3863 |
3489 d 6 h |
jacho |
/Modules/Sensors/PCRD01A/PCB_SCH/ |
|
Diff |
3862 |
3491 d 2 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/CAD/ |
zvetsena tloustka izolacnich sten pod okrajem modulu. |
Diff |
3861 |
3491 d 14 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/ |
pridani dvojite izolacni prepazky a vyrenderovani objektu. |
Diff |
3860 |
3491 d 15 h |
kaklik |
/Modules/ |
nakreslena izolacni podlozka pod spinacovy modul. |
Diff |
3859 |
3494 d 0 h |
kaklik |
/Modules/ARM/ |
dalsi opravy chyb na podstavcich. |
Diff |
3858 |
3495 d 13 h |
kaklik |
/Modules/ARM/ |
opraveny chyby v navrhu mechanickych redukci. |
Diff |
3857 |
3495 d 19 h |
ondra6ak |
/Modules/CommRF/BLE01A/ |
Some fixes from TODO.txt done |
Diff |
3856 |
3496 d 1 h |
kaklik |
/Modules/ARM/ODROID-C1/ |
zaznam chyb na prvnim vytistenem prototypu. |
Diff |
3855 |
3496 d 14 h |
kaklik |
/Designs/Measuring_instruments/AWS02A/DOC/src/img/ |
pridani obrazku krytu na vlhkostni a teplotni cidlo. |
Diff |
3854 |
3496 d 16 h |
kaklik |
/Modules/ARM/ |
mechanicky adapter pro ODROID-C1 do MLABu. |
Diff |
3853 |
3499 d 1 h |
kaklik |
/Modules/CommRF/LNA01A/CAM_AMA/ |
priraveny vzory pro derovaní krabičky pro LNA. |
Diff |
3852 |
3500 d 19 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
editace podlozky pro lepsi geometrii a usetreni materialu. |
Diff |
3851 |
3501 d 17 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zaznam stavu pred prekreslenim. |
Diff |
3850 |
3505 d 23 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zlepšeny tolerance PCB. |
Diff |
3849 |
3506 d 22 h |
kaklik |
/Modules/CommRF/BLE01A/pdf/ |
pridani datasheetu od obvodu na BLE. |
Diff |
3848 |
3506 d 22 h |
kaklik |
/ |
zapsani chyb v navrhu modulu. |
Diff |
3847 |
3506 d 23 h |
kaklik |
/Modules/CommRF/BLE01A/ |
Pridani komunikacniho modulu pro Bluetooth low energy. |
Diff |
3846 |
3511 d 21 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
pridani nahledu ODROIDu do seznamu modulu. |
Diff |
3845 |
3512 d 1 h |
kaklik |
/Modules/ARM/ODROID-U3/DOC/SRC/img/ |
pridani obrazku adapteru. |
Diff |
3844 |
3514 d 22 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
oprava chyby - misto pro kondenzatory na redukcnim PCB. |
Diff |
3843 |
3515 d 16 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
prvni verze podlozky s chybami. |
Diff |
3842 |
3517 d 15 h |
kaklik |
/Designs/Measuring_instruments/AWS02A/CAD/ |
pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer. |
Diff |
3841 |
3520 d 17 h |
kaklik |
/Modules/ |
aktualizace dokumentace. |
Diff |
3840 |
3521 d 22 h |
kaklik |
/Modules/CommSerial/I2CIO01A/ |
zaznam chyb. |
Diff |
3839 |
3522 d 20 h |
kaklik |
/Modules/CommSerial/USBI2C01A/ |
uklid dokumentace. |
Diff |
3838 |
3524 d 15 h |
kakl |
/Modules/CommSerial/I2CHUB02B/ |
Added todo. |
Diff |
3837 |
3524 d 15 h |
kaklik |
/Modules/CommSerial/I2CHUB02B/ |
zapis chyb na modulu. |
Diff |
3836 |
3524 d 23 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
prvni nakres mechanicke podpory pod odroid.. |
Diff |
3835 |
3526 d 16 h |
kakl |
/Modules/PowerSupply/BATPOWER04C/ |
Added bug to todo. |
Diff |
3834 |
3526 d 19 h |
kaklik |
/Modules/CommSerial/I2CIO01A/PCB_SCH/ |
vygenerovano schema modulu. |
Diff |
3833 |
3526 d 20 h |
kaklik |
/Modules/ |
zapis chyb u modulu. |
Diff |
3832 |
3528 d 0 h |
kaklik |
/Modules/CommSerial/I2CSPI01A/SCH_PCB/ |
vygenerovani schema modulu. |
Diff |
3831 |
3528 d 2 h |
jacho |
/Modules/ARM/ODROID-U3/SCH_PCB/ |
|
Diff |
3830 |
3528 d 21 h |
kaklik |
/ |
zapis chyb v modulu. |
Diff |
3829 |
3529 d 7 h |
jacho |
/Modules/ |
generovani podkladu pro osazeni |
Diff |
3828 |
3531 d 1 h |
jacho |
/Modules/Audio/ADCaudio01B/PCB_SCH/ |
|
Diff |
3827 |
3531 d 22 h |
kaklik |
/Modules/CommSerial/I2CIO01A/PCB_SCH/ |
vygenerovani seznamu soucastek. |
Diff |
3826 |
3533 d 2 h |
kaklik |
/Modules/Sensors/IUC01A/ |
zapis požadavků na opravy.. |
Diff |
3825 |
3533 d 18 h |
kaklik |
/ |
pridani zdrojaku dokumentace. |
Diff |
3824 |
3537 d 0 h |
kaklik |
/Modules/Audio/ADCaudio01B/ |
vygenerovany technologicka data. |
Diff |