(kicad_pcb (version 20160815) (host pcbnew "(2016-09-17 revision 679eef1)-makepkg")
  (general
    (links 419)
    (no_connects 111)
    (area -17.262873 -85.09 85.593953 47.773001)
    (thickness 1.6)
    (drawings 4)
    (tracks 1015)
    (zones 0)
    (modules 166)
    (nets 97)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (1 In1.Cu signal)
    (2 In2.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.2)
    (user_trace_width 0.2)
    (user_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.7)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.1)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 2.70002 2.70002)
    (pad_drill 2.30124)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.300000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 /IO3V3)
  (net 2 GND)
  (net 3 /IO1V1)
  (net 4 "Net-(C10-Pad2)")
  (net 5 +3V3)
  (net 6 "Net-(C31-Pad1)")
  (net 7 "Net-(C32-Pad1)")
  (net 8 "Net-(C34-Pad1)")
  (net 9 "Net-(C35-Pad1)")
  (net 10 +5V)
  (net 11 "Net-(C38-Pad1)")
  (net 12 +1V1)
  (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI")
  (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS")
  (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK")
  (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z")
  (net 17 "Net-(C57-Pad1)")
  (net 18 "Net-(C58-Pad1)")
  (net 19 "Net-(C62-Pad1)")
  (net 20 /USBPORT/USB_VBUS_UP)
  (net 21 "Net-(C67-Pad1)")
  (net 22 "Net-(C68-Pad1)")
  (net 23 "Net-(C72-Pad1)")
  (net 24 "Net-(C73-Pad1)")
  (net 25 "Net-(C74-Pad1)")
  (net 26 "Net-(C75-Pad1)")
  (net 27 "Net-(D1-Pad2)")
  (net 28 "Net-(D2-Pad1)")
  (net 29 "Net-(D3-Pad1)")
  (net 30 "Net-(D4-Pad1)")
  (net 31 "Net-(D5-Pad1)")
  (net 32 "Net-(D6-Pad1)")
  (net 33 /TEST_TRSTZ)
  (net 34 /PWRCTL_POL_TDO)
  (net 35 /GANGED_SMBA2_SH_UP)
  (net 36 /FULLPWRMGMTZ_SMBA1)
  (net 37 /SMBUSZ_SS_SUS)
  (net 38 /AUTOENZ_HS_SUS)
  (net 39 "Net-(J12-Pad1)")
  (net 40 /SCL)
  (net 41 /SDA)
  (net 42 "Net-(R1-Pad2)")
  (net 43 "Net-(R3-Pad2)")
  (net 44 "Net-(R5-Pad2)")
  (net 45 "Net-(R16-Pad1)")
  (net 46 "Net-(R17-Pad1)")
  (net 47 "Net-(R24-Pad1)")
  (net 48 "Net-(R25-Pad2)")
  (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS")
  (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS")
  (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS")
  (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS")
  (net 53 "Net-(C63-Pad2)")
  (net 54 "Net-(C59-Pad2)")
  (net 55 "Net-(C60-Pad2)")
  (net 56 "Net-(C64-Pad2)")
  (net 57 "Net-(C69-Pad2)")
  (net 58 "Net-(C70-Pad2)")
  (net 59 "Net-(C76-Pad2)")
  (net 60 "Net-(C77-Pad2)")
  (net 61 "Net-(C79-Pad2)")
  (net 62 "Net-(C80-Pad2)")
  (net 63 /USBPORT/USB_SSTXM_DN1+)
  (net 64 /USBPORT/USB_SSTXM_DN1-)
  (net 65 /USBPORT/USB_SSTXM_UP+)
  (net 66 /USBPORT/USB_SSTXM_UP-)
  (net 67 /USBPORT/USB_SSTXM_DN2+)
  (net 68 /USBPORT/USB_SSTXM_DN2-)
  (net 69 /USBPORT/USB_SSTXM_DN4+)
  (net 70 /USBPORT/USB_SSTXM_DN4-)
  (net 71 /USBPORT/USB_SSTXM_DN3+)
  (net 72 /USBPORT/USB_SSTXM_DN3-)
  (net 73 /USBPORT/USB_SSRXM_DN1-)
  (net 74 /USBPORT/USB_SSRXM_DN1+)
  (net 75 /USBPORT/USB_DM_DN1-)
  (net 76 /USBPORT/USB_DM_DN1+)
  (net 77 /USBPORT/USB_SSRXM_UP+)
  (net 78 /USBPORT/USB_SSRXM_UP-)
  (net 79 /USBPORT/USB_DM_UP+)
  (net 80 /USBPORT/USB_DM_UP-)
  (net 81 /USBPORT/USB_SSRXM_DN2-)
  (net 82 /USBPORT/USB_SSRXM_DN2+)
  (net 83 /USBPORT/USB_DM_DN2-)
  (net 84 /USBPORT/USB_DM_DN2+)
  (net 85 /USBPORT/USB_SSRXM_DN4-)
  (net 86 /USBPORT/USB_SSRXM_DN4+)
  (net 87 /USBPORT/USB_DM_DN4-)
  (net 88 /USBPORT/USB_DM_DN4+)
  (net 89 /USBPORT/USB_SSRXM_DN3-)
  (net 90 /USBPORT/USB_SSRXM_DN3+)
  (net 91 /USBPORT/USB_DM_DN3-)
  (net 92 /USBPORT/USB_DM_DN3+)
  (net 93 "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4")
  (net 94 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3")
  (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2")
  (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1")
  (net_class Default "Toto je výchozí třída sítě."
    (clearance 0.2)
    (trace_width 0.2)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_gap 0.25)
    (diff_pair_width 0.2)
    (add_net +1V1)
    (add_net +3V3)
    (add_net +5V)
    (add_net /AUTOENZ_HS_SUS)
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3")
    (add_net "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4")
    (add_net /FULLPWRMGMTZ_SMBA1)
    (add_net /GANGED_SMBA2_SH_UP)
    (add_net /IO1V1)
    (add_net /IO3V3)
    (add_net /PWRCTL_POL_TDO)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /SMBUSZ_SS_SUS)
    (add_net /TEST_TRSTZ)
    (add_net /USBPORT/USB_DM_DN1+)
    (add_net /USBPORT/USB_DM_DN1-)
    (add_net /USBPORT/USB_DM_DN2+)
    (add_net /USBPORT/USB_DM_DN2-)
    (add_net /USBPORT/USB_DM_DN3+)
    (add_net /USBPORT/USB_DM_DN3-)
    (add_net /USBPORT/USB_DM_DN4+)
    (add_net /USBPORT/USB_DM_DN4-)
    (add_net /USBPORT/USB_DM_UP+)
    (add_net /USBPORT/USB_DM_UP-)
    (add_net /USBPORT/USB_SSRXM_DN1+)
    (add_net /USBPORT/USB_SSRXM_DN1-)
    (add_net /USBPORT/USB_SSRXM_DN2+)
    (add_net /USBPORT/USB_SSRXM_DN2-)
    (add_net /USBPORT/USB_SSRXM_DN3+)
    (add_net /USBPORT/USB_SSRXM_DN3-)
    (add_net /USBPORT/USB_SSRXM_DN4+)
    (add_net /USBPORT/USB_SSRXM_DN4-)
    (add_net /USBPORT/USB_SSRXM_UP+)
    (add_net /USBPORT/USB_SSRXM_UP-)
    (add_net /USBPORT/USB_SSTXM_DN1+)
    (add_net /USBPORT/USB_SSTXM_DN1-)
    (add_net /USBPORT/USB_SSTXM_DN2+)
    (add_net /USBPORT/USB_SSTXM_DN2-)
    (add_net /USBPORT/USB_SSTXM_DN3+)
    (add_net /USBPORT/USB_SSTXM_DN3-)
    (add_net /USBPORT/USB_SSTXM_DN4+)
    (add_net /USBPORT/USB_SSTXM_DN4-)
    (add_net /USBPORT/USB_SSTXM_UP+)
    (add_net /USBPORT/USB_SSTXM_UP-)
    (add_net /USBPORT/USB_VBUS_UP)
    (add_net GND)
    (add_net "Net-(C10-Pad2)")
    (add_net "Net-(C31-Pad1)")
    (add_net "Net-(C32-Pad1)")
    (add_net "Net-(C34-Pad1)")
    (add_net "Net-(C35-Pad1)")
    (add_net "Net-(C38-Pad1)")
    (add_net "Net-(C57-Pad1)")
    (add_net "Net-(C58-Pad1)")
    (add_net "Net-(C59-Pad2)")
    (add_net "Net-(C60-Pad2)")
    (add_net "Net-(C62-Pad1)")
    (add_net "Net-(C63-Pad2)")
    (add_net "Net-(C64-Pad2)")
    (add_net "Net-(C67-Pad1)")
    (add_net "Net-(C68-Pad1)")
    (add_net "Net-(C69-Pad2)")
    (add_net "Net-(C70-Pad2)")
    (add_net "Net-(C72-Pad1)")
    (add_net "Net-(C73-Pad1)")
    (add_net "Net-(C74-Pad1)")
    (add_net "Net-(C75-Pad1)")
    (add_net "Net-(C76-Pad2)")
    (add_net "Net-(C77-Pad2)")
    (add_net "Net-(C79-Pad2)")
    (add_net "Net-(C80-Pad2)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D4-Pad1)")
    (add_net "Net-(D5-Pad1)")
    (add_net "Net-(D6-Pad1)")
    (add_net "Net-(J12-Pad1)")
    (add_net "Net-(R1-Pad2)")
    (add_net "Net-(R16-Pad1)")
    (add_net "Net-(R17-Pad1)")
    (add_net "Net-(R24-Pad1)")
    (add_net "Net-(R25-Pad2)")
    (add_net "Net-(R3-Pad2)")
    (add_net "Net-(R5-Pad2)")
  )
  (module Mlab_Con:USB3_0_B locked (layer F.Cu) (tedit 583D4264)
    (at 34.62 -11.049)
    (tags "USB 3.0 B")
    (fp_text reference J14 (at 6.0198 6.4145) (layer F.SilkS))
    (fp_text value USB3_B (at 6.0198 0.0645) (layer F.Fab))
    (pad 5 thru_hole circle (at 1.75 -6.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 53 "Net-(C63-Pad2)"))
    (pad 6 thru_hole circle (at 3.52 -6.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 56 "Net-(C64-Pad2)"))
    (pad 7 thru_hole circle (at 6.02 -6.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 8 thru_hole circle (at 8.52 -6.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 77 /USBPORT/USB_SSRXM_UP+))
    (pad 9 thru_hole circle (at 10.25 -6.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 78 /USBPORT/USB_SSRXM_UP-))
    (pad 2 thru_hole circle (at 4.77 -4.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 79 /USBPORT/USB_DM_UP+))
    (pad 1 thru_hole circle (at 7.27 -4.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 20 /USBPORT/USB_VBUS_UP))
    (pad 4 thru_hole circle (at 7.27 -2.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole circle (at 4.77 -2.71 180) (size 1.524 1.524) (drill 0.8128) (layers *.Cu *.Mask F.SilkS)
      (net 80 /USBPORT/USB_DM_UP-))
    (pad 10 thru_hole circle (at 0 0 180) (size 2.70002 2.70002) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 19 "Net-(C62-Pad1)"))
    (pad 10 thru_hole circle (at 12.01928 0.0645 180) (size 2.70002 2.70002) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 19 "Net-(C62-Pad1)"))
    (model Connect.3dshapes/USB_B.wrl
      (at (xyz 0.05 -0.185 0.001))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:HTQFP-64_10x10mm_Pitch0.5mm (layer B.Cu) (tedit 583D4264)
    (at 40.64 -40.64 180)
    (descr "64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.5")
    (attr smd)
    (fp_text reference U2 (at 0 7.45 180) (layer B.SilkS))
    (fp_text value TUSB8041IPAPRQ1 (at 0 -7.45 180) (layer B.Fab))
    (pad 65 smd rect (at 0 0 90) (size 5 5) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -5.7 3.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 94 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3"))
    (pad 2 smd rect (at -5.7 3.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 3 smd rect (at -5.7 2.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2"))
    (pad 4 smd rect (at -5.7 2.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1"))
    (pad 5 smd rect (at -5.7 1.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 41 /SDA))
    (pad 6 smd rect (at -5.7 1.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 40 /SCL))
    (pad 7 smd rect (at -5.7 0.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 37 /SMBUSZ_SS_SUS))
    (pad 8 smd rect (at -5.7 0.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 36 /FULLPWRMGMTZ_SMBA1))
    (pad 9 smd rect (at -5.7 -0.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 34 /PWRCTL_POL_TDO))
    (pad 10 smd rect (at -5.7 -0.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 35 /GANGED_SMBA2_SH_UP))
    (pad 11 smd rect (at -5.7 -1.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
    (pad 12 smd rect (at -5.7 -1.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
    (pad 13 smd rect (at -5.7 -2.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 38 /AUTOENZ_HS_SUS))
    (pad 14 smd rect (at -5.7 -2.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
    (pad 15 smd rect (at -5.7 -3.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
    (pad 16 smd rect (at -5.7 -3.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 46 "Net-(R17-Pad1)"))
    (pad 17 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 33 /TEST_TRSTZ))
    (pad 18 smd rect (at -3.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C34-Pad1)"))
    (pad 19 smd rect (at -2.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 20 smd rect (at -2.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 21 smd rect (at -1.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 80 /USBPORT/USB_DM_UP-))
    (pad 22 smd rect (at -1.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 79 /USBPORT/USB_DM_UP+))
    (pad 23 smd rect (at -0.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 66 /USBPORT/USB_SSTXM_UP-))
    (pad 24 smd rect (at -0.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 65 /USBPORT/USB_SSTXM_UP+))
    (pad 25 smd rect (at 0.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 26 smd rect (at 0.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 78 /USBPORT/USB_SSRXM_UP-))
    (pad 27 smd rect (at 1.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 77 /USBPORT/USB_SSRXM_UP+))
    (pad 28 smd rect (at 1.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask))
    (pad 29 smd rect (at 2.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C31-Pad1)"))
    (pad 30 smd rect (at 2.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C32-Pad1)"))
    (pad 31 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 32 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 45 "Net-(R16-Pad1)"))
    (pad 33 smd rect (at 5.7 -3.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 75 /USBPORT/USB_DM_DN1-))
    (pad 34 smd rect (at 5.7 -3.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 76 /USBPORT/USB_DM_DN1+))
    (pad 35 smd rect (at 5.7 -2.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 64 /USBPORT/USB_SSTXM_DN1-))
    (pad 36 smd rect (at 5.7 -2.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 63 /USBPORT/USB_SSTXM_DN1+))
    (pad 37 smd rect (at 5.7 -1.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 38 smd rect (at 5.7 -1.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 73 /USBPORT/USB_SSRXM_DN1-))
    (pad 39 smd rect (at 5.7 -0.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 74 /USBPORT/USB_SSRXM_DN1+))
    (pad 40 smd rect (at 5.7 -0.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask))
    (pad 41 smd rect (at 5.7 0.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 83 /USBPORT/USB_DM_DN2-))
    (pad 42 smd rect (at 5.7 0.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 84 /USBPORT/USB_DM_DN2+))
    (pad 43 smd rect (at 5.7 1.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 68 /USBPORT/USB_SSTXM_DN2-))
    (pad 44 smd rect (at 5.7 1.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 67 /USBPORT/USB_SSTXM_DN2+))
    (pad 45 smd rect (at 5.7 2.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 46 smd rect (at 5.7 2.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 81 /USBPORT/USB_SSRXM_DN2-))
    (pad 47 smd rect (at 5.7 3.25 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 82 /USBPORT/USB_SSRXM_DN2+))
    (pad 48 smd rect (at 5.7 3.75 180) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 49 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 91 /USBPORT/USB_DM_DN3-))
    (pad 50 smd rect (at 3.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 92 /USBPORT/USB_DM_DN3+))
    (pad 51 smd rect (at 2.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 72 /USBPORT/USB_SSTXM_DN3-))
    (pad 52 smd rect (at 2.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 71 /USBPORT/USB_SSTXM_DN3+))
    (pad 53 smd rect (at 1.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 54 smd rect (at 1.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 89 /USBPORT/USB_SSRXM_DN3-))
    (pad 55 smd rect (at 0.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 90 /USBPORT/USB_SSRXM_DN3+))
    (pad 56 smd rect (at 0.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 87 /USBPORT/USB_DM_DN4-))
    (pad 57 smd rect (at -0.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 88 /USBPORT/USB_DM_DN4+))
    (pad 58 smd rect (at -0.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 70 /USBPORT/USB_SSTXM_DN4-))
    (pad 59 smd rect (at -1.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 69 /USBPORT/USB_SSTXM_DN4+))
    (pad 60 smd rect (at -1.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 61 smd rect (at -2.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 85 /USBPORT/USB_SSRXM_DN4-))
    (pad 62 smd rect (at -2.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 86 /USBPORT/USB_SSRXM_DN4+))
    (pad 63 smd rect (at -3.25 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 64 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers B.Cu B.Paste B.Mask)
      (net 93 "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4"))
    (model Housings_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 26.924)
    (attr smd)
    (fp_text reference C1 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1uF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 40.259)
    (attr smd)
    (fp_text reference C2 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -8.509 46.736)
    (attr smd)
    (fp_text reference C3 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 29.464)
    (attr smd)
    (fp_text reference C4 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -9.017 42.164)
    (attr smd)
    (fp_text reference C5 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 22.733)
    (attr smd)
    (fp_text reference C6 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 40.005)
    (attr smd)
    (fp_text reference C7 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 16.002)
    (attr smd)
    (fp_text reference C8 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 37.973)
    (attr smd)
    (fp_text reference C9 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -4.699 44.704)
    (attr smd)
    (fp_text reference C10 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 35.687)
    (attr smd)
    (fp_text reference C11 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -1.524 20.447)
    (attr smd)
    (fp_text reference C12 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 33.401)
    (attr smd)
    (fp_text reference C13 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -1.524 18.161)
    (attr smd)
    (fp_text reference C14 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 69.596 -59.944 270)
    (attr smd)
    (fp_text reference C15 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 31.242)
    (attr smd)
    (fp_text reference C16 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -1.524 16.002)
    (attr smd)
    (fp_text reference C17 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 29.21)
    (attr smd)
    (fp_text reference C18 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 33.655)
    (attr smd)
    (fp_text reference C19 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -12.7 42.164)
    (attr smd)
    (fp_text reference C20 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 18.161)
    (attr smd)
    (fp_text reference C21 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -9.017 37.973)
    (attr smd)
    (fp_text reference C22 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 24.892)
    (attr smd)
    (fp_text reference C23 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -9.017 40.005)
    (attr smd)
    (fp_text reference C24 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 27.178)
    (attr smd)
    (fp_text reference C25 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -9.017 44.45)
    (attr smd)
    (fp_text reference C26 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 31.496)
    (attr smd)
    (fp_text reference C27 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 20.447)
    (attr smd)
    (fp_text reference C28 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 35.941)
    (attr smd)
    (fp_text reference C29 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 38.227)
    (attr smd)
    (fp_text reference C30 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 28.448 -24.892 270)
    (attr smd)
    (fp_text reference C31 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C31-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 28.448 -32.004 90)
    (attr smd)
    (fp_text reference C32 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C32-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at -5.207 42.418)
    (attr smd)
    (fp_text reference C33 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C10-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 47.244 -34.544 270)
    (attr smd)
    (fp_text reference C34 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 1uF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C34-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 59.69 -14.732 180)
    (attr smd)
    (fp_text reference C35 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(C35-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 72.644 -34.544 90)
    (attr smd)
    (fp_text reference C36 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 75.184 -35.052 90)
    (attr smd)
    (fp_text reference C37 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 70.104 -34.544 90)
    (attr smd)
    (fp_text reference C38 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(C38-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 78.74 -45.212 90)
    (attr smd)
    (fp_text reference C39 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 78.74 -49.276 270)
    (attr smd)
    (fp_text reference C40 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 4.572 -10.414 180)
    (attr smd)
    (fp_text reference C41 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 5.588 -39.624)
    (attr smd)
    (fp_text reference C42 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 8.636 -19.304)
    (attr smd)
    (fp_text reference C43 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 7.112 -49.276)
    (attr smd)
    (fp_text reference C44 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 5.08 -25.908 90)
    (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (attr smd)
    (fp_text reference C45 (at -0.20066 3.29946 90) (layer B.SilkS))
    (fp_text value 100uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide)
    (fp_text user + (at -5.6515 2.79908 90) (layer B.SilkS))
    (pad 2 smd rect (at 3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_D.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 6.096 -59.944 90)
    (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (attr smd)
    (fp_text reference C46 (at -0.20066 3.29946 90) (layer B.SilkS))
    (fp_text value 100uF (at -0.09906 -3.59918 90) (layer B.SilkS) hide)
    (fp_text user + (at -5.6515 2.79908 90) (layer B.SilkS))
    (pad 2 smd rect (at 3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -3.175 0 90) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_D.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 13.716 -13.208)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C47 (at -0.20066 3.29946) (layer B.SilkS))
    (fp_text value 47uF (at -0.09906 -3.59918) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 12.192 -43.688)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C48 (at -0.20066 3.29946) (layer B.SilkS))
    (fp_text value 47uF (at -0.09906 -3.59918) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 45.72 -75.184 90)
    (attr smd)
    (fp_text reference C49 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 74.422 -70.866)
    (attr smd)
    (fp_text reference C50 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 34.036 -77.724 90)
    (attr smd)
    (fp_text reference C51 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 62.484 -71.628 180)
    (attr smd)
    (fp_text reference C52 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 24.892 -74.676 180)
    (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (attr smd)
    (fp_text reference C53 (at -0.20066 3.29946 180) (layer B.SilkS))
    (fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide)
    (fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS))
    (pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_D.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeD_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 56.896 -75.184 180)
    (descr "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (tags "Tantal Cap. , Size D, EIA-7343, Reflow,")
    (attr smd)
    (fp_text reference C54 (at -0.20066 3.29946 180) (layer B.SilkS))
    (fp_text value 100uF (at -0.09906 -3.59918 180) (layer B.SilkS) hide)
    (fp_text user + (at -5.6515 2.79908 180) (layer B.SilkS))
    (pad 2 smd rect (at 3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -3.175 0 180) (size 2.55016 2.70002) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_D.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 40.132 -76.708)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C55 (at -0.20066 3.29946) (layer B.SilkS))
    (fp_text value 47uF (at -0.09906 -3.59918) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_C:TantalC_SizeC_Reflow placed (layer B.Cu) (tedit 583D4264)
    (at 67.564 -77.216)
    (descr "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (tags "Tantal Cap. , Size C, EIA-6032, Reflow,")
    (attr smd)
    (fp_text reference C56 (at -0.20066 3.29946) (layer B.SilkS))
    (fp_text value 47uF (at -0.09906 -3.59918) (layer B.SilkS) hide)
    (fp_text user + (at -4.99872 2.55016) (layer B.SilkS))
    (pad 2 smd rect (at 2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -2.52476 0) (size 2.55016 2.49936) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (model MLAB_3D/Capacitors/c_tant_C.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 11.684 -27.94 90)
    (attr smd)
    (fp_text reference C57 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(C57-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 16.002 -18.034 90)
    (attr smd)
    (fp_text reference C58 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C58-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 20.066 -27.94 180)
    (attr smd)
    (fp_text reference C59 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 63 /USBPORT/USB_SSTXM_DN1+))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 54 "Net-(C59-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 20.066 -30.226 180)
    (attr smd)
    (fp_text reference C60 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 64 /USBPORT/USB_SSTXM_DN1-))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(C60-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 20.066 -18.034 90)
    (attr smd)
    (fp_text reference C61 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C58-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 50.8 -17.272)
    (attr smd)
    (fp_text reference C62 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(C62-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 37.084 -21.336 270)
    (attr smd)
    (fp_text reference C63 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 65 /USBPORT/USB_SSTXM_UP+))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 53 "Net-(C63-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 39.37 -21.336 270)
    (attr smd)
    (fp_text reference C64 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 66 /USBPORT/USB_SSTXM_UP-))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 56 "Net-(C64-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 50.8 -15.24)
    (attr smd)
    (fp_text reference C65 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(C62-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 46.736 -15.24)
    (attr smd)
    (fp_text reference C66 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10uF (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 20 /USBPORT/USB_VBUS_UP))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 11.176 -58.42 90)
    (attr smd)
    (fp_text reference C67 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 21 "Net-(C67-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 18.796 -47.244 270)
    (attr smd)
    (fp_text reference C68 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(C68-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 19.304 -57.404 180)
    (attr smd)
    (fp_text reference C69 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 67 /USBPORT/USB_SSTXM_DN2+))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 57 "Net-(C69-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 19.304 -59.944 180)
    (attr smd)
    (fp_text reference C70 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 68 /USBPORT/USB_SSTXM_DN2-))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(C70-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 21.336 -47.244 270)
    (attr smd)
    (fp_text reference C71 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(C68-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 54.356 -70.612 180)
    (attr smd)
    (fp_text reference C72 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 23 "Net-(C72-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 49.276 -78.74 180)
    (attr smd)
    (fp_text reference C73 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(C73-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 23.876 -70.104 180)
    (attr smd)
    (fp_text reference C74 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 25 "Net-(C74-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 34.036 -59.436 180)
    (attr smd)
    (fp_text reference C75 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 26 "Net-(C75-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 57.912 -62.23 90)
    (attr smd)
    (fp_text reference C76 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 69 /USBPORT/USB_SSTXM_DN4+))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(C76-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 60.198 -62.23 90)
    (attr smd)
    (fp_text reference C77 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 70 /USBPORT/USB_SSTXM_DN4-))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(C77-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 49.276 -76.2 180)
    (attr smd)
    (fp_text reference C78 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(C73-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 27.686 -61.976 90)
    (attr smd)
    (fp_text reference C79 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 71 /USBPORT/USB_SSTXM_DN3+))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(C79-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 30.226 -61.976 90)
    (attr smd)
    (fp_text reference C80 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 100nF (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 72 /USBPORT/USB_SSTXM_DN3-))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 62 "Net-(C80-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 34.036 -61.722 180)
    (attr smd)
    (fp_text reference C81 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 1nF (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 26 "Net-(C75-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_Con:DC2,1MM placed (layer F.Cu) (tedit 583D4264)
    (at 64.516 -10.16 270)
    (tags "DC2,1MM nap. konektor")
    (fp_text reference CON1 (at 6.8453 -5.7658 270) (layer F.SilkS))
    (fp_text value BARREL_JACK (at 2.2225 3.5433 270) (layer F.SilkS) hide)
    (pad 2 thru_hole rect (at 2.39 0 270) (size 3.81 3.81) (drill 2.8) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 1 thru_hole rect (at -3.81 0 270) (size 3.81 3.81) (drill 2.8) (layers *.Cu *.Mask F.SilkS)
      (net 9 "Net-(C35-Pad1)"))
    (pad 3 thru_hole rect (at -0.71 -5 270) (size 3.81 3.81) (drill 2.8) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
  )
  (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 583D4264)
    (at 73.406 -38.608)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D1 (at 0 2.54) (layer B.SilkS))
    (fp_text value LED (at 0 -3.81) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494) (layer B.SilkS))
    (pad 1 smd rect (at -2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 2 0) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 27 "Net-(D1-Pad2)"))
    (pad "" thru_hole circle (at 0 0) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 583D4264)
    (at 12.827 -36.97 180)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D2 (at 0 2.54 180) (layer B.SilkS))
    (fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS))
    (pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 583D4264)
    (at 12.827 -67.45 180)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D3 (at 0 2.54 180) (layer B.SilkS))
    (fp_text value LED (at 0 -3.81 180) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 180) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 180) (layer B.SilkS))
    (pad 1 smd rect (at -2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 29 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (pad "" thru_hole circle (at 0 0 180) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_D:LED_1206 locked placed (layer B.Cu) (tedit 583D4264)
    (at 36.97 -68.707 90)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D4 (at 0 2.54 90) (layer B.SilkS))
    (fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS))
    (pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 30 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 583D4264)
