Rev Age Author Path Log message Diff
3869 3562 d 23 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
Diff
3864 3569 d 0 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3569 d 9 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3571 d 5 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3571 d 17 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3571 d 18 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3574 d 3 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3575 d 16 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3575 d 22 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3576 d 4 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3576 d 19 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3579 d 4 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3580 d 22 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3581 d 20 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3586 d 2 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3587 d 1 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3587 d 1 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3587 d 2 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3592 d 0 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3592 d 4 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3595 d 1 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3595 d 19 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3841 3600 d 20 h kaklik /Modules/ aktualizace dokumentace. Diff
3840 3602 d 1 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
3839 3602 d 23 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
3838 3604 d 18 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
3837 3604 d 19 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
3836 3605 d 2 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff
3835 3606 d 19 h kakl /Modules/PowerSupply/BATPOWER04C/ Added bug to todo. Diff
3834 3606 d 22 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovano schema modulu. Diff
3833 3606 d 23 h kaklik /Modules/ zapis chyb u modulu. Diff
3832 3608 d 3 h kaklik /Modules/CommSerial/I2CSPI01A/SCH_PCB/ vygenerovani schema modulu. Diff
3831 3608 d 5 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3830 3609 d 0 h kaklik / zapis chyb v modulu. Diff
3829 3609 d 10 h jacho /Modules/ generovani podkladu pro osazeni Diff
3828 3611 d 4 h jacho /Modules/Audio/ADCaudio01B/PCB_SCH/ Diff
3827 3612 d 1 h kaklik /Modules/CommSerial/I2CIO01A/PCB_SCH/ vygenerovani seznamu soucastek. Diff
3826 3613 d 6 h kaklik /Modules/Sensors/IUC01A/ zapis požadavků na opravy.. Diff
3825 3613 d 21 h kaklik / pridani zdrojaku dokumentace. Diff
3824 3617 d 3 h kaklik /Modules/Audio/ADCaudio01B/ vygenerovany technologicka data. Diff