Rev 4172 – kaklik – 259 d 20 h (2024-02-19 21:55:10)
Repair the MLAB template.
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MLAB
MLAB
library
svnkaklik
MLAB_E
8magsvn
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Rev 4172
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Diff
4172
3358 d 20 h
kaklik
/
aktualizace blokovych schemat na Poster.
Diff
4171
3359 d 3 h
kaklik
/Designs/Measuring_instruments/RMDS02D/DOC/SRC/img/
vytvoreni propagacni sady samolepek Bolidozor.
Diff
4170
3359 d 3 h
jacho
/Modules/CommSerial/USBHUB01A/SCH_PCB/
Diff
4169
3359 d 6 h
jacho
/Modules/ARM/ODROID-U3/
Diff
4168
3359 d 8 h
jacho
/Modules/
Diff
4167
3359 d 9 h
jacho
/Modules/
Diff
4166
3359 d 12 h
jacho
/Modules/Sensors/RGBC01A/
Diff
4165
3360 d 6 h
kaklik
/Modules/PowerSupply/THERMOGEN01A/
presunuti podle standardni struktury a prejmenovani podle konvence PragoBoard.
Diff
4164
3360 d 8 h
kaklik
/Modules/PowerSupply/THERMOGEN01A/
drobne upravy layoutu a vygenerovani vyrobnich dat.
Diff
4163
3360 d 10 h
jacho
/Modules/Sensors/RGBC01A/
Diff
4162
3360 d 10 h
jacho
/Modules/PowerSupply/THERMOGEN01A/
Diff
4161
3361 d 7 h
jacho
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/
Diff
4160
3365 d 3 h
kaklik
/Modules/
Uprava konektoru.
Diff
4159
3367 d 20 h
kaklik
/Modules/ARM/
upravy kapsy pro redukci na eMMC.
Diff
4158
3367 d 21 h
roman
/Modules/ARM/ODROID-C1/CAD/src/
pridani cura configurace
Diff
4157
3367 d 22 h
kaklik
/Modules/ARM/ODROID-C1/CAD/
vygenerovani kapsy na redukci a přidáni loga.
Diff
4156
3368 d 1 h
kaklik
/Modules/ARM/ODROID-C1/CAD/
Navrzena kapsa pro redukci na eMMC kartu.
Diff
4155
3368 d 4 h
kaklik
/Modules/Sensors/RPS01A/SCH_PCB/
okotovani PCB.
Diff
4154
3378 d 12 h
jacho
/Modules/
Diff
4153
3378 d 12 h
jacho
/Modules/ADconverters/I2CADC01A/SCH_PCB/
Diff