    (at 67.45 -68.707 90)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D5 (at 0 2.54 90) (layer B.SilkS))
    (fp_text value LED (at 0 -3.81 90) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 90) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 90) (layer B.SilkS))
    (pad 1 smd rect (at -2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 31 "Net-(D5-Pad1)"))
    (pad 2 smd rect (at 2 0 90) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (pad "" thru_hole circle (at 0 0 90) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_D:LED_1206 placed (layer B.Cu) (tedit 583D4264)
    (at 29.62 -11.049 270)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D6 (at 0 2.54 270) (layer B.SilkS))
    (fp_text value GREEN (at 0 -3.81 270) (layer B.SilkS) hide)
    (fp_text user A (at -1.80086 -1.5494 270) (layer B.SilkS))
    (fp_text user K (at 1.80086 -1.5494 270) (layer B.SilkS))
    (pad 1 smd rect (at -2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 32 "Net-(D6-Pad1)"))
    (pad 2 smd rect (at 2 0 270) (size 1.05 1.5) (layers B.Cu B.Paste B.Mask)
      (net 20 /USBPORT/USB_VBUS_UP))
    (pad "" thru_hole circle (at 0 0 270) (size 1.35 1.35) (drill 1.35) (layers *.Cu *.Mask B.SilkS))
    (model MLAB_3D/Diodes/MiniMELF_DO213AA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.181 -54.991 90)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J1 (at 0 -2.54 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 33 /TEST_TRSTZ))
    (pad 2 thru_hole rect (at 1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 33 /TEST_TRSTZ))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 53.721 -54.991 90)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J2 (at 0 -2.54 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 34 /PWRCTL_POL_TDO))
    (pad 2 thru_hole rect (at 1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 34 /PWRCTL_POL_TDO))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 56.261 -54.991 90)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J3 (at 0 -2.54 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
    (pad 2 thru_hole rect (at 1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 58.801 -54.991 90)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J4 (at 0 -2.54 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
    (pad 2 thru_hole rect (at 1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 61.341 -54.991 90)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J5 (at 0 -2.54 90) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54 90) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
    (pad 2 thru_hole rect (at 1.27 0 90) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -26.67)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J6 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 33 /TEST_TRSTZ))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 33 /TEST_TRSTZ))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -31.75)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J7 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 35 /GANGED_SMBA2_SH_UP))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 35 /GANGED_SMBA2_SH_UP))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -36.83)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J8 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 36 /FULLPWRMGMTZ_SMBA1))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 36 /FULLPWRMGMTZ_SMBA1))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -34.29)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J9 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 34 /PWRCTL_POL_TDO))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 34 /PWRCTL_POL_TDO))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -39.37)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J10 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 37 /SMBUSZ_SS_SUS))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 37 /SMBUSZ_SS_SUS))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x01 placed (layer F.Cu) (tedit 583D4264)
    (at 51.562 -29.21)
    (descr "pin header straight 2x01")
    (tags "pin header straight 2x01")
    (fp_text reference J11 (at 0 -2.54) (layer F.SilkS) hide)
    (fp_text value JUMP_2x1 (at 0 2.54) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 38 /AUTOENZ_HS_SUS))
    (pad 2 thru_hole rect (at 1.27 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 38 /AUTOENZ_HS_SUS))
    (model Pin_Headers/Pin_Header_Straight_2x01.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x05 placed (layer F.Cu) (tedit 583D4264)
    (at 61.722 -44.196 180)
    (descr "pin header straight 2x05")
    (tags "pin header straight 2x05")
    (fp_text reference J12 (at 0 -7.62 180) (layer F.SilkS) hide)
    (fp_text value JUMP_5X2 (at 0 7.62 180) (layer F.SilkS))
    (fp_text user 1 (at -2.921 -5.08 180) (layer F.SilkS))
    (pad 1 thru_hole rect (at -1.27 -5.08 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 39 "Net-(J12-Pad1)"))
    (pad 2 thru_hole rect (at 1.27 -5.08 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 39 "Net-(J12-Pad1)"))
    (pad 3 thru_hole rect (at -1.27 -2.54 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 40 /SCL))
    (pad 4 thru_hole rect (at 1.27 -2.54 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 40 /SCL))
    (pad 5 thru_hole rect (at -1.27 0 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 5 +3V3))
    (pad 6 thru_hole rect (at 1.27 0 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 5 +3V3))
    (pad 7 thru_hole rect (at -1.27 2.54 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 41 /SDA))
    (pad 8 thru_hole rect (at 1.27 2.54 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 41 /SDA))
    (pad 9 thru_hole rect (at -1.27 5.08 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 39 "Net-(J12-Pad1)"))
    (pad 10 thru_hole rect (at 1.27 5.08 180) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask F.SilkS)
      (net 39 "Net-(J12-Pad1)"))
    (model Pin_Headers/Pin_Header_Straight_2x05.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 11.684 -23.876 270)
    (attr smd)
    (fp_text reference L3 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(C57-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 11.176 -53.848 270)
    (attr smd)
    (fp_text reference L4 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 21 "Net-(C67-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 58.42 -70.612)
    (attr smd)
    (fp_text reference L5 (at 0 0.3175) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 23 "Net-(C72-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 27.432 -70.104)
    (attr smd)
    (fp_text reference L6 (at 0 0.3175) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 25 "Net-(C74-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_Mechanical:MountingHole_3mm locked placed (layer F.Cu) (tedit 583D4264)
    (at 76.2 -76.2)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference M1 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value HOLE (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm locked placed (layer F.Cu) (tedit 583D4264)
    (at 76.2 -5.08)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference M2 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value HOLE (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm locked placed (layer F.Cu) (tedit 583D4264)
    (at 5.08 -76.2)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference M3 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value HOLE (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_Mechanical:MountingHole_3mm locked placed (layer F.Cu) (tedit 583D4264)
    (at 5.08 -5.08)
    (descr "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (tags "Mounting hole, Befestigungsbohrung, 3mm, No Annular, Kein Restring,")
    (fp_text reference M4 (at 0 -4.191) (layer F.SilkS) hide)
    (fp_text value HOLE (at 0 4.191) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Adhes *.Mask)
      (net 2 GND) (clearance 1) (zone_connect 2))
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 72.39 -66.294)
    (attr smd)
    (fp_text reference R1 (at 0 0.3175) (layer B.SilkS))
    (fp_text value - (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(R1-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 78.994 -65.532 90)
    (attr smd)
    (fp_text reference R2 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 1k (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(R1-Pad2)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 72.39 -64.262)
    (attr smd)
    (fp_text reference R3 (at 0 0.3175) (layer B.SilkS))
    (fp_text value - (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(R3-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 76.454 -65.532 90)
    (attr smd)
    (fp_text reference R4 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 1k (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(R3-Pad2)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 68.834 -63.754 270)
    (attr smd)
    (fp_text reference R5 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value NOPOP (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(R5-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 75.438 -57.15)
    (attr smd)
