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Rev Age Author Path Log message Diff
3869 3576 d 0 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.		 Diff
3864 3582 d 1 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3582 d 10 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3584 d 6 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3584 d 18 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3584 d 18 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3587 d 4 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3588 d 16 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3588 d 23 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3589 d 5 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3589 d 20 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3592 d 5 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3593 d 23 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3594 d 21 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3599 d 3 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3600 d 2 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3600 d 2 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3600 d 2 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3605 d 1 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3605 d 5 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff