Rev 3877 – kaklik – 260 d 8 h (2024-02-19 21:55:10)
Repair the MLAB template.
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Rev 3877
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Diff
3857
3576 d 12 h
ondra6ak
/Modules/CommRF/BLE01A/
Some fixes from TODO.txt done
Diff
3856
3576 d 18 h
kaklik
/Modules/ARM/ODROID-C1/
zaznam chyb na prvnim vytistenem prototypu.
Diff
3855
3577 d 7 h
kaklik
/Designs/Measuring_instruments/AWS02A/DOC/src/img/
pridani obrazku krytu na vlhkostni a teplotni cidlo.
Diff
3854
3577 d 9 h
kaklik
/Modules/ARM/
mechanicky adapter pro ODROID-C1 do MLABu.
Diff
3853
3579 d 18 h
kaklik
/Modules/CommRF/LNA01A/CAM_AMA/
priraveny vzory pro derovaní krabičky pro LNA.
Diff
3852
3581 d 12 h
kaklik
/Modules/ARM/ODROID-U3/
editace podlozky pro lepsi geometrii a usetreni materialu.
Diff
3851
3582 d 10 h
kaklik
/Modules/ARM/ODROID-U3/
zaznam stavu pred prekreslenim.
Diff
3850
3586 d 16 h
kaklik
/Modules/ARM/ODROID-U3/
zlepšeny tolerance PCB.
Diff
3849
3587 d 15 h
kaklik
/Modules/CommRF/BLE01A/pdf/
pridani datasheetu od obvodu na BLE.
Diff
3848
3587 d 15 h
kaklik
/
zapsani chyb v navrhu modulu.
Diff
3847
3587 d 16 h
kaklik
/Modules/CommRF/BLE01A/
Pridani komunikacniho modulu pro Bluetooth low energy.
Diff
3846
3592 d 15 h
kaklik
/Modules/ARM/ODROID-U3/
pridani nahledu ODROIDu do seznamu modulu.
Diff
3845
3592 d 18 h
kaklik
/Modules/ARM/ODROID-U3/DOC/SRC/img/
pridani obrazku adapteru.
Diff
3844
3595 d 16 h
kaklik
/Modules/ARM/ODROID-U3/
oprava chyby - misto pro kondenzatory na redukcnim PCB.
Diff
3843
3596 d 9 h
kaklik
/Modules/ARM/ODROID-U3/
prvni verze podlozky s chybami.
Diff
3842
3598 d 9 h
kaklik
/Designs/Measuring_instruments/AWS02A/CAD/
pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer.
Diff
3841
3601 d 11 h
kaklik
/Modules/
aktualizace dokumentace.
Diff
3840
3602 d 15 h
kaklik
/Modules/CommSerial/I2CIO01A/
zaznam chyb.
Diff
3839
3603 d 13 h
kaklik
/Modules/CommSerial/USBI2C01A/
uklid dokumentace.
Diff
3838
3605 d 8 h
kakl
/Modules/CommSerial/I2CHUB02B/
Added todo.
Diff