    (fp_text reference R6 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1k (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(R5-Pad2)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -26.67 180)
    (attr smd)
    (fp_text reference R7 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 33 /TEST_TRSTZ))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -29.21)
    (attr smd)
    (fp_text reference R8 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 38 /AUTOENZ_HS_SUS))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.896 -46.736)
    (attr smd)
    (fp_text reference R9 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10k (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 41 /SDA))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -31.75 180)
    (attr smd)
    (fp_text reference R10 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 35 /GANGED_SMBA2_SH_UP))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -39.37)
    (attr smd)
    (fp_text reference R11 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 37 /SMBUSZ_SS_SUS))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 34.036 -28.448 270)
    (attr smd)
    (fp_text reference R12 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C32-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C31-Pad1)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.896 -42.672)
    (attr smd)
    (fp_text reference R13 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10k (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 40 /SCL))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -36.83 180)
    (attr smd)
    (fp_text reference R14 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 36 /FULLPWRMGMTZ_SMBA1))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 56.388 -34.29)
    (attr smd)
    (fp_text reference R15 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 34 /PWRCTL_POL_TDO))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 35.56 -32.512 180)
    (attr smd)
    (fp_text reference R16 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 9k53 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 45 "Net-(R16-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 45.72 -30.988)
    (attr smd)
    (fp_text reference R17 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 10k (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 46 "Net-(R17-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 45.72 -28.702 180)
    (attr smd)
    (fp_text reference R18 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 90k9 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 20 /USBPORT/USB_VBUS_UP))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 46 "Net-(R17-Pad1)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 52.832 -48.768 180)
    (attr smd)
    (fp_text reference R19 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 93 "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 52.832 -46.736 180)
    (attr smd)
    (fp_text reference R20 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 94 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 52.832 -44.704 180)
    (attr smd)
    (fp_text reference R21 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 52.832 -42.672 180)
    (attr smd)
    (fp_text reference R22 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 4K7 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 78.486 -38.608)
    (attr smd)
    (fp_text reference R23 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 27 "Net-(D1-Pad2)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 68.58 -48.768 180)
    (attr smd)
    (fp_text reference R24 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value - (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(R24-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 74.676 -51.562 180)
    (attr smd)
    (fp_text reference R25 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 1K87 (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 48 "Net-(R25-Pad2)"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 71.12 -51.562 180)
    (attr smd)
    (fp_text reference R26 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 48 "Net-(R25-Pad2)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 2.032 -15.24 90)
    (attr smd)
    (fp_text reference R27 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 2.54 -49.276 270)
    (attr smd)
    (fp_text reference R28 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 10K (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 17.272 -39.624 90)
    (attr smd)
    (fp_text reference R29 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 14.732 -71.12 90)
    (attr smd)
    (fp_text reference R30 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 29 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 41.656 -67.056 180)
    (attr smd)
    (fp_text reference R31 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 10K (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 71.12 -69.596 90)
    (attr smd)
    (fp_text reference R32 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 10K (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 37.846 -63.754 270)
    (attr smd)
    (fp_text reference R33 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 30 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 66.548 -63.754 270)
    (attr smd)
    (fp_text reference R34 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 31 "Net-(D5-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 18.034 -18.034 90)
    (attr smd)
    (fp_text reference R35 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(C58-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 50.8 -13.208)
    (attr smd)
    (fp_text reference R36 (at 0 0.3175) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(C62-Pad1)"))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 16.256 -47.244 270)
    (attr smd)
    (fp_text reference R38 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(C68-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 49.276 -73.152 180)
    (attr smd)
    (fp_text reference R39 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(C73-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 placed (layer B.Cu) (tedit 583D4264)
    (at 34.036 -64.008 180)
    (attr smd)
    (fp_text reference R40 (at 0 0.3175 180) (layer B.SilkS))
    (fp_text value 1M (at 0.127 -0.381 180) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 26 "Net-(C75-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 180) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_T:TO-263-5 placed (layer B.Cu) (tedit 583D4264)
    (at 64.262 -33.528)
    (attr smd)
    (fp_text reference U3 (at 0 5.969) (layer B.SilkS))
    (fp_text value TPS7A4533KTTR (at 0 3.937) (layer B.Fab))
    (pad 2 smd rect (at -1.69926 0) (size 1.143 3.4) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 3 smd rect (at 0 10.795) (size 10.80008 9.99998) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 1.69926 0) (size 1.143 3.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 3 smd rect (at 0 0) (size 1.143 3.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -3.40106 0) (size 1.143 3.4) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 5 smd rect (at 3.40106 0) (size 1.143 3.4) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(C38-Pad1)"))
  )
  (module Mlab_IO:TSSOP-8_4.4x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 583D4264)
    (at 75.438 -60.96 180)
    (descr "8-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0.254 0 180) (layer B.SilkS))
    (fp_text value CAT24C04YI-GT3OSCT-ND (at 0 -2.55 180) (layer B.Fab))
    (pad 1 smd rect (at -2.95 0.975 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask))
    (pad 2 smd rect (at -2.95 0.325 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(R1-Pad2)"))
    (pad 3 smd rect (at -2.95 -0.325 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(R3-Pad2)"))
    (pad 4 smd rect (at -2.95 -0.975 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 5 smd rect (at 2.95 -0.975 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 41 /SDA))
    (pad 6 smd rect (at 2.95 -0.325 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 40 /SCL))
    (pad 7 smd rect (at 2.95 0.325 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(R5-Pad2)"))
    (pad 8 smd rect (at 2.95 0.975 180) (size 1.45 0.45) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (model Housings_SSOP.3dshapes/TSSOP-8_4.4x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:QFN-20-1EP_5x5mm_Pitch0.65mm (layer B.Cu) (tedit 583D4264)
    (at 73.914 -46.736 180)
    (descr "20-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFN 0.65")
    (attr smd)
    (fp_text reference U4 (at 0 3.525 180) (layer B.SilkS))
    (fp_text value TPS74801RGWR (at 0 -3.525 180) (layer B.Fab))
