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Rev Age Author Path Log message Diff Changes
3858 3574 d 4 h kaklik /Modules/ARM/ opraveny chyby v navrhu mechanickych redukci. Diff
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.amf
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.gcode
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.scad
/Modules/ARM/ODROID-C1/TODO.txt
/Modules/ARM/ODROID-U3/CAD/Board_support.amf
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/TODO.txt
3857 3574 d 10 h ondra6ak /Modules/CommRF/BLE01A/ Some fixes from TODO.txt done Diff
/Modules/CommRF/BLE01A/PrjInfo.txt
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A-cache.lib
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.cmp
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.kicad_pcb
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.net
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.pro
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.sch
/Modules/CommRF/BLE01A/TODO.txt
3856 3574 d 16 h kaklik /Modules/ARM/ODROID-C1/ zaznam chyb na prvnim vytistenem prototypu. Diff
/Modules/ARM/ODROID-C1/TODO.txt
3854 3575 d 7 h kaklik /Modules/ARM/ mechanicky adapter pro ODROID-C1 do MLABu. Diff
/Modules/ARM/ODROID-C1
/Modules/ARM/ODROID-C1/CAD
/Modules/ARM/ODROID-C1/CAD/C_MAIN_REV0.3_MECH_DWG.DWG
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.amf
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.gcode
/Modules/ARM/ODROID-C1/CAD/ODROID-C1_MLAB_adapter.scad
/Modules/ARM/ODROID-C1/DOC
/Modules/ARM/ODROID-C1/DOC/HTML
/Modules/ARM/ODROID-C1/DOC/SRC
/Modules/ARM/ODROID-C1/PrjInfo.txt
/Modules/ARM/ODROID-C1/SCH_PCB
/Modules/ARM/ODROID-C1/SCH_PCB/odroid-c_rev0.3_201401107.pdf
/Modules/ARM/ODROID-C1/SW
/Modules/ARM/ODROID-C1/pdf
/Modules/ARM/ODROID-U3/CAD/Board_support.amf
3853 3577 d 16 h kaklik /Modules/CommRF/LNA01A/CAM_AMA/ priraveny vzory pro derovaní krabičky pro LNA. Diff
/Modules/CommRF/LNA01A/CAM_AMA/front_panel_multi.pdf
/Modules/CommRF/LNA01A/CAM_AMA/front_panel_multi.svg
/Modules/CommRF/LNA01A/CAM_AMA/hole_pattern.pdf
/Modules/CommRF/LNA01A/CAM_AMA/hole_pattern.svg
/Modules/CommRF/LNA01A/CAM_AMA/front_panel.pdf
/Modules/CommRF/LNA01A/CAM_AMA/front_panel.svg
3852 3579 d 11 h kaklik /Modules/ARM/ODROID-U3/ editace podlozky pro lepsi geometrii a usetreni materialu. Diff
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/TODO.txt
3851 3580 d 8 h kaklik /Modules/ARM/ODROID-U3/ zaznam stavu pred prekreslenim. Diff
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/TODO.txt
3850 3584 d 14 h kaklik /Modules/ARM/ODROID-U3/ zlepšeny tolerance PCB. Diff
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/TODO.txt
3849 3585 d 13 h kaklik /Modules/CommRF/BLE01A/pdf/ pridani datasheetu od obvodu na BLE. Diff
/Modules/CommRF/BLE01A/pdf/nRF8001.pdf
3848 3585 d 13 h kaklik / zapsani chyb v navrhu modulu. Diff
/Library/DirStructure/Module/SCH_PCB
/Modules/CommRF/BLE01A/TODO.txt
/Library/DirStructure/Module/PCB
