Line No. | Rev | Author | Line |
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1 | 75 | jacho | (module TSSOP-16_4.4x5mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77) |
2 | (descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)") |
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3 | (tags "SSOP 0.65") |
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4 | (attr smd) |
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5 | (fp_text reference U1 (at 0 -3.55) (layer F.SilkS) |
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6 | (effects (font (size 1 1) (thickness 0.15))) |
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7 | ) |
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8 | (fp_text value PCA9531 (at 0 3.55) (layer F.Fab) |
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9 | (effects (font (size 1 1) (thickness 0.15))) |
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10 | ) |
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11 | (fp_line (start -3.95 -2.8) (end -3.95 2.8) (layer F.CrtYd) (width 0.05)) |
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12 | (fp_line (start 3.95 -2.8) (end 3.95 2.8) (layer F.CrtYd) (width 0.05)) |
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13 | (fp_line (start -3.95 -2.8) (end 3.95 -2.8) (layer F.CrtYd) (width 0.05)) |
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14 | (fp_line (start -3.95 2.8) (end 3.95 2.8) (layer F.CrtYd) (width 0.05)) |
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15 | (fp_line (start -2.2 2.725) (end 2.2 2.725) (layer F.SilkS) (width 0.15)) |
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16 | (fp_line (start -3.775 -2.725) (end 2.2 -2.725) (layer F.SilkS) (width 0.15)) |
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17 | (pad 1 smd rect (at -2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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18 | (pad 2 smd rect (at -2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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19 | (pad 3 smd rect (at -2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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20 | (pad 4 smd rect (at -2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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21 | (pad 5 smd rect (at -2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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22 | (pad 6 smd rect (at -2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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23 | (pad 7 smd rect (at -2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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24 | (pad 8 smd rect (at -2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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25 | (pad 9 smd rect (at 2.95 2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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26 | (pad 10 smd rect (at 2.95 1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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27 | (pad 11 smd rect (at 2.95 0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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28 | (pad 12 smd rect (at 2.95 0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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29 | (pad 13 smd rect (at 2.95 -0.325) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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30 | (pad 14 smd rect (at 2.95 -0.975) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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31 | (pad 15 smd rect (at 2.95 -1.625) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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32 | (pad 16 smd rect (at 2.95 -2.275) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask)) |
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33 | (model Housings_SSOP.3dshapes/TSSOP-16_4.4x5mm_Pitch0.65mm.wrl |
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34 | (at (xyz 0 0 0)) |
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35 | (scale (xyz 1 1 1)) |
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36 | (rotate (xyz 0 0 0)) |
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37 | ) |
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38 | ) |
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