    (pad 1 smd rect (at -2.4 1.3 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 2 smd rect (at -2.4 0.65 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -2.4 0 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 4 smd rect (at -2.4 -0.65 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 5 smd rect (at -2.4 -1.3 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 6 smd rect (at -1.3 -2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 7 smd rect (at -0.65 -2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 8 smd rect (at 0 -2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 9 smd rect (at 0.65 -2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 10 smd rect (at 1.3 -2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 11 smd rect (at 2.4 -1.3 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (pad 12 smd rect (at 2.4 -0.65 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 13 smd rect (at 2.4 0 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 2.4 0.65 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 15 smd rect (at 2.4 1.3 180) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(R24-Pad1)"))
    (pad 16 smd rect (at 1.3 2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 48 "Net-(R25-Pad2)"))
    (pad 17 smd rect (at 0.65 2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 18 smd rect (at 0 2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 19 smd rect (at -0.65 2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 20 smd rect (at -1.3 2.4 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (pad 21 smd rect (at 0.8375 -0.8375 180) (size 1.675 1.675) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 21 smd rect (at 0.8375 0.8375 180) (size 1.675 1.675) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 21 smd rect (at -0.8375 -0.8375 180) (size 1.675 1.675) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 21 smd rect (at -0.8375 0.8375 180) (size 1.675 1.675) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/QFN-20-1EP_5x5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 583D4264)
    (at 5.588 -14.732 90)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U5 (at 0 2.55 90) (layer B.SilkS))
    (fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab))
    (pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 96 "/DOWNSTREAM PORT POWER SWITCHES/PWRON1_BATEN1"))
    (pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 13 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR1Z_TDI"))
    (pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 49 "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS"))
    (pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 583D4264)
    (at 4.572 -44.196 90)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U6 (at 0 2.55 90) (layer B.SilkS))
    (fp_text value TPS2001CDGN (at 0 -2.55 90) (layer B.Fab))
    (pad 1 smd rect (at -2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 3 smd rect (at -2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 4 smd rect (at -2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 95 "/DOWNSTREAM PORT POWER SWITCHES/PWRON2_BATEN2"))
    (pad 5 smd rect (at 2.105 -0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 14 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR2Z_TMS"))
    (pad 6 smd rect (at 2.105 -0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (pad 7 smd rect (at 2.105 0.325 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (pad 8 smd rect (at 2.105 0.975 90) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 50 "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS"))
    (pad 9 smd rect (at 0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 -0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 0.47 90) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 583D4264)
    (at 42.164 -71.12 180)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U7 (at 0 2.55 180) (layer B.SilkS))
    (fp_text value TPS2001CDGN (at 0 -2.55 180) (layer B.Fab))
    (pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 4 smd rect (at -2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 94 "/DOWNSTREAM PORT POWER SWITCHES/PWRON3_BATEN3"))
    (pad 5 smd rect (at 2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 15 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR3Z_TCK"))
    (pad 6 smd rect (at 2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (pad 7 smd rect (at 2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (pad 8 smd rect (at 2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 51 "/DOWNSTREAM PORT POWER SWITCHES/DN3_VBUS"))
    (pad 9 smd rect (at 0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_IO:MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer B.Cu) (tedit 583D4264)
    (at 68.58 -73.66 180)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U8 (at 0 2.55 180) (layer B.SilkS))
    (fp_text value TPS2001CDGN (at 0 -2.55 180) (layer B.Fab))
    (pad 1 smd rect (at -2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 3 smd rect (at -2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 10 +5V))
    (pad 4 smd rect (at -2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 93 "/DOWNSTREAM PORT POWER SWITCHES/PWRON4_BATEN4"))
    (pad 5 smd rect (at 2.105 -0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 16 "/DOWNSTREAM PORT POWER SWITCHES/OVERCUR4Z"))
    (pad 6 smd rect (at 2.105 -0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (pad 7 smd rect (at 2.105 0.325 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (pad 8 smd rect (at 2.105 0.975 180) (size 1.55 0.42) (layers B.Cu B.Paste B.Mask)
      (net 52 "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS"))
    (pad 9 smd rect (at 0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at 0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 -0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (pad 9 smd rect (at -0.42 0.47 180) (size 0.84 0.94) (layers B.Cu B.Paste B.Mask)
      (net 2 GND) (solder_paste_margin_ratio -0.2))
    (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystals:Crystal_HC49-U_Vertical (layer F.Cu) (tedit 583D4264)
    (at 32.512 -28.448 90)
    (descr "Crystal, Quarz, HC49/U, vertical, stehend,")
    (tags "Crystal, Quarz, HC49/U, vertical, stehend,")
    (fp_text reference Y1 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 24MHz (at 0 3.81 90) (layer F.Fab))
    (pad 1 thru_hole circle (at -2.44094 0 90) (size 1.50114 1.50114) (drill 0.8001) (layers *.Cu *.Mask F.SilkS)
      (net 6 "Net-(C31-Pad1)"))
    (pad 2 thru_hole circle (at 2.44094 0 90) (size 1.50114 1.50114) (drill 0.8001) (layers *.Cu *.Mask F.SilkS)
      (net 7 "Net-(C32-Pad1)"))
  )
  (module Mlab_Con:USB3_0_A locked (layer F.Cu) (tedit 583D4264)
    (at 12.827 -31.97 270)
    (descr "USB A connector")
    (tags "USB USB_A")
    (fp_text reference J13 (at 6.4516 3.7211 270) (layer F.SilkS))
    (fp_text value USB3_A (at 6.7183 6.2992 270) (layer F.Fab))
    (pad 9 thru_hole circle (at 2.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 55 "Net-(C60-Pad2)"))
    (pad 8 thru_hole circle (at 4.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 54 "Net-(C59-Pad2)"))
    (pad 7 thru_hole circle (at 6.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 6 thru_hole circle (at 8.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 73 /USBPORT/USB_SSRXM_DN1-))
    (pad 5 thru_hole circle (at 10.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 74 /USBPORT/USB_SSRXM_DN1+))
    (pad 1 thru_hole circle (at 3.07 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 17 "Net-(C57-Pad1)"))
    (pad 10 thru_hole circle (at 13.14 0 180) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 18 "Net-(C58-Pad1)"))
    (pad 10 thru_hole circle (at 0 0 180) (size 2.99974 2.99974) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 18 "Net-(C58-Pad1)"))
    (pad 4 thru_hole circle (at 10.07 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole circle (at 7.57 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 75 /USBPORT/USB_DM_DN1-))
    (pad 2 thru_hole circle (at 5.57 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 76 /USBPORT/USB_DM_DN1+))
    (model Connect.3dshapes/USB_A.wrl
      (at (xyz 0.14 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Con:USB3_0_A locked (layer F.Cu) (tedit 583D4264)
    (at 12.827 -62.45 270)
    (descr "USB A connector")
    (tags "USB USB_A")
    (fp_text reference J15 (at 6.4516 3.7211 270) (layer F.SilkS))
    (fp_text value USB3_A (at 6.7183 6.2992 270) (layer F.Fab))
    (pad 9 thru_hole circle (at 2.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 58 "Net-(C70-Pad2)"))
    (pad 8 thru_hole circle (at 4.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 57 "Net-(C69-Pad2)"))
    (pad 7 thru_hole circle (at 6.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 6 thru_hole circle (at 8.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 81 /USBPORT/USB_SSRXM_DN2-))
    (pad 5 thru_hole circle (at 10.57 -3.5 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 82 /USBPORT/USB_SSRXM_DN2+))
    (pad 1 thru_hole circle (at 3.07 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 21 "Net-(C67-Pad1)"))
    (pad 10 thru_hole circle (at 13.14 0 180) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 22 "Net-(C68-Pad1)"))
    (pad 10 thru_hole circle (at 0 0 180) (size 2.99974 2.99974) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 22 "Net-(C68-Pad1)"))
    (pad 4 thru_hole circle (at 10.07 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole circle (at 7.57 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 83 /USBPORT/USB_DM_DN2-))
    (pad 2 thru_hole circle (at 5.57 -2 180) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 84 /USBPORT/USB_DM_DN2+))
    (model Connect.3dshapes/USB_A.wrl
