| 3904 |
3564 d 13 h |
kaklik |
/Modules/Mechanical/PLCASE1115/ |
Navrh krytu na malou zakladni desku. |
Diff |
| 3903 |
3564 d 17 h |
jacho |
/Modules/Measuring/GPS01B/SCH_PCB/ |
|
Diff |
| 3902 |
3565 d 7 h |
jacho |
/Modules/Measuring/GPS01B/ |
|
Diff |
| 3901 |
3565 d 7 h |
jacho |
/Modules/Measuring/GPS01B/SCH_PCB/ |
|
Diff |
| 3900 |
3565 d 11 h |
jacho |
/Modules/Sensors/ |
|
Diff |
| 3899 |
3566 d 0 h |
kaklik |
/Modules/ARM/ODroid-X2/CAD/ |
upravy technologickych nastaveni pro tisk. |
Diff |
| 3891 |
3566 d 11 h |
kaklik |
/Modules/ARM/ODroid-X2/CAD/ |
optimalizace navrhu podlozky. |
Diff |
| 3890 |
3567 d 4 h |
kaklik |
/Modules/ |
vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu. |
Diff |
| 3889 |
3567 d 5 h |
kaklik |
/Modules/ |
zdrojove soubory prvni vytisknute verze. |
Diff |
| 3887 |
3568 d 8 h |
jacho |
/Modules/PowerSupply/BATPOWER04C/SCH_PCB/ |
|
Diff |
| 3877 |
3569 d 13 h |
kaklik |
/Modules/ |
zlepseni dokumentace. |
Diff |
| 3875 |
3571 d 6 h |
kaklik |
/Modules/AVR/AT32TQ14401A/SCH_PCB/ |
pridani zapomenuteho schema. |
Diff |
| 3874 |
3571 d 12 h |
kaklik |
/Modules/ARM/ODroid-X2/CAD/ |
opravy chyb v navrhu. |
Diff |
| 3873 |
3571 d 23 h |
kaklik |
/Modules/ARM/ |
nakreslena podlozka pod odroid X2, |
Diff |
| 3872 |
3572 d 8 h |
kaklik |
/Modules/AVR/AT32TQ14401A/ |
pokus o pridani QRkodu do potisku modulu. |
Diff |
| 3871 |
3572 d 11 h |
kaklik |
/Modules/ |
uklid v databazi. |
Diff |
| 3869 |
3574 d 5 h |
kaklik |
/ |
zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu. |
Diff |
| 3864 |
3580 d 6 h |
jacho |
/Modules/Sensors/PCRD02A/PCB_SCH/ |
|
Diff |
| 3863 |
3580 d 16 h |
jacho |
/Modules/Sensors/PCRD01A/PCB_SCH/ |
|
Diff |
| 3862 |
3582 d 12 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/CAD/ |
zvetsena tloustka izolacnich sten pod okrajem modulu. |
Diff |
| 3861 |
3583 d 0 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/ |
pridani dvojite izolacni prepazky a vyrenderovani objektu. |
Diff |
| 3860 |
3583 d 0 h |
kaklik |
/Modules/ |
nakreslena izolacni podlozka pod spinacovy modul. |
Diff |
| 3859 |
3585 d 9 h |
kaklik |
/Modules/ARM/ |
dalsi opravy chyb na podstavcich. |
Diff |
| 3858 |
3586 d 22 h |
kaklik |
/Modules/ARM/ |
opraveny chyby v navrhu mechanickych redukci. |
Diff |
| 3857 |
3587 d 5 h |
ondra6ak |
/Modules/CommRF/BLE01A/ |
Some fixes from TODO.txt done |
Diff |
| 3856 |
3587 d 11 h |
kaklik |
/Modules/ARM/ODROID-C1/ |
zaznam chyb na prvnim vytistenem prototypu. |
Diff |
| 3854 |
3588 d 1 h |
kaklik |
/Modules/ARM/ |
mechanicky adapter pro ODROID-C1 do MLABu. |
Diff |
| 3853 |
3590 d 10 h |
kaklik |
/Modules/CommRF/LNA01A/CAM_AMA/ |
priraveny vzory pro derovaní krabičky pro LNA. |
Diff |
| 3852 |
3592 d 5 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
editace podlozky pro lepsi geometrii a usetreni materialu. |
Diff |
| 3851 |
3593 d 2 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zaznam stavu pred prekreslenim. |
Diff |
| 3850 |
3597 d 9 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zlepšeny tolerance PCB. |
Diff |
| 3849 |
3598 d 7 h |
kaklik |
/Modules/CommRF/BLE01A/pdf/ |
pridani datasheetu od obvodu na BLE. |
Diff |
| 3848 |
3598 d 8 h |
kaklik |
/ |
zapsani chyb v navrhu modulu. |
Diff |
| 3847 |
3598 d 8 h |
kaklik |
/Modules/CommRF/BLE01A/ |
Pridani komunikacniho modulu pro Bluetooth low energy. |
Diff |
| 3846 |
3603 d 7 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
pridani nahledu ODROIDu do seznamu modulu. |
Diff |
| 3845 |
3603 d 10 h |
kaklik |
/Modules/ARM/ODROID-U3/DOC/SRC/img/ |
pridani obrazku adapteru. |
Diff |
| 3844 |
3606 d 8 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
oprava chyby - misto pro kondenzatory na redukcnim PCB. |
Diff |
| 3843 |
3607 d 1 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
prvni verze podlozky s chybami. |
Diff |
| 3841 |
3612 d 3 h |
kaklik |
/Modules/ |
aktualizace dokumentace. |
Diff |
| 3840 |
3613 d 7 h |
kaklik |
/Modules/CommSerial/I2CIO01A/ |
zaznam chyb. |
Diff |