Rev Age Author Path Log message Diff
3862 3579 d 20 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3580 d 7 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3580 d 8 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3582 d 17 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3584 d 6 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3584 d 12 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3584 d 18 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3855 3585 d 7 h kaklik /Designs/Measuring_instruments/AWS02A/DOC/src/img/ pridani obrazku krytu na vlhkostni a teplotni cidlo. Diff
3854 3585 d 9 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3587 d 18 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3589 d 12 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3590 d 10 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3594 d 16 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3595 d 15 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3595 d 15 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3595 d 16 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3600 d 15 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3600 d 18 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3603 d 16 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3604 d 9 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff