Rev Age Author Path Log message Diff
3866 3461 d 19 h kaklik /Designs/LABduino/SW/bootloader/ zmena skriptu tak, aby adresu komunikacniho portu bral z parametru prikazoveho radku. Diff
3865 3462 d 22 h kakl /Designs/Measuring_instruments/RMDS02D/ Added a pictures.
Changed a block diagram.
Diff
3864 3464 d 19 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3465 d 5 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3467 d 1 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3467 d 13 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3467 d 13 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3469 d 22 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3471 d 11 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3471 d 18 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3472 d 0 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3855 3472 d 12 h kaklik /Designs/Measuring_instruments/AWS02A/DOC/src/img/ pridani obrazku krytu na vlhkostni a teplotni cidlo. Diff
3854 3472 d 14 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3474 d 23 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3476 d 18 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3477 d 15 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3481 d 22 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3482 d 21 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3482 d 21 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3482 d 21 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3487 d 20 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3487 d 23 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3490 d 21 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3491 d 14 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3842 3493 d 14 h kaklik /Designs/Measuring_instruments/AWS02A/CAD/ pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer. Diff
3841 3496 d 16 h kaklik /Modules/ aktualizace dokumentace. Diff
3840 3497 d 20 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
3839 3498 d 19 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
3838 3500 d 14 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
3837 3500 d 14 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
3836 3500 d 22 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff
3835 3502 d 15 h kakl /Modules/PowerSupply/BATPOWER04C/ Added bug to todo. Diff
3834 3502 d 17 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovano schema modulu. Diff
3833 3502 d 18 h kaklik /Modules/ zapis chyb u modulu. Diff
3832 3503 d 22 h kaklik /Modules/CommSerial/I2CSPI01A/SCH_PCB/ vygenerovani schema modulu. Diff
3831 3504 d 1 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3830 3504 d 19 h kaklik / zapis chyb v modulu. Diff
3829 3505 d 5 h jacho /Modules/ generovani podkladu pro osazeni Diff
3828 3507 d 0 h jacho /Modules/Audio/ADCaudio01B/PCB_SCH/ Diff
3827 3507 d 21 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovani seznamu soucastek. Diff