)
(path /4AC45B4D)
(attr smd)
(fp_text reference C8 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C8 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 4u7 (at 0 -0.381) (layer B.SilkS)
(fp_text value 4u7 (at 0 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
574,9 → 574,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
586,7 → 586,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888B9)
(at 146.2278 107.1626)
(at 147.4978 107.0991)
(path /4AC451EC)
(attr smd)
(fp_text reference C9 (at 0 0.3175) (layer B.SilkS)
614,7 → 614,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53BE5E0A)
(at 175.514 129.286 270)
(at 156.3116 119.2784 270)
(path /53B8DA42)
(attr smd)
(fp_text reference C10 (at 0 0.3175 270) (layer B.SilkS)
642,7 → 642,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888D3)
(at 146.2278 105.1306)
(at 147.4978 105.0671)
(path /4AC451E6)
(attr smd)
(fp_text reference C11 (at 0 0.3175) (layer B.SilkS)
670,7 → 670,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888E0)
(at 143.7386 61.439)
(at 134.62 77.47)
(path /4AC44EF1)
(attr smd)
(fp_text reference C12 (at 0 0.3175) (layer B.SilkS)
698,7 → 698,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888ED)
(at 176.3014 84.1974)
(at 118.999 105.7275)
(path /4AC44EF8)
(attr smd)
(fp_text reference C13 (at 0 0.3175) (layer B.SilkS)
726,7 → 726,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B888FA)
(at 172.5422 84.1974)
(at 115.189 116.6495)
(path /4B16A2F6)
(attr smd)
(fp_text reference C14 (at 0 0.3175) (layer B.SilkS)
754,7 → 754,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88907)
(at 130.302 83.82 90)
(at 130.2512 82.9564 90)
(path /4AC451C3)
(attr smd)
(fp_text reference C15 (at 0 0.3175 90) (layer B.SilkS)
782,7 → 782,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88914)
(at 176.3014 86.4326)
(at 134.62 75.311)
(path /4B16A2FD)
(attr smd)
(fp_text reference C16 (at 0 0.3175) (layer B.SilkS)
810,7 → 810,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88921)
(at 162.5854 97.8662 270)
(at 162.5854 100.4062 270)
(path /4AC44EAD)
(attr smd)
(fp_text reference C17 (at 0 0.3175 270) (layer B.SilkS)
922,7 → 922,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88955)
(at 165.1254 91.2114 270)
(at 159.1564 100.7364 270)
(path /4AC44E98)
(attr smd)
(fp_text reference C21 (at 0 0.3175 270) (layer B.SilkS)
950,7 → 950,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88962)
(at 163.1188 91.186 270)
(at 164.5412 91.2876 270)
(path /4AC451DB)
(attr smd)
(fp_text reference C22 (at 0 0.3175 270) (layer B.SilkS)
1034,7 → 1034,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88989)
(at 128.27 83.82 90)
(at 128.2192 82.9564 90)
(path /4AC44E47)
(attr smd)
(fp_text reference C25 (at 0 0.3175 90) (layer B.SilkS)
1062,13 → 1062,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88996)
(at 165.1 58.42)
(at 166.243 76.2 270)
(path /4AC44F1E)
(attr smd)
(fp_text reference C26 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C26 (at 0 0.3175 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 100pF (at 0 -0.381) (layer B.SilkS)
(fp_text value 100pF (at 0 -0.381 270) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1078,9 → 1078,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1090,7 → 1090,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889A3)
(at 149.3012 113.6142)
(at 140.0048 109.1184)
(path /4AC4535F)
(attr smd)
(fp_text reference C27 (at 0 0.3175) (layer B.SilkS)
1118,13 → 1118,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889B0)
(at 149.1488 119.126)
(at 143.0528 109.22 180)
(path /4AC45356)
(attr smd)
(fp_text reference C28 (at 0 0.3175) (layer B.SilkS)
(fp_text reference C28 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 8pF (at 0 -0.381) (layer B.SilkS)
(fp_text value 8pF (at 0 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1134,9 → 1134,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 5 "Net-(C28-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1146,14 → 1146,14
)

(module SMD_Packages:SM1812 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889BD)
(at 180.848 117.856 180)
(at 168.8084 113.03)
(tags "CMS SM")
(path /53B891F7)
(attr smd)
(fp_text reference F1 (at -0.74676 0 450) (layer B.SilkS)
(fp_text reference F1 (at -0.74676 0 270) (layer B.SilkS)
(effects (font (size 1.016 0.762) (thickness 0.127)) (justify mirror))
)
(fp_text value FUSE (at 0.762 0 450) (layer B.SilkS)
(fp_text value FUSE (at 0.762 0 270) (layer B.SilkS)
(effects (font (size 1.016 0.762) (thickness 0.127)) (justify mirror))
)
(fp_circle (center -3.302 -2.159) (end -3.175 -2.032) (layer B.SilkS) (width 0.127))
1163,9 → 1163,9
(fp_line (start -1.524 2.032) (end -3.175 2.032) (layer B.SilkS) (width 0.127))
(fp_line (start -3.175 2.032) (end -3.175 -2.032) (layer B.SilkS) (width 0.127))
(fp_line (start -3.175 -2.032) (end -1.524 -2.032) (layer B.SilkS) (width 0.127))
(pad 1 smd rect (at -2.286 0 180) (size 1.397 3.81) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.286 0) (size 1.397 3.81) (layers B.Cu B.Paste B.Mask)
(net 19 "Net-(F1-Pad1)"))
(pad 2 smd rect (at 2.286 0 180) (size 1.397 3.81) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 2.286 0) (size 1.397 3.81) (layers B.Cu B.Paste B.Mask)
(net 6 +5V))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1174,8 → 1174,8
)
)

(module Connect:USB_B placed (layer F.Cu) (tedit 53B886C7) (tstamp 53BE5DFC)
(at 177.292 126.746)
(module Connect:USB_B placed (layer F.Cu) (tedit 53B886C7) (tstamp 53BF0ECF)
(at 158.0896 116.7384)
(tags USB)
(path /53B858EB)
(fp_text reference J33 (at 0 6.35) (layer F.SilkS)
1208,13 → 1208,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889D8)
(at 169.4942 61.4172)
(at 165.3286 64.6176 90)
(path /4B16A672)
(attr smd)
(fp_text reference R1 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R1 (at 0 0.3175 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 10k (at 0 -0.381) (layer B.SilkS)
(fp_text value 10k (at 0 -0.381 90) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1224,9 → 1224,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 3V3))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 9 "Net-(CON1-Pad6)"))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1264,13 → 1264,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889F2)
(at 161.671 111.1758 270)
(at 154.0002 112.6998)
(path /4ACAADCA)
(attr smd)
(fp_text reference R4 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R4 (at 0 0.3175) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 33 (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 33 (at 0 -0.381) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1280,9 → 1280,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 10 "Net-(R4-Pad1)"))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 8 "Net-(J33-Pad3)"))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1292,13 → 1292,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B889FF)
(at 163.6522 111.1758 270)
(at 154.0002 110.8583)
(path /4ACAADD3)
(attr smd)
(fp_text reference R5 (at 0 0.3175 270) (layer B.SilkS)
(fp_text reference R5 (at 0 0.3175) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 33 (at 0 -0.381 270) (layer B.SilkS)
(fp_text value 33 (at 0 -0.381) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1308,9 → 1308,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 11 "Net-(R5-Pad1)"))
(pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 7 "Net-(J33-Pad2)"))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1320,13 → 1320,13
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53B886C5) (tstamp 53B88A0C)
(at 170.18 102.616)
(at 119.0244 107.696 180)
(path /4ACAC091)
(attr smd)
(fp_text reference R6 (at 0 0.3175) (layer B.SilkS)
(fp_text reference R6 (at 0 0.3175 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_text value 1k5 (at 0 -0.381) (layer B.SilkS)
(fp_text value 1k5 (at 0 -0.381 180) (layer B.SilkS)
(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror))
)
(fp_circle (center -1.651 -0.762) (end -1.651 -0.635) (layer B.SilkS) (width 0.09906))
1336,9 → 1336,9
(fp_line (start 0.508 0.762) (end 1.524 0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.09906))
(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.09906))
(pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 12 "Net-(J41-Pad1)"))
(pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
(net 13 3V3))
(model smd/chip_cms.wrl
(at (xyz 0 0 0))
1665,14 → 1665,14
)

(module Crystals:Crystal_HC49-U_Vertical placed (layer F.Cu) (tedit 53B886C6) (tstamp 53B88AE5)
(at 146.0754 116.2304 270)
(at 141.5288 107.442)
(descr "Crystal, Quarz, HC49/U, vertical, stehend,")
(tags "Crystal, Quarz, HC49/U, vertical, stehend,")
(path /53BE60D1)
(fp_text reference X1 (at 0 -3.81 270) (layer F.SilkS)
(fp_text reference X1 (at 0 -3.81) (layer F.SilkS)
(effects (font (thickness 0.3048)))
)
(fp_text value 12MHz (at 0 3.81 270) (layer F.SilkS) hide
(fp_text value 12MHz (at 0 3.81) (layer F.SilkS) hide
(effects (font (thickness 0.3048)))
)
(fp_line (start 4.699 -1.00076) (end 4.89966 -0.59944) (layer F.SilkS) (width 0.381))
1726,14 → 1726,14
(fp_line (start 3.2512 2.32918) (end 3.6703 2.29108) (layer F.SilkS) (width 0.381))
(fp_line (start 3.6703 2.29108) (end 4.16052 2.1209) (layer F.SilkS) (width 0.381))
(fp_line (start -3.2004 -2.32918) (end 3.2512 -2.32918) (layer F.SilkS) (width 0.381))
(pad 1 thru_hole circle (at -2.44094 0 270) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at -2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(net 4 "Net-(C27-Pad1)"))
(pad 2 thru_hole circle (at 2.44094 0 270) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at 2.44094 0) (size 1.50114 1.50114) (drill 0.8001) (layers .Cu .Mask F.SilkS)
(net 5 "Net-(C28-Pad1)"))
)

(module Pin_Headers:Pin_Header_Straight_2x05 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB18C4)
(at 181.102 59.182 90)
(at 169.0116 63.2206 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B89425)
1777,15 → 1777,15
)

(module "SMD_Packages:DO-214AC(SMA)" placed (layer B.Cu) (tedit 53BB12B6) (tstamp 53BB18DC)
(at 168.0718 110.8456 90)
(at 176.1236 112.9792 180)
(descr "DO-214AC (SMA) PACKAGE.")
(tags "DO-214AC SMA")
(path /53BB093C/53275986)
(attr smd)
(fp_text reference D1 (at 0 2.60096 90) (layer B.SilkS)
(fp_text reference D1 (at 0 2.60096 180) (layer B.SilkS)
(effects (font (size 1.00076 1.00076) (thickness 0.11938)) (justify mirror))
)
(fp_text value DIODE (at 0 -2.79908 90) (layer B.SilkS)
(fp_text value DIODE (at 0 -2.79908 180) (layer B.SilkS)
(effects (font (size 1.00076 1.00076) (thickness 0.11938)) (justify mirror))
)
(fp_line (start -0.762 0) (end -0.9652 0) (layer B.SilkS) (width 0.127))
1806,9 → 1806,9
(fp_line (start -0.127 0) (end -0.127 -0.3175) (layer B.SilkS) (width 0.127))
(fp_line (start -0.127 -0.3175) (end 0.03048 -0.47498) (layer B.SilkS) (width 0.127))
(fp_line (start -0.127 0) (end 0.98298 0) (layer B.SilkS) (width 0.127))
(pad 1 smd rect (at -1.89992 0 90) (size 1.6002 2.19964) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -1.89992 0 180) (size 1.6002 2.19964) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(pad 2 smd rect (at 1.89992 0 90) (size 1.6002 2.19964) (layers B.Cu B.Paste B.Mask)
(pad 2 smd rect (at 1.89992 0 180) (size 1.6002 2.19964) (layers B.Cu B.Paste B.Mask)
(net 6 +5V))
(model smd/do214.wrl
(at (xyz 0 0 0))
1818,7 → 1818,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB18E6)
(at 125.966 131.822)
(at 128.9558 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1CB)
1844,7 → 1844,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB18F0)
(at 158.986 131.822)
(at 146.4818 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1D1)
1870,7 → 1870,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB18FA)
(at 141.206 131.822)
(at 136.5758 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B273)
1896,7 → 1896,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1904)
(at 128.506 131.822)
(at 131.2418 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B279)
1922,7 → 1922,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB190E)
(at 133.586 131.822)
(at 133.7818 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1BF)
1948,7 → 1948,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1918)
(at 192.532 80.772 90)
(at 173.0756 86.868 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1C5)
1974,7 → 1974,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1922)
(at 192.532 78.232 90)
(at 184.0484 86.106 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1E3)
2000,7 → 2000,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB192C)
(at 192.532 65.532 90)
(at 173.0756 79.248 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1E9)
2026,7 → 2026,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1936)
(at 192.532 62.992 90)
(at 184.0484 78.486 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1D7)
2052,7 → 2052,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1940)
(at 192.532 60.452 90)
(at 173.0756 76.708 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1DD)
2078,7 → 2078,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB194A)
(at 192.532 57.912 90)
(at 184.0484 75.946 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1FB)
2104,7 → 2104,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1954)
(at 192.532 68.072 90)
(at 184.0484 81.026 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B201)
2130,7 → 2130,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB195E)
(at 192.532 70.612 90)
(at 173.0756 81.788 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1EF)
2156,7 → 2156,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1968)
(at 192.532 73.152 90)
(at 184.0484 83.566 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1F5)
2182,7 → 2182,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1972)
(at 192.532 75.692 90)
(at 173.0756 84.328 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B213)
2208,7 → 2208,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB197C)
(at 192.532 101.092 90)
(at 173.0756 97.028 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B219)
2234,7 → 2234,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1986)
(at 185.674 49.276)
(at 161.29 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B207)
2260,7 → 2260,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1990)
(at 183.134 49.276 180)
(at 162.814 59.309 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B20D)
2286,7 → 2286,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB199A)
(at 192.532 103.632 90)
(at 184.0484 98.806 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B21F)
2312,7 → 2312,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19A4)
(at 192.532 106.172 90)
(at 173.0756 99.568 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B225)
2338,7 → 2338,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19AE)
(at 192.532 116.332 90)
(at 173.0756 104.648 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B237)
2364,7 → 2364,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19B8)
(at 192.532 121.412 90)
(at 173.0756 107.188 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B23D)
2390,7 → 2390,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19C2)
(at 192.532 123.952 90)
(at 184.0484 108.966 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B22B)
2416,7 → 2416,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19CC)
(at 192.532 118.872 90)
(at 184.0484 106.426 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B231)
2442,7 → 2442,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19D6)
(at 192.532 108.712 90)
(at 184.0484 101.346 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B24F)
2468,7 → 2468,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19E0)
(at 192.532 98.552 270)
(at 184.0484 96.266 270)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B255)
2494,7 → 2494,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19EA)
(at 192.532 90.932 90)
(at 173.0756 91.948 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B243)
2520,7 → 2520,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19F4)
(at 192.532 96.012 90)
(at 173.0756 94.488 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B249)
2546,7 → 2546,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB19FE)
(at 192.532 93.472 90)
(at 184.0484 93.726 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B267)
2572,7 → 2572,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A08)
(at 156.446 131.822)
(at 144.1958 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B26D)
