Rev Age Author Path Log message Diff
3909 3556 d 2 h kaklik /Modules/ARM/Raspberry/DOC/src/img/ pridan obrazek ramecku pro Raspberry. Diff
3908 3556 d 2 h kaklik /Modules/ARM/ oprava preklepu v nazvu. Diff
3907 3556 d 17 h kaklik /Modules/ARM/ prvni verze drzaku na raspberry Pi. Diff
3905 3559 d 3 h kaklik /Modules/ARM/RapsberryPi/ pridani dokumentacni slozky pro Raspberry Pi podlozku. Diff
3899 3560 d 15 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3561 d 2 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3561 d 19 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.
Diff
3889 3561 d 20 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3874 3566 d 3 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3566 d 14 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3871 3567 d 2 h kaklik /Modules/ uklid v databazi. Diff
3869 3568 d 20 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
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3859 3580 d 0 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3581 d 13 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3856 3582 d 2 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3582 d 16 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3852 3586 d 20 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3587 d 17 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3592 d 0 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3846 3597 d 22 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3598 d 1 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3600 d 23 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3601 d 16 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3836 3611 d 0 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff
3831 3614 d 2 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3830 3614 d 21 h kaklik / zapis chyb v modulu. Diff
3823 3623 d 1 h kaklik /Modules/ARM/ODROID-U3/ vygenerovani technologickych vystupu. Diff
3822 3623 d 2 h jacho /Modules/ Diff
3821 3623 d 3 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ zaroutovani PCB. Diff
3820 3623 d 14 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ pokus o vytištění papírového modelu. Diff
3816 3624 d 14 h kaklik /Modules/ upraveni potisku a vygenerovani nahledu modulu. Diff
3815 3624 d 18 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ uprava pcb Diff
3814 3624 d 18 h jacho /Modules/ Diff
3813 3624 d 22 h jacho /Modules/ARM/ODROID-U3/SCH_PCB/ Diff
3812 3625 d 2 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ ocislovani schema. Diff
3811 3625 d 16 h kakl /Modules/ARM/ODROID-U3/pdf/ Change of holes arrangement Diff
3810 3625 d 17 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ oprava junction. Diff
3809 3625 d 17 h kaklik /Modules/ARM/ODROID-U3/SCH_PCB/ pridani projektove knihovny. Diff
3808 3625 d 17 h kaklik /Modules/ARM/ODROID-U3/ pridano schema pro redukci na ODROID. Diff
3804 3626 d 13 h kakl /Modules/ARM/ODROID-U3/pdf/ U3 mechanical drawing Diff