Rev Age Author Path Log message Diff
3900 3376 d 5 h jacho /Modules/Sensors/ Diff
3899 3376 d 18 h kaklik /Modules/ARM/ODroid-X2/CAD/ upravy technologickych nastaveni pro tisk. Diff
3891 3377 d 5 h kaklik /Modules/ARM/ODroid-X2/CAD/ optimalizace navrhu podlozky. Diff
3890 3377 d 22 h kaklik /Modules/ vylepseni nozicek, tak aby se daly montovat matky i na mista nozicek.
Pridani nozicky doprostred desky, aby nedochazelo k pruhybu.		 Diff
3889 3377 d 23 h kaklik /Modules/ zdrojove soubory prvni vytisknute verze. Diff
3887 3379 d 2 h jacho /Modules/PowerSupply/BATPOWER04C/SCH_PCB/ Diff
3877 3380 d 7 h kaklik /Modules/ zlepseni dokumentace. Diff
3875 3382 d 0 h kaklik /Modules/AVR/AT32TQ14401A/SCH_PCB/ pridani zapomenuteho schema. Diff
3874 3382 d 6 h kaklik /Modules/ARM/ODroid-X2/CAD/ opravy chyb v navrhu. Diff
3873 3382 d 17 h kaklik /Modules/ARM/ nakreslena podlozka pod odroid X2, Diff
3872 3383 d 2 h kaklik /Modules/AVR/AT32TQ14401A/ pokus o pridani QRkodu do potisku modulu. Diff
3871 3383 d 4 h kaklik /Modules/ uklid v databazi. Diff
3869 3384 d 23 h kaklik / zlepseni dokumentace.
Pokus o vytvoreni sablony KiCAD, ktera by umoznila kresleni plosnych spoju v prvnim kvadrantu.		 Diff
3864 3391 d 0 h jacho /Modules/Sensors/PCRD02A/PCB_SCH/ Diff
3863 3391 d 9 h jacho /Modules/Sensors/PCRD01A/PCB_SCH/ Diff
3862 3393 d 6 h kaklik /Modules/PowerSW/TRIACSHARP02A/CAD/ zvetsena tloustka izolacnich sten pod okrajem modulu. Diff
3861 3393 d 17 h kaklik /Modules/PowerSW/TRIACSHARP02A/ pridani dvojite izolacni prepazky a vyrenderovani objektu. Diff
3860 3393 d 18 h kaklik /Modules/ nakreslena izolacni podlozka pod spinacovy modul. Diff
3859 3396 d 3 h kaklik /Modules/ARM/ dalsi opravy chyb na podstavcich. Diff
3858 3397 d 16 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff