Rev Age Author Path Log message Diff
3882 3558 d 13 h vinchi9 /Designs/Measuring_instruments/AWS02A/CAD/src/rounded_screen/ Added rounded screen OpenSCAD files. Diff
3881 3558 d 13 h vinchi9 /Designs/Measuring_instruments/AWS02A/CAD/src/rounded_screen/ Added rounded screen OpenSCAD files. Diff
3880 3558 d 13 h vinchi9 /Designs/Measuring_instruments/AWS02A/CAD/src/rounded_screen/ Added rounded screen OpenSCAD files. Diff
3879 3558 d 13 h vinchi9 /Designs/Measuring_instruments/AWS02A/CAD/src/ Deleted old versions of rounded screen. Diff
3878 3558 d 13 h vinchi9 /Designs/Measuring_instruments/AWS02A/CAD/src/rounded_screen/ Diff
3877 3558 d 20 h kaklik /Modules/ zlepseni dokumentace. Diff
3876 3559 d 6 h kaklik /Designs/Measuring_instruments/AWS02A/ Přidání lukášových návrhů na kryt senzoru vlhkosního a teplotního čidla. Diff
3875 3560 d 13 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3560 d 20 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3561 d 6 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3561 d 16 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3561 d 18 h kaklik /Modules/ uklid v databazi. Diff
3870 3562 d 14 h kaklik /Designs/Measuring_instruments/AWS02A/CAD/ presunuti zdrojovych souboru do separatni slozky. Diff
3869 3563 d 13 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
Diff
3868 3564 d 22 h kaklik /Designs/Measuring_instruments/RMDS02D/ presunuti obrazku do dokumentacni slozky k fotografiim. Diff
3867 3564 d 22 h kaklik /Designs/Measuring_instruments/RMDS02D/ vytvoreni adresarove struktury pro dokumentacni fotografie. Diff
3866 3566 d 14 h kaklik /Designs/LABduino/SW/bootloader/ zmena skriptu tak, aby adresu komunikacniho portu bral z parametru prikazoveho radku. Diff
3865 3567 d 16 h kakl /Designs/Measuring_instruments/RMDS02D/ Added a pictures.
Changed a block diagram.
Diff
3864 3569 d 14 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3569 d 23 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3571 d 20 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3572 d 7 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3572 d 8 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3574 d 17 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3576 d 6 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3576 d 12 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3576 d 18 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3855 3577 d 7 h kaklik /Designs/Measuring_instruments/AWS02A/DOC/src/img/ pridani obrazku krytu na vlhkostni a teplotni cidlo. Diff
3854 3577 d 9 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3579 d 18 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3581 d 12 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3582 d 10 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3586 d 16 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3587 d 15 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3587 d 15 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3587 d 16 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3592 d 15 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3592 d 18 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3595 d 15 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3596 d 9 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff