Rev Age Author Path Log message Diff
3900 3428 d 9 h jacho /Modules/Sensors/ Diff
3899 3428 d 22 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3429 d 9 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3430 d 2 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.
Diff
3889 3430 d 3 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3887 3431 d 6 h jacho /Modules/PowerSupply/BATPOWER04C/SCH_PCB/ Diff
3877 3432 d 11 h kaklik /Modules/ zlepseni dokumentace. Diff
3875 3434 d 4 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3434 d 10 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3434 d 21 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3435 d 6 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3435 d 9 h kaklik /Modules/ uklid v databazi. Diff
3869 3437 d 3 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
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3864 3443 d 4 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3443 d 14 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3445 d 10 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3445 d 22 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3445 d 22 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3448 d 8 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3449 d 20 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3450 d 3 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3450 d 9 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3450 d 23 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3453 d 8 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3455 d 3 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3456 d 1 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3460 d 7 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3461 d 6 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3461 d 6 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3461 d 6 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3466 d 5 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3466 d 8 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3469 d 6 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3470 d 0 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3841 3475 d 1 h kaklik /Modules/ aktualizace dokumentace. Diff
3840 3476 d 5 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
3839 3477 d 4 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
3838 3478 d 23 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
3837 3478 d 23 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
3836 3479 d 7 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff