library

(module QFN-20-1EP_5x5mm_Pitch0.65mm (layer F.Cu) (tedit 55659A59)
  (descr "20-Lead Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.65")
  (attr smd)
  (fp_text reference U4 (at 0 -3.525) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TPS74801RGWR (at 0 3.525) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.8 -2.8) (end -2.8 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.8 -2.8) (end 2.8 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 -2.8) (end 2.8 -2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.8 2.8) (end 2.8 2.8) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.65 -2.65) (end 2.65 -1.725) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.65 2.65) (end -2.65 1.725) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.65 2.65) (end 2.65 1.725) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.65 -2.65) (end -1.725 -2.65) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.65 2.65) (end -1.725 2.65) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.65 2.65) (end 1.725 2.65) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.65 -2.65) (end 1.725 -2.65) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -2.4 -1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.4 -0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.4 0) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.4 0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.4 1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -1.3 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.65 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0.65 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1.3 2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 2.4 1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 2.4 0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 2.4 0) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 2.4 -0.65) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 2.4 -1.3) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 1.3 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 0.65 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 0 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at -0.65 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at -1.3 -2.4 90) (size 1 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 0.8375 0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at 0.8375 -0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.8375 0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.8375 -0.8375) (size 1.675 1.675) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/QFN-20-1EP_5x5mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)