Rev 3854 – kaklik – 271 d 3 h (2024-02-19 21:55:10)
Repair the MLAB template.
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Rev 3854
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Diff
3854
3588 d 3 h
kaklik
/Modules/ARM/
mechanicky adapter pro ODROID-C1 do MLABu.
Diff
3853
3590 d 12 h
kaklik
/Modules/CommRF/LNA01A/CAM_AMA/
priraveny vzory pro derovaní krabičky pro LNA.
Diff
3852
3592 d 7 h
kaklik
/Modules/ARM/ODROID-U3/
editace podlozky pro lepsi geometrii a usetreni materialu.
Diff
3851
3593 d 4 h
kaklik
/Modules/ARM/ODROID-U3/
zaznam stavu pred prekreslenim.
Diff
3850
3597 d 11 h
kaklik
/Modules/ARM/ODROID-U3/
zlepšeny tolerance PCB.
Diff
3849
3598 d 10 h
kaklik
/Modules/CommRF/BLE01A/pdf/
pridani datasheetu od obvodu na BLE.
Diff
3848
3598 d 10 h
kaklik
/
zapsani chyb v navrhu modulu.
Diff
3847
3598 d 10 h
kaklik
/Modules/CommRF/BLE01A/
Pridani komunikacniho modulu pro Bluetooth low energy.
Diff
3846
3603 d 9 h
kaklik
/Modules/ARM/ODROID-U3/
pridani nahledu ODROIDu do seznamu modulu.
Diff
3845
3603 d 12 h
kaklik
/Modules/ARM/ODROID-U3/DOC/SRC/img/
pridani obrazku adapteru.
Diff
3844
3606 d 10 h
kaklik
/Modules/ARM/ODROID-U3/
oprava chyby - misto pro kondenzatory na redukcnim PCB.
Diff
3843
3607 d 4 h
kaklik
/Modules/ARM/ODROID-U3/
prvni verze podlozky s chybami.
Diff
3842
3609 d 3 h
kaklik
/Designs/Measuring_instruments/AWS02A/CAD/
pridani nakresu casti radiacniho stitu pro teplomer a vlhkomer.
Diff
3841
3612 d 5 h
kaklik
/Modules/
aktualizace dokumentace.
Diff
3840
3613 d 9 h
kaklik
/Modules/CommSerial/I2CIO01A/
zaznam chyb.
Diff
3839
3614 d 8 h
kaklik
/Modules/CommSerial/USBI2C01A/
uklid dokumentace.
Diff
3838
3616 d 3 h
kakl
/Modules/CommSerial/I2CHUB02B/
Added todo.
Diff
3837
3616 d 3 h
kaklik
/Modules/CommSerial/I2CHUB02B/
zapis chyb na modulu.
Diff
3836
3616 d 11 h
kaklik
/Modules/ARM/ODROID-U3/
prvni nakres mechanicke podpory pod odroid..
Diff
3835
3618 d 4 h
kakl
/Modules/PowerSupply/BATPOWER04C/
Added bug to todo.
Diff