Rev Age Author Path Log message Diff
4169 3221 d 18 h jacho /Modules/ARM/ODROID-U3/ Diff
4160 3227 d 15 h kaklik /Modules/ Uprava konektoru. Diff
4159 3230 d 8 h kaklik /Modules/ARM/ upravy kapsy pro redukci na eMMC. Diff
4151 3244 d 0 h kaklik / Vylepseni modelu pro snadnejsi tisk. Diff
4145 3248 d 20 h kaklik / aktualizace dokumentace. Diff
4031 3360 d 7 h kaklik /Modules/ARM/ODROID-U3/CAD/ vylepseni tisknutelnosti prevysu. Diff
3989 3376 d 18 h kaklik /Modules/ vygenerovani nahledu vyrobnich dat. Diff
3965 3388 d 19 h jacho /Modules/ Diff
3952 3389 d 13 h kaklik /Modules/ARM/ODROID-U3/ Opravy chyb v prototypu. Diff
3951 3389 d 14 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ zmena pouzder u kondenzatoru a diod.

V teto verzi je taky omylem aktualizovany footprint pro 2mm hrebinek, coz zpusobilo problem diky zmene cislovani.
Diff
3920 3401 d 14 h kaklik /Modules/ oprava chyb. Diff
3911 3410 d 6 h kaklik /Modules/ vylepseni dokumentace a aktualizace modelu. Diff
3910 3412 d 18 h kaklik /Modules/ARM/ upravy dokumentace k jednodeskovym pocitacum v MLABu. Diff
3871 3423 d 18 h kaklik /Modules/ uklid v databazi. Diff
3869 3425 d 13 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
Diff
3859 3436 d 17 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3438 d 5 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3854 3439 d 8 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3852 3443 d 12 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3444 d 10 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3448 d 16 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3846 3454 d 14 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3454 d 17 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3457 d 15 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3458 d 9 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3836 3467 d 16 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff
3831 3470 d 19 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3830 3471 d 13 h kaklik / zapis chyb v modulu. Diff
3823 3479 d 18 h kaklik /Modules/ARM/ODROID-U3/ vygenerovani technologickych vystupu. Diff
3822 3479 d 18 h jacho /Modules/ Diff
3821 3479 d 19 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ zaroutovani PCB. Diff
3820 3480 d 7 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ pokus o vytištění papírového modelu. Diff
3816 3481 d 6 h kaklik /Modules/ upraveni potisku a vygenerovani nahledu modulu. Diff
3815 3481 d 10 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ uprava pcb Diff
3814 3481 d 10 h jacho /Modules/ Diff
3813 3481 d 14 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3812 3481 d 19 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ ocislovani schema. Diff
3811 3482 d 9 h kakl /Modules/ARM/ODROID-U3/pdf/ Change of holes arrangement Diff
3810 3482 d 9 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ oprava junction. Diff
3809 3482 d 9 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ pridani projektove knihovny. Diff