/Library/DirStructure/Module/SCH
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A-cache.lib
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.sch
3847 3585 d 14 h kaklik /Modules/CommRF/BLE01A/ Pridani komunikacniho modulu pro Bluetooth low energy. Diff
/Modules/CommRF/BLE01A
/Modules/CommRF/BLE01A/CAM_AMA
/Modules/CommRF/BLE01A/CAM_DOC
/Modules/CommRF/BLE01A/CAM_PROFI
/Modules/CommRF/BLE01A/CAM_PROFI/Preview.gvp
/Modules/CommRF/BLE01A/DOC
/Modules/CommRF/BLE01A/DOC/HTML
/Modules/CommRF/BLE01A/DOC/SRC
/Modules/CommRF/BLE01A/PrjInfo.txt
/Modules/CommRF/BLE01A/SCH_PCB
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A-cache.lib
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.cmp
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.kicad_pcb
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.net
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.pro
/Modules/CommRF/BLE01A/SCH_PCB/BLE01A.sch
/Modules/CommRF/BLE01A/SW
/Modules/CommRF/BLE01A/pdf
3846 3590 d 13 h kaklik /Modules/ARM/ODROID-U3/ pridani nahledu ODROIDu do seznamu modulu. Diff
/Modules/ARM/ODROID-U3/ODROIDU3_Top_Small.JPG
/Modules/ARM/ODROID-U3/PrjInfo.txt
3845 3590 d 16 h kaklik /Modules/ARM/ODROID-U3/DOC/SRC/img/ pridani obrazku adapteru. Diff
/Modules/ARM/ODROID-U3/DOC/SRC/img/ODROIDU3_MLAB_ADAPTER.JPG
/Modules/ARM/ODROID-U3/DOC/SRC/img/ODROIDU3_MLAB_adapter_model.png
3844 3593 d 14 h kaklik /Modules/ARM/ODROID-U3/ oprava chyby - misto pro kondenzatory na redukcnim PCB. Diff
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/TODO.txt
3843 3594 d 7 h kaklik /Modules/ARM/ODROID-U3/ prvni verze podlozky s chybami. Diff
/Modules/ARM/ODROID-U3/CAD/Board_support.gcode
/Modules/ARM/ODROID-U3/CAD/Board_support.scad
/Modules/ARM/ODROID-U3/CAD/Board_support.stl
/Modules/ARM/ODROID-U3/TODO.txt
3841 3599 d 9 h kaklik /Modules/ aktualizace dokumentace. Diff
/Modules/CommSerial/I2CHUB01A/PrjInfo.txt
/Modules/CommSerial/I2CSPI01A/PrjInfo.txt
/Modules/H_Bridge/HBSTEP01A/pdf/L6470.pdf
3840 3600 d 13 h kaklik /Modules/CommSerial/I2CIO01A/ zaznam chyb. Diff
/Modules/CommSerial/I2CIO01A/TODO.txt
/Modules/CommSerial/I2CIO01A/PCB_SCH/I2CIO01A-cache.lib
/Modules/CommSerial/I2CIO01A/PCB_SCH/I2CIO01A.bak
/Modules/CommSerial/I2CIO01A/PCB_SCH/I2CIO01A.sch
/Modules/CommSerial/I2CIO01A/PrjInfo.txt
3839 3601 d 11 h kaklik /Modules/CommSerial/USBI2C01A/ uklid dokumentace. Diff
/Modules/CommSerial/USBI2C01A/SCH_PCB
/Modules/CommSerial/USBI2C01A/SCH&PCB
/Modules/CommSerial/USBI2C01A/pdf/CY7C65211_001-82042.pdf
/Modules/CommSerial/USBI2C01A/pdf/CY7C65215_001-81006.pdf
/Modules/CommSerial/USBI2C01A/pdf/DS_FT200XD.pdf
/Modules/CommSerial/USBI2C01A/pdf/DS_FT201X.pdf
/Modules/CommSerial/USBI2C01A/pdf/DS_FT2232D.pdf
/Modules/CommSerial/USBI2C01A/pdf/SC18IM700.pdf
3838 3603 d 7 h kakl /Modules/CommSerial/I2CHUB02B/ Added todo. Diff
/Modules/CommSerial/I2CHUB02B/TODO.txt
3837 3603 d 7 h kaklik /Modules/CommSerial/I2CHUB02B/ zapis chyb na modulu. Diff
/Modules/CommSerial/I2CHUB02B/TODO.txt