Rev Age Author Path Log message Diff
3865 3562 d 10 h kakl /Designs/Measuring_instruments/RMDS02D/ Added a pictures.
Changed a block diagram.
Diff
3864 3564 d 8 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3564 d 17 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3566 d 14 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3567 d 1 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3567 d 2 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3569 d 11 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3571 d 0 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3571 d 6 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3571 d 12 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3855 3572 d 1 h kaklik /Designs/Measuring_instruments/AWS02A/DOC/src/img/ pridani obrazku krytu na vlhkostni a teplotni cidlo. Diff
3854 3572 d 3 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3574 d 12 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3576 d 6 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3577 d 4 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3581 d 10 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3582 d 9 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3582 d 9 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3582 d 10 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3587 d 8 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3587 d 12 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3590 d 9 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3591 d 3 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3842 3593 d 2 h kaklik /Designs/Measuring_instruments/AWS02A/CAD/ pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer. Diff
3841 3596 d 4 h kaklik /Modules/ aktualizace dokumentace. Diff
3840 3597 d 9 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
3839 3598 d 7 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
3838 3600 d 2 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
3837 3600 d 3 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
3836 3600 d 10 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff
3835 3602 d 3 h kakl /Modules/PowerSupply/BATPOWER04C/ Added bug to todo. Diff
3834 3602 d 6 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovano schema modulu. Diff
3833 3602 d 7 h kaklik /Modules/ zapis chyb u modulu. Diff
3832 3603 d 11 h kaklik /Modules/CommSerial/I2CSPI01A/SCH_PCB/ vygenerovani schema modulu. Diff
3831 3603 d 13 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3830 3604 d 8 h kaklik / zapis chyb v modulu. Diff
3829 3604 d 18 h jacho /Modules/ generovani podkladu pro osazeni Diff
3828 3606 d 12 h jacho /Modules/Audio/ADCaudio01B/PCB_SCH/ Diff
3827 3607 d 9 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovani seznamu soucastek. Diff
3826 3608 d 14 h kaklik /Modules/Sensors/IUC01A/ zapis požadavků na opravy.. Diff