Rev Age Author Path Log message Diff
4199 3188 d 22 h kaklik /Modules/Audio/POWERDAC01A/SCH_PCB/ prace na navrhu plosneho spoje.. Diff
4198 3188 d 23 h kaklik /Modules/Audio/ pridani kot do ADCaudio.
Pri tom jsem zjistil, ze modul zrejme nema presne standardni rozmer.
Diff
4197 3191 d 18 h kaklik /Modules/Audio/POWERDAC01A/SCH_PCB/ zacatek navrhu noveho PCB pro modul vykonoveho zesilovace. Diff
4196 3192 d 4 h jacho /Modules/PowerSupply/LION2CELL01C/SCH_PCB/ Diff
4195 3192 d 20 h kaklik / uprava prumeru hridele podle nastaveni tiskarny. Diff
4194 3193 d 1 h kaklik /Modules/ zvetseni toleranci pro tisk. Diff
4192 3193 d 20 h kaklik /Modules/Audio/POWERDAC01A/ zalozeni noveho modulu pro vykonovy audio vystup. Diff
4190 3194 d 18 h kaklik /Modules/ADconverters/BRIDGEADC01A/SCH_PCB/ Posunuti PCB do stredu stranky pri tisk dokumentace. Diff
4189 3194 d 20 h kaklik / Modifikace kola pro snadnejsi tisk. Diff
4188 3195 d 11 h kaklik / upravy rozmeru kola podle skutecneho vytisku. Diff
4187 3199 d 0 h kaklik /Modules/ADconverters/BRIDGEADC01A/ drobne opravy PCB. Diff
4184 3199 d 18 h kaklik /Modules/ADconverters/BRIDGEADC01A/ vygenerovani vyrobnich dat modulu. Diff
4183 3199 d 22 h jacho /Modules/ Diff
4182 3200 d 0 h jacho /Modules/PowerSupply/TPS63060V01A/CAM_PROFI/ Diff
4181 3200 d 2 h jacho /Modules/ADconverters/I2CADC01A/CAM_PROFI/ Diff
4180 3200 d 18 h kaklik /Modules/ADconverters/BRIDGEADC01A/ navrh plosneho spoje. Diff
4179 3200 d 19 h kaklik /Modules/Translators/VLT01A/CAM_PROFI/ uprava formatu do podoby, ktere rozumi gerbv. Diff
4178 3201 d 3 h jacho /Modules/PowerSupply/TPS63060V01A/CAM_PROFI/ Diff
4177 3201 d 17 h kaklik /Modules/ADconverters/ zalozeni noveho modulu pro tenzometricky ADC. Diff
4176 3210 d 1 h kaklik /Modules/CommSerial/USBHUB01A/ Pridani souboru s potrebnymi upravami. Diff
4175 3212 d 23 h jacho /Modules/CommSerial/USBHUB01A/SCH_PCB/ Diff
4174 3213 d 19 h jacho /Modules/CommSerial/USBHUB01A/SCH_PCB/ Diff
4173 3213 d 22 h jacho /Modules/CommSerial/USBHUB01A/SCH_PCB/ USBHUB01A PCB Diff
4172 3214 d 11 h kaklik / aktualizace blokovych schemat na Poster. Diff
4170 3214 d 18 h jacho /Modules/CommSerial/USBHUB01A/SCH_PCB/ Diff
4169 3214 d 21 h jacho /Modules/ARM/ODROID-U3/ Diff
4168 3214 d 23 h jacho /Modules/ Diff
4167 3215 d 0 h jacho /Modules/ Diff
4166 3215 d 3 h jacho /Modules/Sensors/RGBC01A/ Diff
4165 3215 d 21 h kaklik /Modules/PowerSupply/THERMOGEN01A/ presunuti podle standardni struktury a prejmenovani podle konvence PragoBoard. Diff
4164 3215 d 23 h kaklik /Modules/PowerSupply/THERMOGEN01A/ drobne upravy layoutu a vygenerovani vyrobnich dat. Diff
4163 3216 d 1 h jacho /Modules/Sensors/RGBC01A/ Diff
4162 3216 d 1 h jacho /Modules/PowerSupply/THERMOGEN01A/ Diff
4161 3216 d 22 h jacho /Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/ Diff
4160 3220 d 18 h kaklik /Modules/ Uprava konektoru. Diff
4159 3223 d 11 h kaklik /Modules/ARM/ upravy kapsy pro redukci na eMMC. Diff
4158 3223 d 13 h roman /Modules/ARM/ODROID-C1/CAD/src/ pridani cura configurace Diff
4157 3223 d 13 h kaklik /Modules/ARM/ODROID-C1/CAD/ vygenerovani kapsy na redukci a přidáni loga. Diff
4156 3223 d 16 h kaklik /Modules/ARM/ODROID-C1/CAD/ Navrzena kapsa pro redukci na eMMC kartu. Diff
4155 3223 d 19 h kaklik /Modules/Sensors/RPS01A/SCH_PCB/ okotovani PCB. Diff