Rev Age Author Path Log message Diff Changes
4160 3232 d 19 h kaklik /Modules/ Uprava konektoru. Diff
/Modules/Sensors/RPS01A/CAD
/Modules/Sensors/RPS01A/CAD/RPS01A_Dimensions.pdf
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
/Modules/PowerSupply/BATPOWER04C/CAD/4x4MLAB_frame.amf
/Modules/PowerSupply/BATPOWER04C/CAD/src/4x4MLAB_frame.scad
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv-cache.lib
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.bak
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.kicad_pcb
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.kicad_pcb-bak
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.net
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.sch
/Modules/Sensors/RPS01A/SCH_PCB/RPS01A.kicad_pcb
/Modules/Sensors/RPS01A/SCH_PCB/RPS01A.kicad_pcb-bak
4159 3235 d 12 h kaklik /Modules/ARM/ upravy kapsy pro redukci na eMMC. Diff
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_breakout_frame.gcode
/Modules/ARM/ODROID-U3/CAD/src/slic3r_config_multi_Black_PLA.ini
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_breakout_frame.amf
/Modules/ARM/ODROID-C1/CAD/src/ODROID-C1_MLAB_breakout_frame.scad
/Modules/ARM/Raspberry/CAD/RaspiAB_breakout_frame.amf
4151 3249 d 3 h kaklik / Vylepseni modelu pro snadnejsi tisk. Diff
/Designs/Measuring_instruments/RMDS02D/CAD/connectors_holder.amf
/Designs/Measuring_instruments/RMDS02D/CAD/src/connectors_holder.scad
/Designs/Measuring_instruments/RMDS02D/CAD/src/holder_print_config.ini
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.gcode
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
/Modules/ARM/ODROID-U3/CAD/src/slic3r_config.ini
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv-cache.lib
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.bak
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.pro
/Modules/PowerSupply/THERMOGEN01A/SCH_PCB/Energy_harv/Energy_harv.sch
4145 3253 d 23 h kaklik / aktualizace dokumentace. Diff
/Modules/ADconverters/I2CADC02A
/Modules/ADconverters/I2CADC02A/CAM_AMA
/Modules/ADconverters/I2CADC02A/CAM_DOC
/Modules/ADconverters/I2CADC02A/CAM_PROFI
/Modules/ADconverters/I2CADC02A/CAM_PROFI/Preview.gvp
/Modules/ADconverters/I2CADC02A/DOC
/Modules/ADconverters/I2CADC02A/DOC/HTML
/Modules/ADconverters/I2CADC02A/DOC/SRC
/Modules/ADconverters/I2CADC02A/PrjInfo.txt
/Modules/ADconverters/I2CADC02A/SCH_PCB
/Modules/ADconverters/I2CADC02A/SCH_PCB/I2CADC02A.pro
/Modules/ADconverters/I2CADC02A/SCH_PCB/I2CADC02A.sch
/Modules/ADconverters/I2CADC02A/SW
/Modules/ADconverters/I2CADC02A/pdf
/Designs/Measuring_instruments/RMDS02D/CAD/src/terarium_pad.scad
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
/Modules/CommSerial/I2CPWM01A/SCH_PCB/I2CPWM01A.pro
/Modules/Sensors/ALTIMET01A/pdf/MPL3115A2.pdf
4031 3365 d 11 h kaklik /Modules/ARM/ODROID-U3/CAD/ vylepseni tisknutelnosti prevysu. Diff
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
3989 3381 d 22 h kaklik /Modules/ vygenerovani nahledu vyrobnich dat. Diff
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_MLAB_breakout_frame.gcode
/Modules/ARM/ODROID-U3/CAD/src/slic3r_config.ini
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-B_Cu.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-B_Mask.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-Edge_Cuts.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-F_Cu.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-F_Mask.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A-F_SilkS.gbr
/Modules/Sensors/PCRD01A/CAM_PROFI/PCRD01A.drl
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_breakout_frame.gcode
3911 3415 d 10 h kaklik /Modules/ vylepseni dokumentace a aktualizace modelu. Diff
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_breakout_frame.amf
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_breakout_frame.gcode
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_breakout_frame.amf
/Modules/ARM/ODROID-U3/CAD/ODROID-U3_breakout_frame.gcode
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_coaster_frame.amf
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_coaster_frame.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.amf
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
/Modules/ARM/ODROID-U3/TODO.txt
/Modules/Mechanical/PLCASE1115/CAD/src/PLCASE1115.scad
3910 3417 d 21 h kaklik /Modules/ARM/ upravy dokumentace k jednodeskovym pocitacum v MLABu. Diff
/Modules/ARM/ODROID-C1/CAD/src/ODROID-C1_MLAB_breakout_frame.scad
/Modules/ARM/ODROID-U3/CAD/src
/Modules/ARM/ODROID-U3/CAD/src/ODROID-U3_MLAB_breakout_frame.scad
/Modules/ARM/ODroid-X2/CAD/src/ODROID-X2_MLAB_breakout_frame.scad
/Modules/ARM/Raspberry/DOC/src/img/raspberry_pi_B+.jpg
/Modules/ARM/Raspberry/DOC/src/img/raspberry_pi_B.jpg
/Modules/ARM/Raspberry/DOC/src/img/raspberry_pi_breakout_frame.png
/Modules/ARM/ODROID-C1/CAD/src/ODROID-C1_coaster_frame.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODroid-X2/CAD/src/ODROID-X2_MLAB_adapter.scad
/Modules/ARM/Raspberry/DOC/src/img/raspberry_pi_brakeout_frame.png