library

(module MSOP-8-1EP_3x3mm_Pitch0.65mm placed (layer F.Cu) (tedit 55659CC8)
  (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference U8 (at 0 -2.55) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TPS2001CDGN (at 0 2.55) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.8 -1.8) (end -2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.8 -1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 -1.8) (end 2.8 -1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 1.8) (end 2.8 1.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.625 -1.625) (end -1.625 -1.41) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 -1.625) (end 1.625 -1.41) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 1.625) (end 1.625 1.41) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end -1.625 1.41) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 -1.41) (end -2.55 -1.41) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 2.105 0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.105 0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.105 -0.325) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.105 -0.975) (size 1.55 0.42) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 9 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_SSOP.3dshapes/MSOP-8-1EP_3x3mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)