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Rev Age Author Path Log message Diff
3866 3384 d 5 h kaklik /Designs/LABduino/SW/bootloader/ zmena skriptu tak, aby adresu komunikacniho portu bral z parametru prikazoveho radku. Diff
3865 3385 d 7 h kakl /Designs/Measuring_instruments/RMDS02D/ Added a pictures.
Changed a block diagram.		 Diff
3864 3387 d 5 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3387 d 14 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3389 d 10 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3389 d 22 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3389 d 23 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3392 d 8 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3393 d 21 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3394 d 3 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3394 d 9 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3855 3394 d 22 h kaklik /Designs/Measuring_instruments/AWS02A/DOC/src/img/ pridani obrazku krytu na vlhkostni a teplotni cidlo. Diff
3854 3395 d 0 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3397 d 9 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3399 d 3 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3400 d 1 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3404 d 7 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3405 d 6 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3405 d 6 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3405 d 6 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff