Rev Age Author Path Log message Diff
3906 3375 d 8 h kaklik /Modules/Sensors/IUC01A/pdf/ pridani datasheetu. Diff
3905 3375 d 9 h kaklik /Modules/ARM/RapsberryPi/ pridani dokumentacni slozky pro Raspberry Pi podlozku. Diff
3904 3375 d 10 h kaklik /Modules/Mechanical/PLCASE1115/ Navrh krytu na malou zakladni desku. Diff
3903 3375 d 13 h jacho /Modules/Measuring/GPS01B/SCH_PCB/ Diff
3902 3376 d 4 h jacho /Modules/Measuring/GPS01B/ Diff
3901 3376 d 4 h jacho /Modules/Measuring/GPS01B/SCH_PCB/ Diff
3900 3376 d 8 h jacho /Modules/Sensors/ Diff
3899 3376 d 21 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3377 d 8 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3378 d 1 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.
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3889 3378 d 2 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3887 3379 d 5 h jacho /Modules/PowerSupply/BATPOWER04C/SCH_PCB/ Diff
3877 3380 d 10 h kaklik /Modules/ zlepseni dokumentace. Diff
3875 3382 d 3 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3382 d 9 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3382 d 20 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3383 d 5 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3383 d 7 h kaklik /Modules/ uklid v databazi. Diff
3869 3385 d 2 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.
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3864 3391 d 3 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3391 d 12 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3393 d 9 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3393 d 20 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3393 d 21 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3396 d 6 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3397 d 19 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
3857 3398 d 1 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
3856 3398 d 8 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
3854 3398 d 22 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
3853 3401 d 7 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
3852 3403 d 2 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
3851 3403 d 23 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
3850 3408 d 5 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
3849 3409 d 4 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
3848 3409 d 4 h kaklik / zapsani chyb v navrhu modulu. Diff
3847 3409 d 5 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
3846 3414 d 4 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
3845 3414 d 7 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
3844 3417 d 5 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
3843 3417 d 22 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff