Rev 3908 – ?author? – ?age? (?date?)
?log?
Subversion Repositories
–
MLAB
MLAB
library
svnkaklik
MLAB_E
8magsvn
Català-Valencià – Catalan
中文 – Chinese (Simplified)
中文 – Chinese (Traditional)
Česky – Czech
Dansk – Danish
Nederlands – Dutch
English – English
Suomi – Finnish
Français – French
Deutsch – German
עברית – Hebrew
हिंदी – Hindi
Magyar – Hungarian
Bahasa Indonesia – Indonesian
Italiano – Italian
日本語 – Japanese
한국어 – Korean
Македонски – Macedonian
मराठी – Marathi
Norsk – Norwegian
Polski – Polish
Português – Portuguese
Português – Portuguese (Brazil)
Русский – Russian
Slovenčina – Slovak
Slovenščina – Slovenian
Español – Spanish
Svenska – Swedish
Türkçe – Turkish
Українська – Ukrainian
Oëzbekcha – Uzbek
(root)
/
Modules
@ 3920
Rev 3908
Go to most recent revision
Show changed files
Details
Blame
Compare with Previous
From rev:
To rev:
Max revs:
Search history for:
←Prev
1
2
Next→
Show All
Clear current filter
Rev
Age
Author
Path
Log message
Diff
3869
3496 d 17 h
kaklik
/
zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
Diff
3864
3502 d 18 h
jacho
/Modules/Sensors/PCRD02A/PCB_SCH/
Diff
3863
3503 d 4 h
jacho
/Modules/Sensors/PCRD01A/PCB_SCH/
Diff
3862
3505 d 0 h
kaklik
/Modules/PowerSW/TRIACSHARP02A/CAD/
zvetsena tloustka izolacnich sten pod okrajem modulu.
Diff
3861
3505 d 12 h
kaklik
/Modules/PowerSW/TRIACSHARP02A/
pridani dvojite izolacni prepazky a vyrenderovani objektu.
Diff
3860
3505 d 12 h
kaklik
/Modules/
nakreslena izolacni podlozka pod spinacovy modul.
Diff
3859
3507 d 21 h
kaklik
/Modules/ARM/
dalsi opravy chyb na podstavcich.
Diff
3858
3509 d 10 h
kaklik
/Modules/ARM/
opraveny chyby v navrhu mechanickych redukci.
Diff
3857
3509 d 17 h
ondra6ak
/Modules/CommRF/BLE01A/
Some fixes from TODO.txt done
Diff
3856
3509 d 23 h
kaklik
/Modules/ARM/ODROID-C1/
zaznam chyb na prvnim vytistenem prototypu.
Diff
3854
3510 d 13 h
kaklik
/Modules/ARM/
mechanicky adapter pro ODROID-C1 do MLABu.
Diff
3853
3512 d 22 h
kaklik
/Modules/CommRF/LNA01A/CAM_AMA/
priraveny vzory pro derovaní krabičky pro LNA.
Diff
3852
3514 d 17 h
kaklik
/Modules/ARM/ODROID-U3/
editace podlozky pro lepsi geometrii a usetreni materialu.
Diff
3851
3515 d 14 h
kaklik
/Modules/ARM/ODROID-U3/
zaznam stavu pred prekreslenim.
Diff
3850
3519 d 21 h
kaklik
/Modules/ARM/ODROID-U3/
zlepšeny tolerance PCB.
Diff
3849
3520 d 19 h
kaklik
/Modules/CommRF/BLE01A/pdf/
pridani datasheetu od obvodu na BLE.
Diff
3848
3520 d 20 h
kaklik
/
zapsani chyb v navrhu modulu.
Diff
3847
3520 d 20 h
kaklik
/Modules/CommRF/BLE01A/
Pridani komunikacniho modulu pro Bluetooth low energy.
Diff
3846
3525 d 19 h
kaklik
/Modules/ARM/ODROID-U3/
pridani nahledu ODROIDu do seznamu modulu.
Diff
3845
3525 d 22 h
kaklik
/Modules/ARM/ODROID-U3/DOC/SRC/img/
pridani obrazku adapteru.
Diff