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Rev Age Author Path Log message Diff
3900 3565 d 2 h jacho /Modules/Sensors/ Diff
3899 3565 d 15 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3566 d 2 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3566 d 19 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.		 Diff
3889 3566 d 21 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3887 3568 d 0 h jacho /Modules/PowerSupply/BATPOWER04C/SCH_PCB/ Diff
3877 3569 d 4 h kaklik /Modules/ zlepseni dokumentace. Diff
3875 3570 d 21 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3571 d 3 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3571 d 14 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3572 d 0 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3572 d 2 h kaklik /Modules/ uklid v databazi. Diff
3869 3573 d 21 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.		 Diff
3864 3579 d 22 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3580 d 7 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3582 d 4 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3582 d 15 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3582 d 16 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3585 d 1 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3586 d 14 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff