| 3869 |
3363 d 12 h |
kaklik |
/ |
zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu. |
Diff |
| 3868 |
3364 d 20 h |
kaklik |
/Designs/Measuring_instruments/RMDS02D/ |
presunuti obrazku do dokumentacni slozky k fotografiim. |
Diff |
| 3867 |
3364 d 20 h |
kaklik |
/Designs/Measuring_instruments/RMDS02D/ |
vytvoreni adresarove struktury pro dokumentacni fotografie. |
Diff |
| 3866 |
3366 d 13 h |
kaklik |
/Designs/LABduino/SW/bootloader/ |
zmena skriptu tak, aby adresu komunikacniho portu bral z parametru prikazoveho radku. |
Diff |
| 3865 |
3367 d 15 h |
kakl |
/Designs/Measuring_instruments/RMDS02D/ |
Added a pictures.
Changed a block diagram. |
Diff |
| 3864 |
3369 d 13 h |
jacho |
/Modules/Sensors/PCRD02A/PCB_SCH/ |
|
Diff |
| 3863 |
3369 d 22 h |
jacho |
/Modules/Sensors/PCRD01A/PCB_SCH/ |
|
Diff |
| 3862 |
3371 d 18 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/CAD/ |
zvetsena tloustka izolacnich sten pod okrajem modulu. |
Diff |
| 3861 |
3372 d 6 h |
kaklik |
/Modules/PowerSW/TRIACSHARP02A/ |
pridani dvojite izolacni prepazky a vyrenderovani objektu. |
Diff |
| 3860 |
3372 d 7 h |
kaklik |
/Modules/ |
nakreslena izolacni podlozka pod spinacovy modul. |
Diff |
| 3859 |
3374 d 16 h |
kaklik |
/Modules/ARM/ |
dalsi opravy chyb na podstavcich. |
Diff |
| 3858 |
3376 d 4 h |
kaklik |
/Modules/ARM/ |
opraveny chyby v navrhu mechanickych redukci. |
Diff |
| 3857 |
3376 d 11 h |
ondra6ak |
/Modules/CommRF/BLE01A/ |
Some fixes from TODO.txt done |
Diff |
| 3856 |
3376 d 17 h |
kaklik |
/Modules/ARM/ODROID-C1/ |
zaznam chyb na prvnim vytistenem prototypu. |
Diff |
| 3855 |
3377 d 6 h |
kaklik |
/Designs/Measuring_instruments/AWS02A/DOC/src/img/ |
pridani obrazku krytu na vlhkostni a teplotni cidlo. |
Diff |
| 3854 |
3377 d 8 h |
kaklik |
/Modules/ARM/ |
mechanicky adapter pro ODROID-C1 do MLABu. |
Diff |
| 3853 |
3379 d 17 h |
kaklik |
/Modules/CommRF/LNA01A/CAM_AMA/ |
priraveny vzory pro derovaní krabičky pro LNA. |
Diff |
| 3852 |
3381 d 11 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
editace podlozky pro lepsi geometrii a usetreni materialu. |
Diff |
| 3851 |
3382 d 9 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zaznam stavu pred prekreslenim. |
Diff |
| 3850 |
3386 d 15 h |
kaklik |
/Modules/ARM/ODROID-U3/ |
zlepšeny tolerance PCB. |
Diff |