Rev 1312 – ?author? – ?age? (?date?)
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Modules
Rev 1312
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Diff
1312
5754 d 3 h
kaklik
/Modules/Universal/
Doplneny popisy k nekterym dalsim modulum.
Diff
1311
5754 d 3 h
kaklik
/Modules/
Doplneny popisy k nekterym dalsim modulum.
Diff
1310
5758 d 17 h
miho
/Modules/H_Bridge/MPC17529HB01A/
Rozpracovaný návrh PCB
Diff
1309
5767 d 4 h
miho
/Modules/H_Bridge/MPC17529HB01A/
H-Bridge s obvodem MPC17529 (max 8V a 0.7A) - zatím jen schéma
Diff
1296
5769 d 3 h
kaklik
/
Pridan Seidenglanzuv navrh plosneho spoje pro dvouosy akcelerometr.
Diff
1268
5792 d 7 h
kaklik
/Modules/
zalozen novy modul urceny na generovani rychlych hodinovych signalu.
Diff
1266
5794 d 1 h
kaklik
/Modules/PIC/
doplneny popisy k nekterym modulum
Diff
1265
5794 d 1 h
kaklik
/Modules/PIC/
Diff
1264
5794 d 1 h
kaklik
/Modules/
doplneny popisy k nekterym modulum
Diff
1263
5794 d 6 h
kaklik
/Modules/
Diff
1262
5794 d 7 h
kaklik
/Modules/Measuring/RFdetect01A/
Dokoncen navrh plosneho spoje RFdetect01A/PCB/RFDETECT.pcb
Diff
1261
5794 d 10 h
kaklik
/Modules/
Diff
1260
5795 d 4 h
kaklik
/Modules/
Diff
1259
5796 d 5 h
kaklik
/Modules/CommSerial/USBIO01A/PCB/
pokrok v navrhu PCB pro USBIO.
Diff
1255
5803 d 4 h
kaklik
/Modules/CommSerial/USBIO01A/
pokrok v navrhu PCB
Diff
1254
5805 d 3 h
kaklik
/
pridani obrazku modulu TTLCAN01A
Diff
1253
5823 d 1 h
kaklik
/Modules/CommSerial/USBIO01A/
rozdelan plosny spoj pro modul USBIO.
Diff
1252
5823 d 11 h
kaklik
/Modules/
Diff
1251
5823 d 13 h
kaklik
/Modules/CommSerial/TTLCAN01B/CAM_PROFI/
vygenerovany technologicke vystupy.
Diff
1250
5823 d 23 h
kaklik
/Modules/CommSerial/TTLCAN01B/
opraveny chyby v modulu budice CAN.
Diff