| 3879 |
3569 d 20 h |
vinchi9 |
/Designs/Measuring_instruments/AWS02A/CAD/src/ |
Deleted old versions of rounded screen. |
Diff |
| 3878 |
3569 d 20 h |
vinchi9 |
/Designs/Measuring_instruments/AWS02A/CAD/src/rounded_screen/ |
|
Diff |
| 3877 |
3570 d 4 h |
kaklik |
/Modules/ |
zlepseni dokumentace. |
Diff |
| 3876 |
3570 d 14 h |
kaklik |
/Designs/Measuring_instruments/AWS02A/ |
Přidání lukášových návrhů na kryt senzoru vlhkosního a teplotního čidla. |
Diff |
| 3875 |
3571 d 21 h |
kaklik |
/Modules/AVR/AT32TQ14401A/SCH_PCB/ |
pridani zapomenuteho schema. |
Diff |
| 3874 |
3572 d 3 h |
kaklik |
/Modules/ARM/ODroid-X2/CAD/ |
opravy chyb v navrhu. |
Diff |
| 3873 |
3572 d 14 h |
kaklik |
/Modules/ARM/ |
nakreslena podlozka pod odroid X2, |
Diff |
| 3872 |
3572 d 23 h |
kaklik |
/Modules/AVR/AT32TQ14401A/ |
pokus o pridani QRkodu do potisku modulu. |
Diff |
| 3871 |
3573 d 2 h |
kaklik |
/Modules/ |
uklid v databazi. |
Diff |
| 3870 |
3573 d 22 h |
kaklik |
/Designs/Measuring_instruments/AWS02A/CAD/ |
presunuti zdrojovych souboru do separatni slozky. |
Diff |
| 3869 |
3574 d 20 h |
kaklik |
/ |
zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu. |
Diff |
| 3868 |
3576 d 5 h |
kaklik |
/Designs/Measuring_instruments/RMDS02D/ |
presunuti obrazku do dokumentacni slozky k fotografiim. |
Diff |
| 3867 |
3576 d 5 h |
kaklik |
/Designs/Measuring_instruments/RMDS02D/ |
vytvoreni adresarove struktury pro dokumentacni fotografie. |
Diff |
| 3866 |
3577 d 21 h |
kaklik |
/Designs/LABduino/SW/bootloader/ |
zmena skriptu tak, aby adresu komunikacniho portu bral z parametru prikazoveho radku. |
Diff |
| 3865 |
3579 d 0 h |
kakl |
/Designs/Measuring_instruments/RMDS02D/ |
Added a pictures.
Changed a block diagram. |
Diff |
| 3864 |
3580 d 21 h |
jacho |
/Modules/Sensors/PCRD02A/PCB_SCH/ |
|
Diff |
| 3863 |
3581 d 7 h |
jacho |
/Modules/Sensors/PCRD01A/PCB_SCH/ |
|
Diff |
| 3862 |
3583 d 3 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/CAD/ |
zvetsena tloustka izolacnich sten pod okrajem modulu. |
Diff |
| 3861 |
3583 d 15 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/ |
pridani dvojite izolacni prepazky a vyrenderovani objektu. |
Diff |
| 3860 |
3583 d 15 h |
kaklik |
/Modules/ |
nakreslena izolacni podlozka pod spinacovy modul. |
Diff |