Rev 1814 – kaklik – 262 d 4 h (2024-02-19 21:55:10)
Repair the MLAB template.
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MLAB
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svnkaklik
MLAB_E
8magsvn
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Rev 1814
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1814
5029 d 16 h
kaklik
/
vygenerovani nahledu
Diff
1813
5029 d 16 h
kaklik
/
vygenerovani technologickych vystupu.
Diff
1812
5029 d 17 h
kaklik
/Designs/HAM Constructions/SDRX01B/PCB/
posunutí pouzdra operečního zesilovače.
Diff
1811
5030 d 3 h
kaklik
/
Diff
1810
5030 d 5 h
kaklik
/
aktualizace odmaskování. Odstaraněno odmaskování VIA
Diff
1809
5030 d 13 h
kaklik
/
drobné úpravy a vygenerování technologických výstupů
Diff
1808
5031 d 3 h
kaklik
/Modules/Clock/CLKGEN01B/PCB/
přidání prokovů
Diff
1807
5031 d 4 h
kaklik
/
pripravy k vyrobě
Diff
1806
5031 d 5 h
kaklik
/Designs/HAM Constructions/SDRX01B/
ppřidání spousty prokovů, srovnání popisků.
Diff
1805
5031 d 6 h
kaklik
/Designs/HAM Constructions/SDRX01B/PCB/
Diff
1804
5031 d 8 h
kaklik
/Designs/HAM Constructions/SDRX01B/PCB/
Diff
1803
5031 d 9 h
kaklik
/Designs/HAM Constructions/SDRX01B/
ve schematu aktualizovano zapojeni trimru
Diff
1802
5032 d 14 h
kaklik
/Modules/ARM/STM32F10xRxT/
upravy ve vyliti medi.
Diff
1801
5032 d 14 h
kaklik
/Modules/Sensors/
prejmenovani dokumentacni slozky GSENSE01A
Diff
1800
5032 d 14 h
kaklik
/Modules/Sensors/MMA7260/DOC/
Diff
1799
5032 d 15 h
kaklik
/Modules/PIC/PICPROGUSB02A/DOC/
oprava nadpisu
Diff
1798
5036 d 12 h
kaklik
/
aktualizace schemat v PDF.
Diff
1797
5039 d 16 h
kaklik
/Modules/ARM/STM32F10xRxT/
uprava potisku
Diff
1796
5039 d 16 h
kaklik
/Modules/ARM/STM32F10xRxT/
aktualizace vyrobnich dat.
Diff
1795
5040 d 2 h
kaklik
/Modules/CommSerial/ETH01A/
zacatek navrhu PCB.
Diff