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Modules/
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Rev 1334
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Diff
1312
5766 d 18 h
kaklik
/Modules/Universal/
Doplneny popisy k nekterym dalsim modulum.
Diff
1311
5766 d 18 h
kaklik
/Modules/
Doplneny popisy k nekterym dalsim modulum.
Diff
1310
5771 d 8 h
miho
/Modules/H_Bridge/MPC17529HB01A/
Rozpracovaný návrh PCB
Diff
1309
5779 d 19 h
miho
/Modules/H_Bridge/MPC17529HB01A/
H-Bridge s obvodem MPC17529 (max 8V a 0.7A) - zatím jen schéma
Diff
1296
5781 d 18 h
kaklik
/
Pridan Seidenglanzuv navrh plosneho spoje pro dvouosy akcelerometr.
Diff
1268
5804 d 22 h
kaklik
/Modules/
zalozen novy modul urceny na generovani rychlych hodinovych signalu.
Diff
1266
5806 d 16 h
kaklik
/Modules/PIC/
doplneny popisy k nekterym modulum
Diff
1265
5806 d 16 h
kaklik
/Modules/PIC/
Diff
1264
5806 d 16 h
kaklik
/Modules/
doplneny popisy k nekterym modulum
Diff
1263
5806 d 21 h
kaklik
/Modules/
Diff
1262
5806 d 22 h
kaklik
/Modules/Measuring/RFdetect01A/
Dokoncen navrh plosneho spoje RFdetect01A/PCB/RFDETECT.pcb
Diff
1261
5807 d 1 h
kaklik
/Modules/
Diff
1260
5807 d 19 h
kaklik
/Modules/
Diff
1259
5808 d 20 h
kaklik
/Modules/CommSerial/USBIO01A/PCB/
pokrok v navrhu PCB pro USBIO.
Diff
1255
5815 d 19 h
kaklik
/Modules/CommSerial/USBIO01A/
pokrok v navrhu PCB
Diff
1254
5817 d 18 h
kaklik
/
pridani obrazku modulu TTLCAN01A
Diff
1253
5835 d 16 h
kaklik
/Modules/CommSerial/USBIO01A/
rozdelan plosny spoj pro modul USBIO.
Diff
1252
5836 d 2 h
kaklik
/Modules/
Diff
1251
5836 d 4 h
kaklik
/Modules/CommSerial/TTLCAN01B/CAM_PROFI/
vygenerovany technologicke vystupy.
Diff
1250
5836 d 14 h
kaklik
/Modules/CommSerial/TTLCAN01B/
opraveny chyby v modulu budice CAN.
Diff