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(kicad_pcb (version 4) (host pcbnew "(2014-08-29 BZR 5106)-product") |
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) |
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|
| 176 |
(module Hrebinky:Pin_Header_Straight_2x05 placed (layer F.Cu) (tedit 53F5A718) (tstamp 547EC957) |
178 |
(module Hrebinky:Pin_Header_Straight_2x05 placed (layer F.Cu) (tedit 55125659) (tstamp 547EC957) |
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(at 7.62 -35.179 180) |
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|
| 240 |
(module Hrebinky:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 5472F1F7) (tstamp 547EC961) |
242 |
(module Hrebinky:Pin_Header_Straight_2x01 placed (layer F.Cu) (tedit 55125655) (tstamp 547EC961) |
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(at 17.145 -35.179) |
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(descr "1 pin") |
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(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC977) |
268 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 55126217) (tstamp 547EC977) |
| 267 |
(at 5.08 -5.08) |
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(at 5.08 -5.08) |
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(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(net 2 GND) (clearance 1) (zone_connect 2)) |
| 280 |
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) |
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|
283 |
|
| 282 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC97D) |
284 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 5512621C) (tstamp 547EC97D) |
| 283 |
(at 15.24 -5.08) |
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(at 15.24 -5.08) |
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(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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297 |
(net 2 GND) (clearance 1) (zone_connect 2)) |
| 296 |
) |
298 |
) |
| 297 |
|
299 |
|
| 298 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC983) |
300 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 55126201) (tstamp 547EC983) |
| 299 |
(at 15.24 -25.4) |
301 |
(at 15.24 -25.4) |
| 300 |
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
302 |
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
| 301 |
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
303 |
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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|
315 |
|
| 314 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 54345FDC) (tstamp 547EC989) |
316 |
(module Dira:MountingHole_3mm placed (layer F.Cu) (tedit 551261F5) (tstamp 547EC989) |
| 315 |
(at 5.08 -25.4) |
317 |
(at 5.08 -25.4) |
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(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
318 |
(descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
| 317 |
(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,") |
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(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9A3) |
360 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9A3) |
| 359 |
(at 18.669 -16.637 90) |
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(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9B0) |
388 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9B0) |
| 387 |
(at 18.669 -12.954 90) |
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(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9BD) |
416 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9BD) |
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(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15)) |
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(pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask) |
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(net 7 /A2)) |
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(net 7 /A2)) |
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(pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask) |
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(pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask) |
| 434 |
(net 3 VDD)) |
436 |
(net 3 VDD)) |
| 435 |
(model MLAB_3D/Resistors/chip_cms.wrl |
437 |
(model MLAB_3D/Resistors/chip_cms.wrl |
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(at (xyz 0 0 0)) |
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(at (xyz 0 0 0)) |
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(scale (xyz 0.1 0.1 0.1)) |
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(scale (xyz 0.1 0.1 0.1)) |
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(rotate (xyz 0 0 0)) |
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(rotate (xyz 0 0 0)) |
| 439 |
) |
441 |
) |
| 440 |
) |
442 |
) |
| 441 |
|
443 |
|
| 442 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9CA) |
444 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547EC9CA) |
| 443 |
(at 16.383 -12.827 90) |
445 |
(at 10.16 -6.477 90) |
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(path /547DFA35) |
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(path /547DFA35) |
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(attr smd) |
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(attr smd) |
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(fp_text reference R5 (at 0 0.3175 90) (layer B.SilkS) |
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(fp_text reference R5 (at 0 0.3175 90) (layer B.SilkS) |
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(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror)) |
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(effects (font (size 0.50038 0.50038) (thickness 0.10922)) (justify mirror)) |
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) |
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(scale (xyz 0.1 0.1 0.1)) |
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(rotate (xyz 0 0 0)) |
| 467 |
) |
469 |
) |
| 468 |
) |
470 |
) |
| 469 |
|
471 |
|
| 470 |
(module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77) (tstamp 547EC9E7) |
472 |
(module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer B.Cu) (tedit 551255F1) (tstamp 55125207) |
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(at 9.906 -13.208 180) |
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(at 10.16 -15.24 180) |
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(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)") |
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(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)") |
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(tags "SSOP 0.65") |
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(tags "SSOP 0.65") |
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(path /547DEEB9) |
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(rotate (xyz 0 0 0)) |
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) |
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) |
| 520 |
) |
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) |
| 521 |
|
523 |
|
| 522 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED178) |
524 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED178) |
| 523 |
(at 11.938 -20.193) |
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(at 10.16 -20.447 90) |
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(fp_line (start 1.524 0.762) (end 1.524 -0.762) (layer B.SilkS) (width 0.15)) |
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(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15)) |
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(fp_line (start 1.524 -0.762) (end 0.508 -0.762) (layer B.SilkS) (width 0.15)) |
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(net 5 /SDA)) |
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| 542 |
(net 3 VDD)) |
544 |
(net 3 VDD)) |
| 543 |
(model MLAB_3D/Resistors/chip_cms.wrl |
545 |
(model MLAB_3D/Resistors/chip_cms.wrl |
| 544 |
(at (xyz 0 0 0)) |
546 |
(at (xyz 0 0 0)) |
| 545 |
(scale (xyz 0.1 0.1 0.1)) |
547 |
(scale (xyz 0.1 0.1 0.1)) |
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(rotate (xyz 0 0 0)) |
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(rotate (xyz 0 0 0)) |
| 547 |
) |
549 |
) |
| 548 |
) |
550 |
) |
| 549 |
|
551 |
|
| 550 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED185) |
552 |
(module MLAB_R:SMD-0805 (layer B.Cu) (tedit 54799E0C) (tstamp 547ED185) |
| 551 |
(at 17.145 -20.32) |
553 |
(at 12.573 -20.447 90) |
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(path /547ED1C7) |
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(path /547ED1C7) |
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(net 4 /SCL)) |
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(net 4 /SCL)) |
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| 570 |
(net 3 VDD)) |
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(net 3 VDD)) |
| 571 |
(model MLAB_3D/Resistors/chip_cms.wrl |
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(model MLAB_3D/Resistors/chip_cms.wrl |
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(at (xyz 0 0 0)) |
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(at (xyz 0 0 0)) |
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(scale (xyz 0.1 0.1 0.1)) |
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(scale (xyz 0.1 0.1 0.1)) |
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(rotate (xyz 0 0 0)) |
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(rotate (xyz 0 0 0)) |
| 575 |
) |
577 |
) |
| 576 |
) |
578 |
) |
| 577 |
|
579 |
|
| - |
|
580 |
(module Hrebinky:SMD_JUMP1X5 (layer B.Cu) (tedit 5512564D) (tstamp 547ED707) |
| - |
|
581 |
(at 17.526 -15.494 180) |
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) |
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|
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) |
| - |
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|
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(net 2 GND)) |
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(net 3 VDD)) |
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