      (at (xyz 0.14 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Con:USB3_0_A locked (layer F.Cu) (tedit 583D4264)
    (at 62.45 -68.707 180)
    (descr "USB A connector")
    (tags "USB USB_A")
    (fp_text reference J16 (at 6.4516 3.7211 180) (layer F.SilkS))
    (fp_text value USB3_A (at 6.7183 6.2992 180) (layer F.Fab))
    (pad 9 thru_hole circle (at 2.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 60 "Net-(C77-Pad2)"))
    (pad 8 thru_hole circle (at 4.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 59 "Net-(C76-Pad2)"))
    (pad 7 thru_hole circle (at 6.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 6 thru_hole circle (at 8.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 85 /USBPORT/USB_SSRXM_DN4-))
    (pad 5 thru_hole circle (at 10.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 86 /USBPORT/USB_SSRXM_DN4+))
    (pad 1 thru_hole circle (at 3.07 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 23 "Net-(C72-Pad1)"))
    (pad 10 thru_hole circle (at 13.14 0 90) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 24 "Net-(C73-Pad1)"))
    (pad 10 thru_hole circle (at 0 0 90) (size 2.99974 2.99974) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 24 "Net-(C73-Pad1)"))
    (pad 4 thru_hole circle (at 10.07 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole circle (at 7.57 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 87 /USBPORT/USB_DM_DN4-))
    (pad 2 thru_hole circle (at 5.57 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 88 /USBPORT/USB_DM_DN4+))
    (model Connect.3dshapes/USB_A.wrl
      (at (xyz 0.14 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Con:USB3_0_A locked (layer F.Cu) (tedit 583D4264)
    (at 31.97 -68.707 180)
    (descr "USB A connector")
    (tags "USB USB_A")
    (fp_text reference J17 (at 6.4516 3.7211 180) (layer F.SilkS))
    (fp_text value USB3_A (at 6.7183 6.2992 180) (layer F.Fab))
    (pad 9 thru_hole circle (at 2.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 62 "Net-(C80-Pad2)"))
    (pad 8 thru_hole circle (at 4.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 61 "Net-(C79-Pad2)"))
    (pad 7 thru_hole circle (at 6.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 6 thru_hole circle (at 8.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 89 /USBPORT/USB_SSRXM_DN3-))
    (pad 5 thru_hole circle (at 10.57 -3.5 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 90 /USBPORT/USB_SSRXM_DN3+))
    (pad 1 thru_hole circle (at 3.07 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 25 "Net-(C74-Pad1)"))
    (pad 10 thru_hole circle (at 13.14 0 90) (size 2.99974 2.99974) (drill 2.30124) (layers *.Cu *.Mask F.SilkS)
      (net 26 "Net-(C75-Pad1)"))
    (pad 10 thru_hole circle (at 0 0 90) (size 2.99974 2.99974) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 26 "Net-(C75-Pad1)"))
    (pad 4 thru_hole circle (at 10.07 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole circle (at 7.57 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 91 /USBPORT/USB_DM_DN3-))
    (pad 2 thru_hole circle (at 5.57 -2 90) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask F.SilkS)
      (net 92 /USBPORT/USB_DM_DN3+))
    (model Connect.3dshapes/USB_A.wrl
      (at (xyz 0.14 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_Pin_Headers:Straight_2x03 (layer F.Cu) (tedit 583D4264)
    (at 76.2 -14.732)
    (descr "pin header straight 2x03")
    (tags "pin header straight 2x03")
    (fp_text reference J18 (at 0 -5) (layer F.SilkS) hide)
    (fp_text value JUMP_3X2 (at 0 5) (layer F.SilkS) hide)
    (fp_text user 1 (at -2 -2) (layer F.SilkS))
    (pad 1 thru_hole rect (at -1 -2) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 2 thru_hole rect (at 1 -2) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 3 thru_hole rect (at -1 0) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 9 "Net-(C35-Pad1)"))
    (pad 4 thru_hole rect (at 1 0) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 9 "Net-(C35-Pad1)"))
    (pad 5 thru_hole rect (at -1 2) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (pad 6 thru_hole rect (at 1 2) (size 1 1) (drill 0.762) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
    (model Pin_Headers/Pin_Header_Straight_2x03.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Mlab_SW:Prepinaci_3A_SL19121 placed (layer F.Cu) (tedit 583D4264)
    (at 75.692 -25.908 180)
    (tags "Prepinaci tlacitko 3A")
    (fp_text reference SW1 (at 0.0254 -7.7216 180) (layer F.SilkS))
    (fp_text value SPST (at -4.5593 -0.2667 270) (layer F.SilkS) hide)
    (pad 3 thru_hole rect (at 0 4.7 180) (size 3.4 3.4) (drill 2.3) (layers *.Cu *.Mask F.SilkS))
    (pad 2 thru_hole rect (at 0 0 180) (size 3.4 3.4) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 10 +5V))
    (pad 1 thru_hole rect (at 0 -4.7 180) (size 3.4 3.4) (drill 2.3) (layers *.Cu *.Mask F.SilkS)
      (net 9 "Net-(C35-Pad1)"))
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 583D4264)
    (at 78.232 -52.832 270)
    (attr smd)
    (fp_text reference L2 (at 0 0.3175 270) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381 270) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 3 /IO1V1))
    (pad 2 smd rect (at 0.9525 0 270) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 12 +1V1))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 583D4264)
    (at 29.718 -16.002 90)
    (attr smd)
    (fp_text reference R37 (at 0 0.3175 90) (layer B.SilkS))
    (fp_text value 330R (at 0.127 -0.381 90) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 32 "Net-(D6-Pad1)"))
    (pad 2 smd rect (at 0.9525 0 90) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Mlab_R:SMD-0805 (layer B.Cu) (tedit 583D4264)
    (at -13.716 21.844)
    (attr smd)
    (fp_text reference L1 (at 0 0.3175) (layer B.SilkS))
    (fp_text value BLM21PG300SN1D (at 0.127 -0.381) (layer B.SilkS))
    (pad 1 smd rect (at -0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 1 /IO3V3))
    (pad 2 smd rect (at 0.9525 0) (size 0.889 1.397) (layers B.Cu B.Paste B.Mask)
      (net 5 +3V3))
    (model MLAB_3D/Resistors/chip_cms.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.1 0.1 0.1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_line (start 0.254 -0.254) (end 0.254 -81.026) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 81.026 -0.254) (end 0.254 -0.254) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 81.026 -81.026) (end 81.026 -0.254) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 0.254 -81.026) (end 81.026 -81.026) (angle 90) (layer Edge.Cuts) (width 0.1))
  (zone (net 9) (net_name "Net-(C35-Pad1)") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 62.23 -16.764) (xy 70.358 -16.764) (xy 70.358 -23.114) (xy 77.724 -23.114) (xy 77.724 -19.05)
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        (xy 67.056 -11.684) (xy 62.23 -11.684)
      )
    )
  )
  (zone (net 10) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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      )
    )
  )
  (zone (net 5) (net_name +3V3) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 76.962 -44.958) (xy 76.962 -45.72) (xy 75.692 -45.72) (xy 75.692 -44.958) (xy 72.136 -44.958)
        (xy 72.136 -45.72) (xy 70.866 -45.72) (xy 69.85 -45.72) (xy 69.85 -37.846) (xy 65.278 -37.846)
      )
    )
  )
  (zone (net 49) (net_name "/DOWNSTREAM PORT POWER SWITCHES/DN1_VBUS") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 5.08 -16.002) (xy 6.858 -16.002) (xy 6.858 -21.336) (xy 12.7 -21.336) (xy 12.7 -23.622)
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        (xy 5.08 -20.32)
      )
    )
  )
  (zone (net 50) (net_name "/DOWNSTREAM PORT POWER SWITCHES/DN2_VBUS") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 9.144 -58.166) (xy 9.144 -53.594) (xy 12.192 -53.594)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -2.286 -83.566) (xy 83.312 -83.312) (xy 85.09 1.524) (xy -1.524 3.048)
      )
    )
  )
  (zone (net 10) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 69.85 -74.168) (xy 71.628 -74.168) (xy 74.168 -71.882)
      )
    )
  )
  (zone (net 52) (net_name "/DOWNSTREAM PORT POWER SWITCHES/DN4_VBUS") (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 58.928 -69.85) (xy 59.944 -69.85) (xy 59.944 -73.406) (xy 61.976 -73.406) (xy 65.024 -73.406)
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        (xy 58.42 -77.216) (xy 58.42 -73.406) (xy 58.928 -73.406)
      )
    )
  )
  (zone (net 10) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 43.434 -70.612) (xy 43.434 -71.628) (xy 45.212 -71.628) (xy 45.212 -73.406) (xy 44.958 -73.406)
        (xy 44.958 -74.676) (xy 46.736 -74.676) (xy 46.736 -70.612)
      )
    )
  )
  (zone (net 12) (net_name +1V1) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
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        (xy 74.93 -50.292) (xy 73.66 -50.292)
      )
    )
  )
  (zone (net 10) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 5.08 -13.208) (xy 6.096 -13.208) (xy 6.096 -9.652) (xy 5.08 -9.652)
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    )
  )
  (zone (net 10) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 4.064 -42.926) (xy 5.08 -42.926) (xy 5.08 -38.862) (xy 4.064 -38.862)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -3.556 -85.09) (xy 84.582 -83.82) (xy 84.328 2.54) (xy -4.064 2.286)
      )
    )
  )
)