2598,7 → 2598,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A12)
(at 192.532 88.392 90)
(at 184.0484 91.186 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B25B)
2624,7 → 2624,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A1C)
(at 192.532 85.852 90)
(at 173.0756 89.408 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B261)
2650,7 → 2650,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A26)
(at 164.066 131.822)
(at 149.0218 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D46C)
2676,7 → 2676,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A30)
(at 161.526 131.822)
(at 146.7358 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D472)
2702,7 → 2702,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A3A)
(at 146.286 131.822)
(at 139.1158 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D48A)
2728,7 → 2728,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A44)
(at 148.826 131.822)
(at 141.4018 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D490)
2754,7 → 2754,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A4E)
(at 180.594 49.276 180)
(at 158.75 68.58 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D47E)
2780,7 → 2780,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A58)
(at 178.054 49.276)
(at 160.274 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8D484)
2806,7 → 2806,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A62)
(at 120.886 131.822)
(at 126.4158 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDB7)
2832,7 → 2832,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A6C)
(at 153.906 131.822)
(at 143.9418 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDBD)
2858,7 → 2858,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A76)
(at 151.366 131.822)
(at 141.6558 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDAB)
2883,8 → 2883,8
)
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A80)
(at 166.606 131.822)
(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BFFB75)
(at 149.2758 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDB1)
2910,7 → 2910,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A8A)
(at 192.532 113.792 270)
(at 184.0484 103.886 270)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDCF)
2936,7 → 2936,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A94)
(at 192.532 111.252 90)
(at 173.0756 102.108 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDD5)
2962,7 → 2962,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1A9E)
(at 192.532 83.312 90)
(at 184.0484 88.646 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDC3)
2988,7 → 2988,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AA8)
(at 143.746 131.822)
(at 138.8618 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDC9)
3014,7 → 3014,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AB2)
(at 138.666 131.822)
(at 136.3218 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDE7)
3040,7 → 3040,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1ABC)
(at 136.126 131.822)
(at 134.0358 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDED)
3066,7 → 3066,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AC6)
(at 131.046 131.822)
(at 131.4958 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDDB)
3092,7 → 3092,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AD0)
(at 123.426 131.822)
(at 128.7018 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8CDE1)
3118,7 → 3118,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1ADA)
(at 101.6 85.09 90)
(at 110.1344 82.169 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B117)
3144,7 → 3144,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AE4)
(at 101.6 74.93 90)
(at 110.1344 77.089 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B11D)
3170,7 → 3170,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AEE)
(at 101.6 67.31 90)
(at 120.2944 74.549 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B10B)
3196,7 → 3196,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1AF8)
(at 101.6 64.77 90)
(at 110.1344 72.009 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B111)
3222,7 → 3222,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B02)
(at 101.6 72.39 90)
(at 120.2944 77.089 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B12F)
3248,7 → 3248,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B0C)
(at 101.6 77.47 90)
(at 120.2944 79.629 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B135)
3274,7 → 3274,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B16)
(at 101.6 90.17 90)
(at 110.1344 84.709 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B123)
3300,7 → 3300,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B20)
(at 101.6 87.63 90)
(at 120.2944 84.709 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B129)
3326,7 → 3326,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B2A)
(at 101.6 97.79 90)
(at 120.2944 89.789 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B147)
3352,7 → 3352,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B34)
(at 101.6 100.33 90)
(at 110.1344 89.789 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B14D)
3378,7 → 3378,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B3E)
(at 101.6 125.73 90)
(at 110.1344 102.489 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B13B)
3404,7 → 3404,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B48)
(at 101.6 59.69 90)
(at 110.1344 69.469 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B141)
3430,7 → 3430,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B52)
(at 113.266 131.822)
(at 123.6218 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B15F)
3456,7 → 3456,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B5C)
(at 115.806 131.822)
(at 123.8758 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B165)
3482,7 → 3482,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B66)
(at 101.6 57.15 270)
(at 120.2944 69.469 270)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B153)
3508,7 → 3508,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B70)
(at 101.6 118.11 90)
(at 120.2944 99.949 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B159)
3534,7 → 3534,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B7A)
(at 118.346 131.822)
(at 126.1618 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B16B)
3560,7 → 3560,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B84)
(at 139.954 49.276)
(at 138.43 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B171)
3586,7 → 3586,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B8E)
(at 142.494 49.276)
(at 142.494 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B183)
3612,7 → 3612,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1B98)
(at 110.726 131.822)
(at 121.3358 113.2078)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B189)
3638,7 → 3638,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BA2)
(at 119.634 49.276)
(at 128.27 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B177)
3664,7 → 3664,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BAC)
(at 137.414 49.276)
(at 139.954 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B17D)
3690,7 → 3690,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BB6)
(at 115.951 49.403 180)
(at 129.794 59.309 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B19B)
3716,7 → 3716,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BC0)
(at 145.034 49.276)
(at 140.97 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1A1)
3742,7 → 3742,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BCA)
(at 147.574 49.276)
(at 145.034 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B18F)
3768,7 → 3768,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BD4)
(at 162.814 49.276)
(at 152.654 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B195)
3794,7 → 3794,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BDE)
(at 157.734 49.276 180)
(at 150.114 59.309 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1B3)
3820,7 → 3820,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BE8)
(at 155.194 49.276)
(at 146.05 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1B9)
3846,7 → 3846,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BF2)
(at 160.274 49.276)
(at 148.59 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1A7)
3872,7 → 3872,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1BFC)
(at 167.894 49.276)
(at 155.194 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B1AD)
3898,7 → 3898,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C06)
(at 172.974 49.276 180)
(at 157.734 59.309 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B063)
3924,7 → 3924,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C10)
(at 175.514 49.276)
(at 156.21 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B069)
3950,7 → 3950,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C1A)
(at 165.354 49.276 180)
(at 151.13 68.58 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B028)
3976,7 → 3976,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C24)
(at 170.434 49.276 180)
(at 153.67 68.58 180)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B03A)
4002,7 → 4002,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C2E)
(at 101.6 69.85 90)
(at 110.1344 74.549 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B07B)
4028,7 → 4028,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C38)
(at 101.6 123.19 90)
(at 120.2944 102.489 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B081)
4054,7 → 4054,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C42)
(at 101.6 107.95 90)
(at 120.2944 94.869 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B06F)
4080,7 → 4080,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C4C)
(at 101.6 105.41 90)
(at 110.1344 92.329 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B075)
4106,7 → 4106,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C56)
(at 101.6 95.25 90)
(at 110.1344 87.249 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B093)
4132,7 → 4132,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C60)
(at 101.6 92.71 90)
(at 120.2944 87.249 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B099)
4158,7 → 4158,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C6A)
(at 108.186 131.822)
(at 121.0818 123.571)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B087)
4184,7 → 4184,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C74)
(at 113.411 49.403)
(at 125.73 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B08D)
4210,7 → 4210,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C7E)
(at 108.331 49.403)
(at 124.714 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0AB)
4236,7 → 4236,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C88)
(at 152.654 49.276)
(at 147.574 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0B1)
4262,7 → 4262,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C92)
(at 101.6 62.23 90)
(at 120.2944 72.009 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B09F)
4288,7 → 4288,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1C9C)
(at 110.871 49.403)
(at 127.254 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0A5)
4314,7 → 4314,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CA6)
(at 122.174 49.276)
(at 132.334 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0B7)
4340,7 → 4340,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CB0)
(at 101.6 120.65 90)
(at 110.1344 99.949 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0BD)
4366,7 → 4366,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CBA)
(at 101.6 115.57 90)
(at 110.1344 97.409 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0CF)
4392,7 → 4392,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CC4)
(at 101.6 110.49 90)
(at 110.1344 94.869 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0D5)
4418,7 → 4418,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CCE)
(at 124.714 49.276)
(at 130.81 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0C3)
4444,7 → 4444,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CD8)
(at 129.794 49.276)
(at 133.35 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0C9)
4470,7 → 4470,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CE2)
(at 150.114 49.276)
(at 143.51 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0E7)
4496,7 → 4496,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CEC)
(at 101.6 113.03 270)
(at 120.2944 97.409 270)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0ED)
4522,7 → 4522,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1CF6)
(at 101.6 102.87 90)
(at 120.2944 92.329 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0DB)
4548,7 → 4548,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D00)
(at 134.874 49.276)
(at 135.89 68.58)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0E1)
4574,7 → 4574,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D0A)
(at 132.334 49.276)
(at 137.414 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0FF)
4600,7 → 4600,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D14)
(at 127.254 49.276)
(at 134.874 59.309)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B105)
4626,7 → 4626,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D1E)
(at 101.6 80.01 90)
(at 110.1344 79.629 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0F3)
4652,7 → 4652,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D28)
(at 101.6 82.55 90)
(at 120.2944 82.169 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53B8B0F9)
4678,7 → 4678,7
)

(module MLAB_Jumpery:Pin_Header_Straight_2x03 placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D38)
(at 173.0502 110.617 90)
(at 171.9072 120.9548 90)
(descr "1 pin")
(tags "CONN DEV")
(path /53BB093C/5324F25A)
4714,7 → 4714,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53BB12B6) (tstamp 53BB1D45)
(at 182.372 121.92)
(at 163.1696 111.9124)
(path /53B8912D)
(attr smd)
(fp_text reference L1 (at 0 0.3175) (layer B.SilkS)
4741,8 → 4741,8
)
)

(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D4B)
(at 101.6 50.8)
(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 53BFFC78) (tstamp 53BB1D4B)
(at 111.76 60.96)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /53BB093C/53272432)
4758,7 → 4758,7
)

(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BE5B70)
(at 101.6 132.08)
(at 111.76 121.92)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /53BB093C/53272446)
4774,7 → 4774,7
)

(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D57)
(at 193.04 50.8)
(at 182.88 60.96)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /53BB093C/5327245A)
4790,7 → 4790,7
)

(module MLAB_Mechanical:MountingHole_3mm placed (layer F.Cu) (tedit 53BB12B8) (tstamp 53BB1D5D)
(at 193.04 132.08)
(at 182.88 121.92)
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
(path /53BB093C/5327246E)
4806,7 → 4806,7
)

(module SMD_Packages:SM0805 placed (layer B.Cu) (tedit 53BB12B6) (tstamp 53BE5DED)
(at 177.546 129.286 270)
(at 158.3436 119.2784 270)
(path /53B8DA6A)
(attr smd)
(fp_text reference R2 (at 0 0.3175 270) (layer B.SilkS)
4833,13 → 4833,13
)
)

(module Discret:SW_PUSH_SMALL placed (layer F.Cu) (tedit 53BB12B9) (tstamp 53BB1D77)
(at 156.21 64.77)
(module Discret:SW_PUSH_SMALL placed (layer F.Cu) (tedit 53BFFE8B) (tstamp 53BB1D77)
(at 176.4792 69.2912 270)
(path /4ACC4792)
(fp_text reference S1 (at 0 -0.762) (layer F.SilkS)
(fp_text reference S1 (at 0 -0.762 270) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)))
)
(fp_text value SW_PUSH (at 0 1.016) (layer F.SilkS)
(fp_text value SW_PUSH (at 0 1.016 360) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)))
)
(fp_circle (center 0 0) (end 0 -2.54) (layer F.SilkS) (width 0.127))
4847,23 → 4847,23
(fp_line (start 3.81 -3.81) (end 3.81 3.81) (layer F.SilkS) (width 0.127))
(fp_line (start 3.81 3.81) (end -3.81 3.81) (layer F.SilkS) (width 0.127))
(fp_line (start -3.81 -3.81) (end -3.81 3.81) (layer F.SilkS) (width 0.127))
(pad 1 thru_hole circle (at 3.81 -2.54) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at 3.81 -2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 1 GND))
(pad 2 thru_hole circle (at 3.81 2.54) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at 3.81 2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 9 "Net-(CON1-Pad6)"))
(pad 1 thru_hole circle (at -3.81 -2.54) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at -3.81 -2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 1 GND))
(pad 2 thru_hole circle (at -3.81 2.54) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at -3.81 2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 9 "Net-(CON1-Pad6)"))
)

