Rev 3850 – kaklik – 259 d 0 h (2024-02-19 21:55:10)
Repair the MLAB template.
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MLAB
MLAB
library
svnkaklik
MLAB_E
8magsvn
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Rev 3850
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Diff
3850
3585 d 8 h
kaklik
/Modules/ARM/ODROID-U3/
zlepšeny tolerance PCB.
Diff
3849
3586 d 7 h
kaklik
/Modules/CommRF/BLE01A/pdf/
pridani datasheetu od obvodu na BLE.
Diff
3848
3586 d 7 h
kaklik
/
zapsani chyb v navrhu modulu.
Diff
3847
3586 d 7 h
kaklik
/Modules/CommRF/BLE01A/
Pridani komunikacniho modulu pro Bluetooth low energy.
Diff
3846
3591 d 6 h
kaklik
/Modules/ARM/ODROID-U3/
pridani nahledu ODROIDu do seznamu modulu.
Diff
3845
3591 d 10 h
kaklik
/Modules/ARM/ODROID-U3/DOC/SRC/img/
pridani obrazku adapteru.
Diff
3844
3594 d 7 h
kaklik
/Modules/ARM/ODROID-U3/
oprava chyby - misto pro kondenzatory na redukcnim PCB.
Diff
3843
3595 d 1 h
kaklik
/Modules/ARM/ODROID-U3/
prvni verze podlozky s chybami.
Diff
3842
3597 d 0 h
kaklik
/Designs/Measuring_instruments/AWS02A/CAD/
pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer.
Diff
3841
3600 d 2 h
kaklik
/Modules/
aktualizace dokumentace.
Diff
3840
3601 d 7 h
kaklik
/Modules/CommSerial/I2CIO01A/
zaznam chyb.
Diff
3839
3602 d 5 h
kaklik
/Modules/CommSerial/USBI2C01A/
uklid dokumentace.
Diff
3838
3604 d 0 h
kakl
/Modules/CommSerial/I2CHUB02B/
Added todo.
Diff
3837
3604 d 0 h
kaklik
/Modules/CommSerial/I2CHUB02B/
zapis chyb na modulu.
Diff
3836
3604 d 8 h
kaklik
/Modules/ARM/ODROID-U3/
prvni nakres mechanicke podpory pod odroid..
Diff
3835
3606 d 1 h
kakl
/Modules/PowerSupply/BATPOWER04C/
Added bug to todo.
Diff
3834
3606 d 3 h
kaklik
/Modules/CommSerial/I2CIO01A/PCB_SCH/
vygenerovano schema modulu.
Diff
3833
3606 d 4 h
kaklik
/Modules/
zapis chyb u modulu.
Diff
3832
3607 d 9 h
kaklik
/Modules/CommSerial/I2CSPI01A/SCH_PCB/
vygenerovani schema modulu.
Diff
3831
3607 d 11 h
jacho
/Modules/ARM/ODROID-U3/SCH_PCB/
Diff