| 1814 |
5036 d 11 h |
kaklik |
/ |
vygenerovani nahledu |
Diff |
| 1813 |
5036 d 11 h |
kaklik |
/ |
vygenerovani technologickych vystupu. |
Diff |
| 1811 |
5036 d 22 h |
kaklik |
/ |
|
Diff |
| 1810 |
5037 d 1 h |
kaklik |
/ |
aktualizace odmaskování. Odstaraněno odmaskování VIA |
Diff |
| 1809 |
5037 d 8 h |
kaklik |
/ |
drobné úpravy a vygenerování technologických výstupů |
Diff |
| 1808 |
5037 d 22 h |
kaklik |
/Modules/Clock/CLKGEN01B/PCB/ |
přidání prokovů |
Diff |
| 1802 |
5039 d 9 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
upravy ve vyliti medi. |
Diff |
| 1801 |
5039 d 10 h |
kaklik |
/Modules/Sensors/ |
prejmenovani dokumentacni slozky GSENSE01A |
Diff |
| 1800 |
5039 d 10 h |
kaklik |
/Modules/Sensors/MMA7260/DOC/ |
|
Diff |
| 1799 |
5039 d 10 h |
kaklik |
/Modules/PIC/PICPROGUSB02A/DOC/ |
oprava nadpisu |
Diff |
| 1798 |
5043 d 7 h |
kaklik |
/ |
aktualizace schemat v PDF. |
Diff |
| 1797 |
5046 d 11 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
uprava potisku |
Diff |
| 1796 |
5046 d 12 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
aktualizace vyrobnich dat. |
Diff |
| 1795 |
5046 d 22 h |
kaklik |
/Modules/CommSerial/ETH01A/ |
zacatek navrhu PCB. |
Diff |
| 1794 |
5047 d 1 h |
kaklik |
/Modules/CommSerial/ETH01A/SCH/ |
doklesleno schema. |
Diff |
| 1793 |
5048 d 4 h |
kaklik |
/Modules/CommSerial/ETH01A/SCH/ |
dokresleni schema casti na PoE.
Jeste je treba prekleslit pripojeni RJ45 konektoru. |
Diff |
| 1792 |
5048 d 5 h |
miho |
/Modules/CPLD_FPGA/S3AN01A/SCH/ |
Ještě pracovní knihovna projektu S3AN01A |
Diff |
| 1791 |
5048 d 5 h |
miho |
/Modules/CPLD_FPGA/S3AN01A/ |
Created FPGA module (school board) for XILINX Spartan 3 XC3S50AN gate array S3AN01A |
Diff |
| 1790 |
5048 d 5 h |
miho |
/Modules/ |
Přejmenování podstromu CPLD na CPLD_FPGA |
Diff |
| 1789 |
5048 d 11 h |
miho |
/ |
Vygenerované podklady pro amatérskou výrobu plošných spojů. |
Diff |
| 1786 |
5054 d 23 h |
kaklik |
/Modules/Translators/TTLPECL01A/ |
vygenerovani technologickych vystupu |
Diff |
| 1785 |
5054 d 23 h |
kaklik |
/Modules/Translators/TTLPECL01A/PCB/ |
|
Diff |
| 1784 |
5055 d 0 h |
kaklik |
/ |
zacatek navrhu spoje. |
Diff |
| 1783 |
5055 d 4 h |
kaklik |
/Modules/Translators/TTLPECL01A/DOC/ |
Zalozena nоvá třída modulů pro převod signálových úrovní. |
Diff |
| 1782 |
5055 d 5 h |
kaklik |
/ |
presunuti mezi nove zavedeny typ modulu. |
Diff |
| 1781 |
5055 d 6 h |
kaklik |
/ |
Zalozena nоvá třída modulů pro převod signálových úrovní. |
Diff |
| 1780 |
5056 d 1 h |
kaklik |
/ |
vytvoren modul pro vlhkostni cidlo. |
Diff |
| 1779 |
5056 d 1 h |
kaklik |
/Modules/Sensors/HUM01A/PCB/ |
zakladni verze PCB |
Diff |
| 1778 |
5056 d 4 h |
kaklik |
/Modules/ |
zalozen novy modul - na mereni vlhkosti. |
Diff |
| 1775 |
5059 d 4 h |
kaklik |
/Modules/TDC/GP201A/SW/PICinterface/ |
TDC nwmwri ani v modu 1 |
Diff |
| 1774 |
5059 d 9 h |
kaklik |
/Modules/TDC/GP201A/SW/PICinterface/ |
pridani mereni teploty pomoci ccidla DS18B20 |
Diff |
| 1767 |
5060 d 3 h |
kaklik |
/Modules/TDC/GP201A/SW/PICinterface/ |
pridani zdrojaku pro teplomer |
Diff |
| 1766 |
5063 d 7 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
dokonceni uprav PCB pro vyrobu. |
Diff |
| 1765 |
5063 d 11 h |
kaklik |
/Modules/ARM/STM32F10xRxT/PCB/ |
pridani technologickych znacek. |
Diff |
| 1764 |
5063 d 22 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
aktualizace oprav chyb |
Diff |
| 1763 |
5064 d 0 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
přegenerování technologických výstupů |
Diff |
| 1762 |
5064 d 0 h |
kaklik |
/Modules/ARM/STM32F10xRxT/ |
uklid ve slozkach modulu. |
Diff |
| 1760 |
5064 d 0 h |
kaklik |
/Modules/TDC/GP201A/SW/PICinterface/ |
zmena absolutnich cest v projektu na relativni. |
Diff |
| 1759 |
5064 d 23 h |
kakl |
/Modules/TDC/GP201A/SW/PICinterface/ |
implementace MR2. TDC ale nereaguje na stop impuls. |
Diff |
| 1758 |
5065 d 2 h |
kakl |
/Modules/TDC/GP201A/SW/PICinterface/ |
znicializovany nastaveni registru |
Diff |