Rev Age Author Path Log message Diff
3900 3562 d 20 h jacho /Modules/Sensors/ Diff
3899 3563 d 9 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3563 d 20 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3564 d 13 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.
Diff
3889 3564 d 15 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3887 3565 d 18 h jacho /Modules/PowerSupply/BATPOWER04C/SCH_PCB/ Diff
3877 3566 d 22 h kaklik /Modules/ zlepseni dokumentace. Diff
3875 3568 d 15 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3568 d 21 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3569 d 8 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3569 d 18 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3569 d 20 h kaklik /Modules/ uklid v databazi. Diff
3869 3571 d 15 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
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3864 3577 d 16 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3578 d 1 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3579 d 21 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3580 d 9 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3580 d 10 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3582 d 19 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3584 d 8 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3584 d 14 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3584 d 20 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3585 d 11 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3587 d 20 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3589 d 14 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3590 d 12 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3594 d 18 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3595 d 17 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3595 d 17 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3595 d 18 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3600 d 16 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3600 d 20 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3603 d 17 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3604 d 11 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
3841 3609 d 12 h kaklik /Modules/ aktualizace dokumentace. Diff
3840 3610 d 17 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
3839 3611 d 15 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
3838 3613 d 10 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
3837 3613 d 11 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
3836 3613 d 18 h kaklik /Modules/ARM/ODROID-U3/ prvni nakres mechanicke podpory pod odroid.. Diff