(module Discret:SW_PUSH_SMALL placed (layer F.Cu) (tedit 53BB12B9) (tstamp 53BB1D84)
(at 173.99 69.596 90)
(module Discret:SW_PUSH_SMALL placed (layer F.Cu) (tedit 53BFF936) (tstamp 53BB1D84)
(at 113.03 110.6932 270)
(path /4ACC4781)
(fp_text reference S2 (at 0 -0.762 90) (layer F.SilkS)
(fp_text reference S2 (at 0 -0.762 270) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)))
)
(fp_text value SW_PUSH (at 0 1.016 90) (layer F.SilkS)
(fp_text value SW_PUSH (at 0 1.016 450) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)))
)
(fp_circle (center 0 0) (end 0 -2.54) (layer F.SilkS) (width 0.127))
4871,26 → 4871,26
(fp_line (start 3.81 -3.81) (end 3.81 3.81) (layer F.SilkS) (width 0.127))
(fp_line (start 3.81 3.81) (end -3.81 3.81) (layer F.SilkS) (width 0.127))
(fp_line (start -3.81 -3.81) (end -3.81 3.81) (layer F.SilkS) (width 0.127))
(pad 1 thru_hole circle (at 3.81 -2.54 90) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at 3.81 -2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 12 "Net-(J41-Pad1)"))
(pad 2 thru_hole circle (at 3.81 2.54 90) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at 3.81 2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 1 GND))
(pad 1 thru_hole circle (at -3.81 -2.54 90) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 1 thru_hole circle (at -3.81 -2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 12 "Net-(J41-Pad1)"))
(pad 2 thru_hole circle (at -3.81 2.54 90) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(pad 2 thru_hole circle (at -3.81 2.54 270) (size 1.397 1.397) (drill 0.8128) (layers .Cu .Mask F.SilkS)
(net 1 GND))
)

(module SMD_Packages:SOT223 placed (layer B.Cu) (tedit 53BB12B6) (tstamp 53BB1D94)
(at 179.8828 110.109 180)
(at 162.56 106.0196 270)
(descr "module CMS SOT223 4 pins")
(tags "CMS SOT")
(path /53BB093C/5324EDA7)
(attr smd)
(fp_text reference U2 (at 0 0.762 180) (layer B.SilkS)
(fp_text reference U2 (at 0 0.762 270) (layer B.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)) (justify mirror))
)
(fp_text value NCP1117ST18T3G (at 0 -0.762 180) (layer B.SilkS)
(fp_text value NCP1117ST18T3G (at 0 -0.762 270) (layer B.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.2032)) (justify mirror))
)
(fp_line (start -3.556 -1.524) (end -3.556 -4.572) (layer B.SilkS) (width 0.2032))
4901,12 → 4901,12
(fp_line (start -2.032 4.572) (end 2.032 4.572) (layer B.SilkS) (width 0.2032))
(fp_line (start 2.032 4.572) (end 3.556 2.286) (layer B.SilkS) (width 0.2032))
(fp_line (start 3.556 2.286) (end 3.556 1.524) (layer B.SilkS) (width 0.2032))
(pad 4 smd rect (at 0 3.302 180) (size 3.6576 2.032) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at 0 -3.302 180) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(pad 4 smd rect (at 0 3.302 270) (size 3.6576 2.032) (layers B.Cu B.Paste B.Mask))
(pad 2 smd rect (at 0 -3.302 270) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(net 13 3V3))
(pad 3 smd rect (at 2.286 -3.302 180) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(pad 3 smd rect (at 2.286 -3.302 270) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(net 6 +5V))
(pad 1 smd rect (at -2.286 -3.302 180) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(pad 1 smd rect (at -2.286 -3.302 270) (size 1.016 2.032) (layers B.Cu B.Paste B.Mask)
(net 1 GND))
(model smd/SOT223.wrl
(at (xyz 0 0 0))
4915,125 → 4915,330
)
)

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(gr_line (start 197.8914 141.351) (end 93.8022 141.351) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 197.8914 42.7736) (end 197.8914 141.351) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 93.8022 42.7736) (end 197.8914 42.7736) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 115.824 52.9336) (end 115.8494 52.9336) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 106.68 141.351) (end 106.68 42.7736) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 197.8914 127) (end 93.8022 127) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 187.96 42.7736) (end 187.96 141.351) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 93.8022 55.88) (end 197.8914 55.88) (angle 90) (layer Edge.Cuts) (width 0.15))
(gr_line (start 136.398 63.9826) (end 136.4234 63.9826) (angle 90) (layer Edge.Cuts) (width 0.15))

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 /Modules/PowerSupply/SYMPOWER01A/SCH_PCB/sympower-cache.lib
 ,0 → 1,201
+EESchema-LIBRARY Version 2.3
+#encoding utf-8
+#
+# AGND
+#
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+DRAW
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+X AGND 1 0 0 0 U 40 40 1 1 W N
+ENDDRAW
+ENDDEF
+#
+# C
+#
+DEF C C 0 10 N Y 1 F N
+F0 "C" 0 100 40 H V L CNN
+F1 "C" 6 -85 40 H V L CNN
+F2 "" 38 -150 30 H V C CNN
+F3 "" 0 0 60 H V C CNN
+$FPLIST
+ SM*
+ C?
+ C1-1
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+DRAW
+P 2 0 1 20  -80 -30  80 -30 N
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+X ~ 1 0 200 170 D 40 40 1 1 P
+X ~ 2 0 -200 170 U 40 40 1 1 P
+ENDDRAW
+ENDDEF
+#
+# CONN_2
+#
+DEF CONN_2 P 0 40 Y N 1 F N
+F0 "P" -50 0 40 V V C CNN
+F1 "CONN_2" 50 0 40 V V C CNN
+F2 "" 0 0 60 H V C CNN
+F3 "" 0 0 60 H V C CNN
+DRAW
+S -100 150 100 -150 0 1 0 N
+X P1 1 -350 100 250 R 60 60 1 1 P I
+X PM 2 -350 -100 250 R 60 60 1 1 P I
+ENDDRAW
+ENDDEF
+#
+# CP1
+#
+DEF CP1 C 0 10 N N 1 F N
+F0 "C" 50 100 50 H V L CNN
+F1 "CP1" 50 -100 50 H V L CNN
+F2 "" 0 0 60 H V C CNN
+F3 "" 0 0 60 H V C CNN
+$FPLIST
+ CP*
+ SM*
+$ENDFPLIST
+DRAW
+T 0 -50 100 80 0 0 0 +  Normal 0 C C
+A 0 -200 180 563 1236 0 1 15 N 100 -50 -100 -50
+P 4 0 1 15  -100 50  100 50  50 50  50 50 N
+X ~ 1 0 200 150 D 40 40 1 1 P
+X ~ 2 0 -200 180 U 40 40 1 1 P
+ENDDRAW
+ENDDEF
+#
+# DIODESCH
+#
+DEF DIODESCH D 0 40 N N 1 F N
+F0 "D" 0 100 40 H V C CNN
+F1 "DIODESCH" 0 -100 40 H V C CNN
+F2 "" 0 0 60 H V C CNN
+F3 "" 0 0 60 H V C CNN
+$FPLIST
+ D?
+ S*
+$ENDFPLIST
+DRAW
+P 3 0 1 0  -50 50  50 0  -50 -50 F
+P 6 0 1 8  75 25  75 50  50 50  50 -50  25 -50  25 -25 N
+X A 1 -200 0 150 R 40 40 1 1 P
+X K 2 200 0 150 L 40 40 1 1 P
+ENDDRAW
+ENDDEF
+#
+# GND
+#
+DEF ~GND #PWR 0 0 Y Y 1 F P
+F0 "#PWR" 0 0 30 H I C CNN
+F1 "GND" 0 -70 30 H I C CNN
+F2 "" 0 0 60 H V C CNN
+F3 "" 0 0 60 H V C CNN
+DRAW
+P 4 0 1 0  -50 0  0 -50  50 0  -50 0 N
+X GND 1 0 0 0 U 30 30 1 1 W N
+ENDDRAW
+ENDDEF
+#
+# LT3439
+#
+DEF LT3439 U 0 40 Y Y 1 F N
+F0 "U" -500 300 60 H V L CNN
+F1 "LT3439" 150 -825 60 H V L CNN
+F2 "" 0 0 60 H V C CNN
+F3 "" 0 0 60 H V C CNN
+DRAW
+S -500 250 350 -750 0 1 0 N
+X PGND 1 -100 -1000 250 U 50 50 1 1 W
+X COLA 3 600 -100 250 L 50 50 1 1 O
+X Rsl 4 600 -550 250 L 50 50 1 1 P
+X SYNC 5 -750 -150 250 R 50 50 1 1 P
+X Ct 6 -750 -250 250 R 50 50 1 1 P
+X Rt 7 -750 -350 250 R 50 50 1 1 P
+X GND 10 -200 -1000 250 U 50 50 1 1 W
+X SHDN 11 -750 50 250 R 50 50 1 1 I I
+X VIN 13 -50 500 250 D 50 50 1 1 W
+X COLB 14 600 -250 250 L 50 50 1 1 O
+X PGND 16 0 -1000 250 U 50 50 1 1 W
+ENDDRAW
+ENDDEF
+#
+# R
+#
+DEF R R 0 0 N Y 1 F N
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+F1 "R" 7 1 40 V V C CNN
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+X OUT2B 7 400 -400 300 L 60 60 1 1 P
+ENDDRAW
+ENDDEF
+#
+# VCC
+#
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+F1 "VCC" 0 100 30 H V C CNN
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+F3 "" 0 0 60 H V C CNN
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+#End Library

 /Modules/PowerSupply/SYMPOWER01A/SCH_PCB/sympower.bak
 ,0 → 1,426
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 /Modules/PowerSupply/SYMPOWER01A/SCH_PCB/sympower.pro
 ,0 → 1,89
+update=Sat 12 Jul 2014 17:20:48 CEST
+version=1
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+LibName30=regul

 /Modules/PowerSupply/SYMPOWER01A/SCH_PCB/sympower.sch
 ,0 → 1,426
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Subversion Repositories – MLAB

/Modules/ @ 3692 → /Modules/ @ 3693

Compare Path:	Rev
With Path:	Rev